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The ISIG 2026 documents will be made available following each summit.
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The necessity to have the right logistics partner in South East Asia to support the Global Supply Chain
Brandon Kennedy
Global Managing Director, High-Tech & Industrials
Airspace
Designing for Tomorrow : Evolving Challenges in Semiconductor Design
J-Wing Teh
Director of Silicon & Systems Design Engineering
AMD
AI in MEMS Manufacturing – A collaborational challenge for the entire value chain
Dr. Florian Schuster
Director of Product Management
Bosch
Digital: The New Key Strategy of Advanced Manufacturing
Yvonne Keil
Senior Director GF Operations India/Malaysia
GlobalFoundries
The Future of Advanced Semiconductor Manufacturing
Kok Tiong Ng
SVP and Managing Dir., Infineon Technologies Kulim Sdn Bhd
Infineon Technologies
I.S.I.G. Accelerator Program
Salah Nasri
CEO and Co-Founder
International Semiconductor Industry Group (ISIG)
Harnessing the Benefit of Precious Metals Deposition While Managing Total Cost of Ownership
Richard Oliveri
VP, General Manager
Materion
LOW COST, SCALABLE and FLEXIBLE line for different types of IC Packaging (LGA, BGA, QFN, SiP, AiP, DrMOS, Power Invertor)
Jimmy Chew
Chief Executive
PEP Innovation
The Blueprint for Sustainable Fabs
Henri Berthe
Semiconductors Segment VP • Sales
Schneider Electric
SoC Design with AI: Unlocking Innovation, Efficiency, Complexity Management, and Foundry Collaboration
Michael Woon Chin Liew
Senior Principal Engineer
StarFive Technology International Sdn. Bhd.
Impact of Generative AI in Advanced Packaging
Yik Yee Tan, PhD
Senior Technology & Market Analyst, Semiconductor Packaging
Yole Group
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