15:05 – 15:25
Breaking the Mold and Driving Innovation – Challenges and Advances in Automotive Power Packaging Technology
突破常规，驱动创新 – 汽车功率封装技术的挑战与进展
This report focuses on the automotive power semiconductor market, providing a comprehensive analysis of its core applications and key technological challenges. By examining the market landscape and the critical role of power semiconductors in electric vehicles (EVs) and intelligent systems, the report identifies major technical bottlenecks and industry barriers. It also highlights JCET’s strategic layout in power semiconductor packaging and testing, including cutting-edge solutions where AI integration significantly enhances efficiency across the entire packaging and testing process. Additionally, the report showcases the advanced capabilities of JCET’s new automotive electronics factory and emphasizes its comprehensive one-stop service—covering design, packaging, and testing—to meet diverse customer needs.
Gang Jung
JCET
Korean veteran Automotive Electronic Expert, Currently serving as GM of JCET Automotive BU. With over 23years of profound expertise at the world’s top semiconductor packaging & testing companies and leading global Tier1 suppliers, he processes extensive experience in R&D, supply chain optimization，quality management and OEM customer service. Mr. Jung Gang has consistently pursued the mission of being the “Global Automotive Industry’s Best Partner.” Through technological innovation and lean management, he continues to drive globalization in the smart mobility sector.
Company Profile
JCET Group is the world’s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services that include semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to vendors around the world.
Our comprehensive portfolio covers a wide spectrum of semiconductor applications such as mobile, communication, compute, consumer, automotive, and industrial, through advanced wafer-level packaging, 2.5D/3D, System-in-Package, and reliable flip chip and wire bonding technologies. JCET Group has two R&D centers in China and Korea, six manufacturing locations in China, Korea, and Singapore, and sales centers around the world, providing close technology collaboration and efficient supply-chain manufacturing to our global customers.
Korean veteran Automotive Electronic Expert, Currently serving as GM of JCET Automotive BU. With over 23years of profound expertise at the world’s top semiconductor packaging & testing companies and leading global Tier1 suppliers, he processes extensive experience in R&D, supply chain optimization，quality management and OEM customer service. Mr. Jung Gang has consistently pursued the mission of being the “Global Automotive Industry’s Best Partner.” Through technological innovation and lean management, he continues to drive globalization in the smart mobility sector.
Company Profile
JCET Group is the world’s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services that include semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to vendors around the world.
Our comprehensive portfolio covers a wide spectrum of semiconductor applications such as mobile, communication, compute, consumer, automotive, and industrial, through advanced wafer-level packaging, 2.5D/3D, System-in-Package, and reliable flip chip and wire bonding technologies. JCET Group has two R&D centers in China and Korea, six manufacturing locations in China, Korea, and Singapore, and sales centers around the world, providing close technology collaboration and efficient supply-chain manufacturing to our global customers.
