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The ISIG 2026 documents will be made available following each summit.
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Chiplets and System Integration – Key Concepts and Implementation
Jianmin Li
Packaging R&D Director, Amkor Technology China, Inc.
Amkor Technology, Inc.
SiC – A Yin and Yang Perspective
Ralf Bornefeld
SVP Business Unit Power Semiconductors & Modules
Bosch
Pushing the Boundaries of Thermal Management to Address Challenges in Wafer Test and Advanced Packaging
Laurent Giai-Miniet
CEO
ERS electronic GmbH
Power Semiconductors Trends in eMobility from a Broader Power Electronics Perspective
Dr. Rainer Kaesmaier
Managing Director Semiconductors
Hitachi Energy
Fu Lu Shou – The Three Lucky Stars of Power
Mark Nils Münzer
Distinguished Engineer Innovation & Emerging Technologies Automotive High Power
Infineon Technologies
Heterogeneous Integration Enabled by Advanced Chiplet Packaging
Dr. Yang Cheng
Senior Director Design Service BU
JCET
Electroless Metallization as Alternative Final Finish for Power Semiconductor Devices
Dr. Stefan Pieper
Global Application Manager
mks | Atotech
How Silicon Carbide is Shifting the Future of EV – The Promise and Challenges
Dr. Tong Wu
Leader of China Automotive Solution Team
onsemi
Advanced Packaging Materials and Evaluation Platform at Resonac
Hidenori Abe
Executive director, Electronics Business Headquarters and CTO for semiconductor materials
Resonac Corporation
Innovation in Power & Energy Management is Key to Support a Sustainable Future
Francesco Muggeri
Vice President, Power Discrete and Analog Products China
STMicroelectronics
Tailored Solutions for the Semiconductor Industry Powered by TRUMPF
Dariusz Czaja
Managing Director of TRUMPF Huettinger Asia
TRUMPF Huettinger
GaN HEMT for Electric Car Inverter: Breakthroughs and Challenges
Jim Jian
VP Sales APAC and NA
VisIC Technologies
The Challenges in Getting a Reliable SiC Device
Dr. Hongchao Liu
SVP/Chief Scientist
Anhui YOFC Advanced Semiconductor Co. Ltd (YASC)
Memory and Processors for Chiplet Designs
Simone Bertolazzi, PhD.
Principal Technology & Market Analyst
Yole Intelligence
Semiconductors and Sustainability – Why Going Green is Chip Driven
Julian Fieres
Vice President Transformation, Strategy, Sustainability & Digitalization
ZF Friedrichshafen AG
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