ISES TV – ISES China 2024 – Day 2
Bosch SiC Enable the Future Electric Mobility 博世SiC赋能未来电动出行
Introduce the Bosch Group’s SiC semiconductor business, the trench technology SiC chips. Introduce the power modules that Bosch developed dedicate for mass market new energy vehicles.
The power module on pin-fin cooler.
The Compact SiC Line (CSL)
Leadframe SiC Line (LSL)
介绍了博世集团SiC功率半导体的发展历程，重点介绍了博世集团针对新能源汽车电驱专门开发的碳化硅功率模块的主要特点和性能指标。
（1） 紧凑型碳化硅功率模块(CSL)
（2） 引线框架塑封碳化硅功率模块(LSL)
Dr. Richard Feng
Director of power semiconductor and module R&D center
Robert Bosch GmbH