11:45 – 12:05
Qualcomm – Leading Technological Transformation
This presentation will showcase Qualcomm’s innovations in Mobile, PC, Auto, XR, and AI and how these technologies are helping transform the middle east in collaboration with Saudi Arabia and UAE based companies
Ahmer Syed
Qualcomm Technologies
Ahmer Syed is VP, Operations at Qualcomm, heading sourcing operations for Packaging and Test services. He leads the team in supplier relations, capacity investments, supply assurance, and cost optimization and drives supply chain expansion – identifying, selecting, and bringing-up new OSAT and substrate suppliers for capacity assurance.
Prior to his current role, Ahmer led the Package Engineering team at Qualcomm for 8 years in developing and deploying new packaging technologies such as PoP, FOWLP, 600x600mm panel level packaging, SiP, and 2.5D and 3D advanced RDL based interposer technology.
Before joining Qualcomm in 2013, Ahmer worked at Amkor Technology for 16 years, supporting advance packaging development with Simulations, Mechanical and Reliability Testing, and Applications Engineering.
Ahmer has authored over 70 technical papers and articles on packaging and interconnects performance and reliability and has delivered numerous Keynotes at International Conferences.
Company Profile
Qualcomm is the world’s leading wireless technology innovator and the driving force behind the development, launch, and expansion of 5G. When we connected the phone to the internet, the mobile revolution was born. Today, our foundational technologies enable the mobile ecosystem and are found in every 3G, 4G and 5G smartphone. We bring the benefits of mobile to new industries, including automotive, the internet of things, and computing, and are leading the way to a world where everything and everyone can communicate and interact seamlessly.
Ahmer Syed is VP, Operations at Qualcomm, heading sourcing operations for Packaging and Test services. He leads the team in supplier relations, capacity investments, supply assurance, and cost optimization and drives supply chain expansion – identifying, selecting, and bringing-up new OSAT and substrate suppliers for capacity assurance.
Prior to his current role, Ahmer led the Package Engineering team at Qualcomm for 8 years in developing and deploying new packaging technologies such as PoP, FOWLP, 600x600mm panel level packaging, SiP, and 2.5D and 3D advanced RDL based interposer technology.
Before joining Qualcomm in 2013, Ahmer worked at Amkor Technology for 16 years, supporting advance packaging development with Simulations, Mechanical and Reliability Testing, and Applications Engineering.
Ahmer has authored over 70 technical papers and articles on packaging and interconnects performance and reliability and has delivered numerous Keynotes at International Conferences.
Company Profile
Qualcomm is the world’s leading wireless technology innovator and the driving force behind the development, launch, and expansion of 5G. When we connected the phone to the internet, the mobile revolution was born. Today, our foundational technologies enable the mobile ecosystem and are found in every 3G, 4G and 5G smartphone. We bring the benefits of mobile to new industries, including automotive, the internet of things, and computing, and are leading the way to a world where everything and everyone can communicate and interact seamlessly.
