Our advisory boards includes leading experts from across the semiconductor and MEMS sectors including 5G, IoT, Advanced Packaging, AI, Automotive Electronics, and Power Semiconductors.
Dr. Xiaoning Qi
VP
Biography
Xiaoning Qi is the Vice President of Alibaba Group. Previously, he held senior management and technical positions in companies such as Intel, designing integrated circuits and systems. He sits on the board of directors at several international organizations including RISC-V International Association, CHIPS Alliance, OpenHW, EEMBC, etc. He is a member of Global Semiconductor Alliance (GSA) Advisory Board, a member of GSA Asia-Pacific Leadership Council and GSA CEO Council. He has published more than fifty technical papers, a book, and has delivered over three dozen invited talks. He holds two US patents. Xiaoning received his Ph.D. degree in Electrical Engineering from Stanford University.
Company Profile
Alibaba Group’s mission is to make it easy to do business anywhere. The company aims to build the future infrastructure of commerce. It envisions its customers will meet, work and live at Alibaba and that it will be a good company lasting for 102 years. We pledged to reach carbon neutrality by 2030. By working with merchants and consumers, the company expects to slash carbon emissions by 1.5 gigatons across its digital ecosystem by 2035.
Dr. Hongchao Liu
SVP/Chief Scientist
Biography
Dr. Liu has more than 20 years’ semiconductor industry and more than 10 years’ experience with rich experience and unique understanding of technology industrialization and internationalization. His academic in materials science includes Shanghai Institute of Ceramics, Chinese Academy of Sciences, Muenster University in Germany, Nagoya Institute of Technology in Japan. He industry career covered China Resources Microelectronics, ASMC (Now GtaSemi). Dr. Liu received his BS degree in physical chemistry from Sichuan University, PhD in Materials Science from Shanghai Institute of Ceramics, Chinese Academy of Sciences. He held a Postdoc position in Nagoya Institute of Technology, and received a Young Scientist Award by Asian Crystallography Association. He was awarded an Alexander von Humboldt Research Fellowship in 2000. S. He has authored more than 30 papers, and holds over 40 patents. His research covers semiconductor materials, devices and processing.
Company Profile
YASC dedicates to the design, process, and fabrication of devices of SiC and GaN. Currently, we are one of the leading 6-inch fab in mass production with advanced supporting systems, provides turn-key services from chip design, epitaxial processing, wafer manufacturing, probing, assembly, module packaging, reliability and final test.
Dr. Xiaoxin Qiu
CEO
Biography
Xiaoxin Qiu received her BE and ME degrees from Tsinghua University, P. R. China, in 1990 and 1991, respectively; and her Ph.D. from University of Southern California, Los Angeles, in 1996, all in Electrical Engineering.
From 1996 to 2001, she was with the Broadband Wireless Systems Research Department of AT&T Laboratories in Middletown, NJ, USA. In January 2001, she joined Mobilink Telecom Inc, which became a part of Broadcom Corporation in 2002. During her tenure in Broadcom, she served as the Vice President of Systems Design Engineering, and was responsible for cellular modem development and productization as well as developing next generation cellular IoT/M2M/NB-IoT devices and platforms.
In 2016, she joined WNC, a Taiwanese ODM company, serving as the CTO of Software and Vice President of Technical Marketing. In this capacity, Xiaoxin was in charge of creating the 5G product line from scratch and was responsible for the successful product design-ins in Verizon and a handful of European operators.
In 2018, Xiaoxin joined UniSoC Corp in China as Chief Technology Officer, responsible for defining the company technology and product roadmaps, and leading the R&D effort.
In 2019, she started and served as CEO of Axera Technology Co. Ltd., a start-up company focusing on creating AI enabled, high performance vision processing chips for a variety of public safety, smart city, smart home, smart industrial applications.
Xiaoxin is a senior member of the IEEE, and was elected Broadcom Distinguished Engineer in 2008 due to her outstanding contributions in cellular technology development in Broadcom.
Company Profile
Axera is a high-tech semiconductor company focused on developing world class Artificial Intelligence (AI) SoCs, for high-performance low-power computer vision applications. These chips are particularly suitable for today’s AIoT products, extending the AI intelligence from the cloud to the edge as well as end devices. They can be used in a vast array of applications such as smart cities, smart transportation, smart manufacturing and smart homes, with the goal to convenience people’s life and make our society a better and safer place.
AX630A：A high-performance low-power Computer Vision AI SoC
axerapr@axera-tech.com
https://www.axera-tech.com/
Add: 4th Floor, Raycom Info Tech Tower A, No. 2 Kexueyuan South Road, Haidian District, Beijing, 100190 PRC
General phone number and fax 010-82622584
Dr. Yongxiang Wen
Process Technology Director
Biography
Process Technology Director of Hangzhou Silan Microelectronics Co., LTD., responsible for the manufacturing and development of IC products, With 35 years of experience in integrated circuit manufacturing, responsible for the development of SL’s BICMOS\BCD products and processes, VDMOS, IGBT 、SIC products and processes. There are 6 patents （No.1 writer）authorized in the United States and 70 patents authorized in China.
Company Profile
Since 1997
As a high-tech enterprise specializing in the design of IC chip and the manufacturing of semiconductor microelectronics-related products, Hangzhou Silan Microelectronics Co., Ltd. (600460) is located in Hangzhou High-tech Industrial Development Zone. The company was founded in September 1997 and was headquartered in Hangzhou, China. In March 2003, our stock was listed on the Shanghai Stock Exchange and the company is the first IC chip design enterprise listed in China. Thanks to the rapid development of China’s electronic information industry, Silan has become one of the largest IC design and manufacturing enterprises in China, and many indicators such as technical level, business scale, profitability etc. are among the best in the domestic counterparts.
The IC chip production line belonging to Silan built in the Qiantang New District of Hangzhou currently has an actual monthly output of 220,000 pieces, ranking second in the world in production capacity for chips of 6 inches or less. Meanwhile, with the production line for 8-inch chips being constructed in 2015 and going into operation in 2017, the company has become the first domestic company possessing IDM products and production line for 8-inch chips. In 2018, a special process wafer production line for 12-inch chips and an advanced compound semiconductor device production line were constructed in Xiamen. By the end of 2022, the monthly production capacity of the company’s 12-inch chips line has reached 60,000 pieces, and the monthly production capacity of the compound semiconductor device production line has reached 140,000 pieces.
Our technologies and products cover many fields of consumer products, and maintain a leading position in many technical fields, such as green power supply chip technology, MEMS sensor technology, LED lighting and screen display technology, high-voltage smart power module technology, the third-generation power semiconductor device technology, digital audio and video technology etc. Moreover, with rich experience in multiple fields of chip design, we can provide customers with solutions on targeted chip product series and systemic applications.
Our product and R&D investment is mainly focused on the following three fields:
ICs, Power Module(IPM/ PIM), Discrete Devices and kinds of MCU/ IC power semiconductor solutions based on Silan’s own special process of high voltage, high power and high frequency.MEMS sensors & Digital audio SoC and speech recognition.Optoelectronic products, LED chip Manufacturing and packaging (for indoor and outdoor LED display panel as well as LED illumination applications).
Our technologies and products cover many fields of consumer products, and maintain a leading position in many technical fields, such as green power supply chip technology, MEMS sensor technology, LED lighting and screen display technology, high-voltage smart power module technology, the third-generation power semiconductor device technology, digital audio and video technology etc. Moreover, with rich experience in multiple fields of chip design, we can provide customers with solutions on targeted chip product series and systemic applications.
Our product and R&D investment is mainly focused on the following three fields:
Shaojun Wei
Professor
Biography
魏少军，应用科学博士，清华大学教授，国际电气和电子工程师协会会士（IEEE Fellow），中国电子学会会士（CIE Fellow），亚太人工智能学会会士（AAIA Fellow），国际欧亚科学院院士，俄罗斯工程院外籍院士；国家集成电路产业发展咨询委员会委员；中国半导体行业协会副理事长，世界半导体理事会中国 JSTC 主席，长期致力于超大规模集成电路设计方法学研究、可重构计算架构研究和通信专用集成电路技术研究，主要研究领域为：超大规模集成电路设计方法学研究，高层次综合技术研究，嵌入式系统设计技术研究和可重构计算技术研究。发表学术论文近300 篇，出版专著 10 册，曾获国家技术发明二等奖、国家科技进步二等奖及多项省部级科学技术奖等。
Wei Shaojun, Doctor in Applied Science, Professor of Tsinghua University, IEEE fellow, CIE Fellow, AAIA Fellow, academician of the International Eurasian Academy of Sciences, Foreign Academician of the Russian Academy of Engineering, Member of the National Integrated Circuit Industry Development Advisory Committee, Vice Chairman of China Semiconductor Industry Association and Chairman of World Semiconductor Council China JSTC, has long been committed to the research on VLSI design methodology, reconfigurable computing architecture and Communication ASIC technology. His main research fields are: Research on IC design methodology and high-level synthesis technology, embedded system design technology and reconfigurable computing technology. He has published nearly 300 academic papers and 10 monographs, has won the second prize of national technological invention, the second prize of national scientific and technological progress and a number of provincial and ministerial science and technology awards.
Company Profile
The campus of Tsinghua University is situated in northwest Beijing on the site of the former imperial gardens of the Qing Dynasty, and surrounded by a number of historical sites.
Tsinghua University was established in 1911, originally under the name “Tsinghua Xuetang”. The school was renamed “Tsinghua School” in 1912. The university section was founded in 1925. The name “National Tsinghua University” was adopted in 1928.
The faculty greatly valued the interaction between Chinese and Western cultures, the sciences and humanities, the ancient and modern. Tsinghua scholars Wang Guowei, Liang Qichao, Chen Yinque and Zhao Yuanren, renowned as the “Four Tutors” in the Institute of Chinese Classics, advocated this belief and had a profound impact on Tsinghua’s later development.
Tsinghua University was forced to move to Kunming and join with Peking University and Nankai University to form the Southwest Associated University due to the Resistance War against the Japanese Invasion in 1937. In 1946 The University was moved back to its original location in Beijing after the war.
After the founding of the People’s Republic of China, the University was molded into a polytechnic institute focusing on engineering in the nationwide restructuring of universities and colleges undertaken in 1952. In November 1952, Mr. Jiang Nanxiang became the President of the University. He made significant contributions in leading Tsinghua to become the national center for training engineers and scientists with both professional proficiency and personal integrity.
Since China opened up to the world in 1978, Tsinghua University has developed at a breathtaking pace into a comprehensive research university. At present, the university has 20 schools and 59 departments with faculties in science, engineering, humanities, law, medicine, history, philosophy, economics, management, education and art.
With the motto of “Self-Discipline and Social Commitment” and the spirit of “Actions Speak Louder than Words”, Tsinghua University is dedicated to the well-being of Chinese society and to world development. As one of China’s most prestigious and influential universities, Tsinghua is committed to cultivating global citizens who will thrive in today’s world and become tomorrow’s leaders. Through the pursuit of education and research at the highest level of excellence, Tsinghua is developing innovative solutions that will help solve pressing problems in China and the world.
Joseph Chou
General Manager
Biography
Company Profile
POMME was established in 2015 and is located in Hsinchu, Taiwan. It is engaged in high-end wafer test integration and design services for the semiconductor industry, focusing on providing you with the most efficient wafer parameter test solutions. Such as IC Design house, foundry, IDM, testing company, assembly and packaging company, etc., to simplify work for engineers in different departments (such as: technology research and development, quality and reliability assurance, failure analysis, manufacturing, etc.). POMME can help turn all the measurement and analysis under numerous test results into a simple job, speeding up product throughput throughout semiconductor production.
POMME is the solution partner of Keysight Technologies, a world-renowned instrument manufacturer. With more than 16 years of long-term cooperation experience, POMME has developed into the only and most reliable partner of customers among semiconductor industry test integration system providers, with the most professional The technical team, adhering to the spirit of quality first and customer satisfaction, grows together with customers and employees.
Since its establishment, it has served the semiconductor industry chain in the Asia-Pacific region, with more than 300 customers. We use experienced teamwork to run your test work quickly and efficiently. We can provide test solutions that meet your unique needs every time.
POMME possesses the leading wide-bandgap semiconductor automotive electronic components and module test solution technology, and has officially become the exclusive distributor of ipTEST LTD. in the UK. It can provide a full range of measurement solutions more efficiently to meet your needs.
main products:
Power semiconductor wafers, chips, components, and power module testing solutions.
Electrical test probe station (manual/semi-automatic/automatic), all electrical test probe station standard/custom configuration.
Electrical test system upgrade/maintenance/calibration/expansion (HP/Agilent/HP/Keysight/Keithley).
OST (Entrusted Measurement)/WBG/Low Current/Reliability/Burn-In.
Dr. Tim Yeh
Technical Director
Biography
Tim Yeh holds a Ph.D. in Electrical Engineering from National Central University in Taiwan and serves as a member of the Executive Advisory Committee of the International Semiconductor Executive Summit (ISES China). He has long been engaged in the research and industrialization of compound semiconductor materials and devices, with 25 years of industrial R&D experience, particularly in the field of third-generation semiconductor materials and devices. He is well-versed in the design and industrial manufacturing of compound semiconductor devices.
Dr. Ye has previously worked as a researcher at the Telecommunication Laboratories of Chunghwa Telecom in Taiwan and served as a technical director for a publicly listed company in Taiwan. His research achievements have led to the granting of more than 30 patents across the United States, Japan, Mainland China, and Taiwan, and he has published over 70 papers in international journals. He has led or participated in several major projects under China’s Ministry of Science and Technology and key national R&D programs.
He currently serves as the Technical Director at Hunan Sanan Semiconductor, where he is responsible for the R&D and mass production integration of compound semiconductor power electronic devices. He has successfully established a full industrial chain production line for third-generation semiconductor power electronic devices, covering the entire process from epitaxy to device fabrication.
叶念慈，台湾中央大学电机工程博士，国际半导体高管峰会 (ISES China）执行顾问委员会成员，长期从事化合物半导体材料和器件研究及产业化，特别是在 第三代半导体材料和器件 领域拥有 25 年的产业研发经验，精通化合物半导体器件设计和产业化制造。曾先后任台湾中华电信公司电信研究所研究员及台湾上市公司技术负责人。研究成果获美国、日本、中国大陆和台湾地区专利授权30 余件，发表国际期刊论文 70 余篇，曾作为项目或课题负责人参与数项国家科技部重大专项和国家重点研发计划项目。现担任湖南三安半导体技术总监，负责 化合物半导体功率电子器件研发与量产导入，成功打造从外延到器件全产业链 第三代半导体功率电子器件产线。
Company Profile
Sanan Semiconductor is a wholly-owned subsidiary of the listed company Sanan Optoelectronics. Sanan is committed to becoming a world-class R & D, manufacturing and service platform for wide bandgap semiconductors. Sanan Semiconductor extended Sanan Optoelectronics’ 20-year compound semiconductor industrialization experience to the field of power electronics, and became a full-chain integration platform focusing on the wide bandgap semiconductor industry and providing the most comprehensive products and services.
Sanan Semiconductor’s silicon carbide (SiC) power products include automotive and industrial SiC Schottky barrier diodes (SBD) and SiC MOSFETs which provide key components with higher power density and higher energy conversion efficiency for the electric vehicles and renewable energy markets. These can then be applied to high-reliability applications such as electric vehicle drivetrains, charging stations, and solar photovoltaic inverters. Sanan Semiconductor is a member of the JEDEC JC-70 Wide Band Gap Semiconductor Standards Committee, which collaborated with the industry to provide process technologies and products with improved reliability and quality. The company also has a portfolio of AEC-Q101 certified products.
Dr. Yemin Dong
General Manager
Biography
董业民，2004 年毕业于中国科学院上海微系统与信息技术研究 所，获工学博士学位，先后在宏力半导体(华虹宏力)和新加坡 特许半导体(GlobalFoundries)从事研发工作，具有丰富的集 成电路研发和产品量产经验。2016 年 3 月加入中国科学院上海 微系统所，曾先后担任高可靠器件协同创新设计中心主任、硅基 材料与集成器件实验室主任、信息功能材料国家重点实验室(集 成电路材料全国重点实验室)副主任等职务，2021 年 1 月-2023 年 6 月在广东省工业和信息化厅挂职，担任总工程师。承担多项 国家和省部级重大科研项目，从事极端微电子和高性能模拟等 芯片研发和产业化工作，发表学术论文 60 余篇，申请发明专利 80 余项，培养硕士和博士研究生近 20 名。
Dong Yemin graduated from the Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences in 2004, obtaining a doctoral degree in engineering. He has worked in research and development at Huali Semiconductor (Hua Hong Semiconductor) and GlobalFoundries in Singapore, with rich experience in integrated circuit research and product manufacturing. In March 2016, he joined the Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, successively serving as the director of the High-Reliability Device Collaborative Innovation Design Center, director of the Silicon-Based Materials and Integrated Devices Laboratory, and deputy director of the State Key Laboratory of Functional Materials for Information. From January 2021 to June 2023, he served as the chief engineer of the Department of Industry and Information Technology of Guangdong Province. He has undertaken several national and provincial major scientific research projects, engaging in the development and industrialization of chips such as extreme microelectronics and high-performance analog. He has published over 60 academic papers, applied for more than 80 invention patents, and supervised nearly 20 master’s and doctoral students.”
董业民，2004 年毕业于中国科学院上海微系统与信息技术研究 所，获工学博士学位，先后在宏力半导体(华虹宏力)和新加坡 特许半导体(GlobalFoundries)从事研发工作，具有丰富的集 成电路研发和产品量产经验。2016 年 3 月加入中国科学院上海 微系统所，曾先后担任高可靠器件协同创新设计中心主任、硅基 材料与集成器件实验室主任、信息功能材料国家重点实验室(集 成电路材料全国重点实验室)副主任等职务，2021 年 1 月-2023 年 6 月在广东省工业和信息化厅挂职，担任总工程师。承担多项 国家和省部级重大科研项目，从事极端微电子和高性能模拟等 芯片研发和产业化工作，发表学术论文 60 余篇，申请发明专利 80 余项，培养硕士和博士研究生近 20 名。
Dong Yemin graduated from the Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences in 2004, obtaining a doctoral degree in engineering. He has worked in research and development at Huali Semiconductor (Hua Hong Semiconductor) and GlobalFoundries in Singapore, with rich experience in integrated circuit research and product manufacturing. In March 2016, he joined the Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, successively serving as the director of the High-Reliability Device Collaborative Innovation Design Center, director of the Silicon-Based Materials and Integrated Devices Laboratory, and deputy director of the State Key Laboratory of Functional Materials for Information. From January 2021 to June 2023, he served as the chief engineer of the Department of Industry and Information Technology of Guangdong Province. He has undertaken several national and provincial major scientific research projects, engaging in the development and industrialization of chips such as extreme microelectronics and high-performance analog. He has published over 60 academic papers, applied for more than 80 invention patents, and supervised nearly 20 master’s and doctoral students.”
Company Profile
Shanghai Micro-Technology Industrial Research Institute (SITRI) was established in 2013 by Shanghai Science and Technology Commission, Jiading District Government and Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences. It is a R&D and transformation functional platform integrating R&D, engineering, industrialization and cultivation, providing in-depth process technology support and services for innovative enterprises and partners. SITRI was established under the guidance of Shanghai Lianhe Investment Co., Ltd.’s strategic mission of serving the national strategy and being a pioneer in scientific and technological development. It relies on the “three-in-one” innovation architecture model of Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences. With the support of the technical strength of Shanghai Institute of Microsystem and the investment and operation model of Shanghai Xinwei Technology Group, it has established close cooperative relations with many domestic and foreign production, learning and research organizations, realized the efficient industrialization of innovative achievements, and accelerated the establishment of the “More than Moore” industrial ecosystem.
· SITRI has the first 8-inch “More than Moore” R&D pilot line in China, providing “More than Moore” core process technologies such as MEMS, silicon photonics, and biochips, and providing efficient R&D, pilot and verification services for semiconductor companies such as design, equipment and materials, realizing seamless connection from R&D to small batch production.
· Up to now, SITRI has applied for 877 patents, 697 invention patents, including 56 PCT (international patent) patents. · SITRI is based in Shanghai, facing the Yangtze River Delta, and radiating across the country, and has initially formed an industrial ecosystem in the field of “More Than Moore”.
Dariusz Czaja
Managing Director of TRUMPF Huettinger Asia
Biography
Dariusz Czaja先生于2007年加入通快霍廷格电子，目前担任通快霍廷格电子亚洲董事总经理，主要负责中国，日本，韩国以及东南亚市场的业务营运以及拓展。在光伏、半导体、显示面板、玻璃镀膜等多个领域，Dariusz Czaja先生拥有十余年的业务营运和管理经验，其中包括光伏应用项目的重点推广。在通快霍廷格电子任职期间，Dariusz Czaja先生曾先后在波兰和德国工作，并于2017年开始担任通快霍廷格电子中国总经理一职。2023年，因应业务成长需要，荣任亚洲董事总经理
Dariusz Czaja先生拥有波兰卡齐米耶日-普瓦斯基拉多姆技术与人文大学的电子工程学位，他也是世界太阳能大会（World Solar Congress）咨询委员会的成员，同时也是中国国际半导体高层峰会（I.S.E.S.）的执行委员会成员。
Dariusz Czaja joined TRUMPF HUETTINGER Electronics in 2007 and is currently the Managing Director of TRUMPF HUETTINGER Electronics Asia, where he is responsible for business operations and expansion in China, Japan, Korea and Southeast Asia. Mr. Dariusz Czaja has more than 10 years of business operation and management experience in photovoltaics, semiconductors, display panels, glass coatings and other fields, including the key promotion of photovoltaic application projects. During his tenure at TRUMPF Huettinger Electronics, Mr. Czaja worked in Poland and Germany, and in 2017 he became General Manager of TRUMPF Huettinger Electronics China. In 2023, he was appointed Managing Director of Asia in response to business growth needs.
Mr. Czaja holds a degree in Electronic Engineering from the University of Technology and Humanities in Kazimierz-Pułaskiradom, Poland, and is a member of the Advisory Board of the World Solar Congress and a member of the China International Semiconductor Executive Summit (I. S.E.S.).
Company Profile
通快霍廷格电子有限公司成立于1922年，总部设于德国弗莱堡，是世界领先的等离子体电源制造商，产品主要用于：半导体，显示器和太阳能领域，以及光学镀膜，装饰镀膜，工业镀膜，大面积玻璃镀膜等行业的等离子体应用，于1990年正式加入通快集团。通快霍廷格电子致力于开发、制造用于各种沉积和干法刻蚀工艺的等离子电源，在电源领域拥有一百多年的经验积累，在欧洲、美洲和亚洲分别设有销售和服务子公司和分支机构。
2006年，通快霍廷格电子中国成立，至今已经深耕中国市场19年。如今，通快霍廷格在中国设有亚太区应用中心、维修中心、电源及匹配器生产中心，为客户提供所有生产过程中的优质服务。2023年，通快霍廷格中国新工厂在太仓建成开业，这是通快霍廷格继德国、波兰之后布局的全球第三家生产制造基地。
TRUMPF Huettinger is a high-tech company and a leading global manufacturer of DC, medium-frequency, high-frequency and semiconductor-based solid-state microwave generators.
The business units include plasma technology, industrial heating, battery inverter systems as well as microwave generators and amplifiers. These process power supplies are being used in many key processes in research, development and production. As a part of TRUMPF – technology leader of industrial lasers and machine tools – TRUMPF Electronics is headquartered in Freiburg/Germany and has sales and service branches in Europe, US and Asia providing a global IoT based service support.
Product introduction:
1. TruPlasma DC 4000 (G2) Series
TruPlasma DC 4000 (G2) 系列专为金属，金属氧化物，绝缘材料的反应直流溅射而开发。电源以直流脉冲的形式输出，在高要求的膜层质量和大产能的PVD 和PECVD 工艺中证明了它的优势。
The TruPlasma DC Series 4000 (G2) combines the excellent arc handling of TRUMPF Hüttinger with the advantages of DC pulse technology. This means you gain improved coating results with fewer defects, along with a higher deposition rate. The results are brilliant surfaces and a high level of production power.
2. TruPlasma DC 3000 (G2) Series
TruPlasma DC 3000 (G2) 系列适合众多直流溅射工艺，得益于先进的电弧管理和集成水冷装置，该款直流电源同样可用作脉冲式直流电源的高性价比替代方案。此外，极其紧凑的结构使其方便集成至现有应用中。
The TruPlasma DC Series 3000 (G2) is suited to numerous DC sputtering processes. The DC generators also make an interesting cost-effective alternative to pulsed DC generators due to their progressive arc management and the integrated water cooling. The very compact design also enables simple integration into existing applications.
3. TruPlasma RF 1000/3000 (G2/13) Series
全新一代的射频电源TruPlasma RF 1000 / 3000 (G2/13.56M) 系列，对工艺过程中的所有参数进行实时监测，即使在要求严苛的等离子体工艺中，仍能确保可靠供电。其稳定的输出功率和高精度控制确保高效高生产效率的同时，实现最佳工艺效果。
The TruPlasma RF Series 1000 / 3000 (G2/13) are the latest generation of RF generators. Due to innovative functions such as the patented CombineLine coupling technology or real-time measurement of all process parameters, reliable power supply even in demanding plasma processes is guaranteed – the optimal conditions for reproducible results and high productivity.
4. TruPlasma LF Series
TruPlasma LF 1000 系列电源基于创新的平台概念, 频率范围有350k，400k，2M，功率范围1~10kw，适用于各类半导体，光伏，ALD，刻蚀等离子应用。
TruPlasma LF 1000 series are based on an innovative platform concept with frequency ranges of 350k, 400k, 2M and power ranges from 1 to 10kw for all types of semiconductors, photovoltaic, ALD, and etch plasma applications.
5. TruPlasma VHF 3000 series
TruPlasma VHF 3000 系列电源基于创新的平台概念, 频率覆盖27M；40M；60M。功率范围1~10kw。可满足极为苛刻的生产要求。VHF 电源的纯水冷模块化结构与极高的功率密度设计可以确保大功率输出下的稳定性。
TruPlasma VHF 3000 series power supply is based on an innovative platform concept covering frequencies of 27M, 40M, 60M, and power ranges of 1~10kw to meet the most demanding production requirements. the VHF power supply’s pure water-cooled modular construction and extremely high power density design ensure stability at high power outputs.
Dr. Tong Wu
Leader of China Automotive Solution Team
Biography
Dr. Tong Wu is leading the onsemi Automotive Application and Marketing team in China. He graduated from Shanghai Jiao Tong University with a bachelor in Semiconductor Physics, minoring in Mathematics, and holds a Ph.D. in Electrical Engineering from the University of Tennessee, USA. Dr. Wu has over 10 years of R&D and industrial experience in semiconductor packaging and the design and application of silicon carbide.
He is now responsible for automotive technology engagement in China, covering from product definition, manufacturing, marketing, to system applications. He maintains in-depth cooperation with multiple automotive OEMs and Tier 1 suppliers.
Dr. Wu previously worked at the Oak Ridge National Laboratory (ORNL) in Oak Ridge, Tennessee, USA, and also with solid industrial R&D backgrounds. He has published more than 40 papers in international conferences and journals and has also been granted multiple US patents in the field of semiconductors.
Company Profile
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Dr. Alan Zhou
CEO
Biography
Dr. Alan Zhou has over 30 years of executive experience in multinational and startup companies within the semiconductor industry. Currently serving as the CEO of Shanghai Pixelworks Stock Limited Co. Formerly he was the CEO of BelGaN and Chairman of GaNcool. Before that, he was an Executive Vice President (EVP) of Pixelworks and the President of its China subsidiary, he was responsible for corporate restructuring, financing, acquisitions, and preparations for a STAR Market listing; He also served as the managing partner and Chief Strategy Officer (CTO) at the National IC Fund’s Fujian Anxin Capital, overseeing global investments and acquisitions for the third generation compound semiconductors; a Corporate Vice President at Qualcomm in charge of the smartphone chipset business worth over $3 billion; and a Managing Director at Lucent Technologies, where he led the development and design of China’s first local brand GSM mobile phone reference design and chipset. In 1998, he co-founded MEMSIC, a MEMS sensor company listed in NASDAQ around 2007; and in 1994, served as the General Manager of AT&T Bell Laboratories in Wuxi, managing the technology transfer and construction of China’s first sub-micron very large scale integrated circuit (VLSI) manufacturing Fab for the national 908 Project, which led to the establishment of CSMC went public in HongKong, then acquired by China Resources Group, now known as China Resources Microelectronics listed in the STAR exchange. Dr.Zhou graduated from MIT and earned a Master and Doctor degree in Microelectronics and Computer Science.
Company Profile
Pixelworks’ technology and solutions cover end to end, optimized video delivery that is true to its creator’s intent with a highly authentic viewing experience. Our innovations over two decades has resulted in a strong IP portfolio related to the visual display of digital image data. Our vision is that every screen, no matter how big or small, deserves the highest picture quality. This vision has driven us to develop technology that spans the range from digital projection systems and large flat panel displays to small, low power mobile devices such as smartphones. We also develop innovative methods to apply our core technologies to reduce overall system power and help reduce the bandwidth burden that comes with the display of HD and UHD video.
The relentless advancement of display technology and explosive growth of video consumption driven by digital delivery systems and mobile applications are increasing the necessity and demand for Video Display Processing technology. To meet this growing demand, we deliver our technology as IP cores, semiconductors, software and custom ASIC solutions. This flexible approach allows our customers to deliver the highest video quality in a multitude of applications and form factors while also providing the ability for end product differentiation. Our primary target markets include smartphones, tablets and digital projection systems.
We focus our investments on developing video enhancement solutions for Video Delivery, Mobile Devices and Projectors market segments, with particular attention to increasing performance, video quality, device functionality and saving power. Additionally, we look for ways to leverage our research and development investment into products that address other high-value markets where our innovative proprietary technology provides differentiation for us and our customers. We continually seek to expand our technology portfolio through internal development, co-development with business partners.
Dr. Leon(Yenan) Wu
Founding Partner & CEO
Biography
- Master’s degree from Xi’an Jiaotong University
- PhD from the School of Integrated Circuits, Tsinghua University
- With a background in Electronic Engineering, he has served as a member of the investment committee for integrated circuit and related industry funds under well-known large central enterprises such as Yizhuang Holding Co., Ltd., achieving remarkable investment performance
Company Profile
Xi’an Longding Investment Management Co., Ltd. (referred to as “Longding”) was established in 2014. It is a high-end investment management company focused on the needs of national development, with “finance” and “industry” as the core drivers, focusing on hard technology tracks such as semiconductors, new energy, and information technology.
西安龙鼎投资管理有限公司（简称“龙鼎投资”）成立于2014年，是一家以国家发展需求为核心导向，以“金融”+“产业”为核心引擎，专注半导 体、新能源、信息技术等硬科技赛道的精品投资管理公司。
Wilson Hong
CTO & Partner
Biography
Wilson Hong, Chair of ISIG China, Partner and CTO of Wuxi Leapers Semiconductor. He has 20 years R&D experience on power electronic engineering, software engineering, electric drive system and high voltage architecture in EV.
He used to be senior director in NIO, built the power electronic and software team from 1 person in 2015 to ~200 people in 2023. He led the team to deliver over 1.6 million inverters with several classes and different semiconductors, incl. first highest NEDC efficiency SiC Inverter, first 3-in-1 240kW IM system, first 3-in-1 160kW PM system and 4-in-1 HV ECU.
He hold over 50 power electronic, software, electric drive system patents cross China, US and EU. He won the first Prize and second Prize of Science and Technology Progress of China Association of Automobile Manufacturers in 2021 and 2024.
He is now working on power module advanced packaging, super charging and AI power.
Company Profile
Wuxi Leapers Semiconductor Co., Ltd. brings together experienced professionals at home and abroad, including wafer process and device design, module packaging design, product application, marketing and product operation. Major products include high-reliability SiC and IGBT modules for new energy vehicles and industrial applications. Products are used in new energy vehicles, smart grids, renewable energy, industrial motor drives, medical equipment, power supplies and other scenarios and fields; the company is headquartered in Wuxi, China, and has a research and development center in Japan.We adopts innovative packaging materials and processing technology to provide complete module application solutions for the miniaturization, efficiency and light weight of electric drive systems and inverters for new energy vehicles. Meet the needs of high-performance, high-reliability new energy vehicles and high-end industrial power semiconductor modules.
Dr. Weiping (Bill) Li
Former CEO and Founder of Yibu Semiconductor
Biography
Weiping Li is a seasoned executive in the semiconductor and IT industry with vast experience both in the US and China. He founded Yibu Semiconductor in 2020 that pioneered Si bridge chiplet packaging in China. Prior to that, he served as the Senior Vice President with Unigroup and was the Chairman of the Board of its subsidiary, Unimos. He was Vice President of Jiangsu Changjiang Electronics Technolgy (JCET) for 8 years before Unigroup. He also worked in the US at Amkor, Motorola SPS and Delphi Delco in R&D and product management roles.
Weiping Li held a Ph.D. degree from Georgia Institute of Technology in Materials Science and Engineering. He received the “Extinguished Alumni in Engineering Award” from the same school in 2012. He has over one hundred of patents and numerous technical and industrial publications/talks in electronics packaging.
Company Profile
Established in 2010, the International SemiconductorIndustry (I.S.I.G.) is a prestigious & trusted associationwithin the semiconductor industry, renowned fororchestrating major regional summits across the globe,ranging from the U.S, the Middle East & Asia via ourdivision, the International Semiconductor ExecutiveSummits (I.S.E.S.). Our summits are fully endorsed bylocal governments and leading companies in all areas ofthe semiconductor supply chain.
Moreover, I.S.E.S. serves as the Premier platform for senior executives in technology, manufacturing, and R&D from diverse semiconductor companies, technology providers, and affiliated industries.
Our events are instrumental helping to shed light onto key industry trends, drive innovation and influence key decisions to help shape, and advance the growth of the semiconductor sector.
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