08:30 – 09:00
Keynote
Advancing The Memory Solutions Roadmap To Enrich Our Multi-Dimensional World For Generations To Come
A memory and storage hierarchy evolution is unfolding before us. Homogenous data centers that met our needs in the past, will not meet our future needs.
We must look to heterogenous solutions that require an expansion of the current memory hierarchy, and ultimately, a convergence of memory and storage.
Conventional scaling must continue, while disruptive 3D, and other advanced solutions will emerge to move us into the next few decades of memory advancement.
Advanced Packaging solutions will play a critical role in this expanded hierarchy, but to achieve this monumental shift, the collaboration, knowledge-sharing, and
innovation our industry has relied on to extend Moore’s Law over the past decade must now push the boundaries, to move the packaging supply chain to a front-end like model.
At the same time, we must keep focus on more sustainable and cost-effective solutions while building a strong talent-based workforce to support long-term growth.
We face many near-term challenges to enable this new ecosystem, but if successful, our industry will emerge with a longer-term roadmap that impacts and enriches lives for generations to come.
Dr. Naga Chandrasekaran
Intel Foundry
Naga Chandrasekaran is responsible for Intel Foundry’s technology development, worldwide manufacturing, customer service and ecosystem operations, including research, development, and deployment of next-generation silicon logic, packaging and test technologies, as well as front-end and back-end manufacturing, foundry services, strategic planning, corporate quality and reliability and supply chain.
Chandrasekaran earned a bachelor’s degree in mechanical engineering from the University of Madras; a master’s degree and doctorate in mechanical engineering from Oklahoma State University; a master’s degree in information and data science from the University of California, Berkeley; and dual executive MBAs from the University of California, Los Angeles, and the National University of Singapore.
Company Profile
Intel’s systems foundry approach offers full-stack optimization from the factory network to software. Intel and its ecosystem empower customers to innovate across the entire system through continuous technology improvements, reference designs and new standards. Intel Foundry is an independent foundry business that meets our customers’ unique product needs, including our industry-leading sort and test capabilities. Whether front-end or back-end design is needed, when integrated with our foundry co-optimized development kits based on industry-standard tools and flows and powerful silicon IPs, the result is true innovation.
Naga Chandrasekaran is responsible for Intel Foundry’s technology development, worldwide manufacturing, customer service and ecosystem operations, including research, development, and deployment of next-generation silicon logic, packaging and test technologies, as well as front-end and back-end manufacturing, foundry services, strategic planning, corporate quality and reliability and supply chain.
Chandrasekaran earned a bachelor’s degree in mechanical engineering from the University of Madras; a master’s degree and doctorate in mechanical engineering from Oklahoma State University; a master’s degree in information and data science from the University of California, Berkeley; and dual executive MBAs from the University of California, Los Angeles, and the National University of Singapore.
Company Profile
Intel’s systems foundry approach offers full-stack optimization from the factory network to software. Intel and its ecosystem empower customers to innovate across the entire system through continuous technology improvements, reference designs and new standards. Intel Foundry is an independent foundry business that meets our customers’ unique product needs, including our industry-leading sort and test capabilities. Whether front-end or back-end design is needed, when integrated with our foundry co-optimized development kits based on industry-standard tools and flows and powerful silicon IPs, the result is true innovation.
