20-21 April
Silicon Valley



CEO and Co-Founder


CEO and Co-Founder
Salah Nasri is the CEO and Co-Founder of the International Semiconductor Industry Group (ISIG), a global organization founded in 2010 that connects and empowers semiconductor decision-makers through strategic leadership platforms, executive summits, and collaborative initiatives. ISIG has become a trusted global hub for industry leaders driving innovation and progress across the semiconductor value chain.
With extensive experience across the semiconductor sector, Salah has played a pivotal role in fostering global collaboration among industry leaders. Under his leadership, ISIG has evolved into one of the most influential communities in the semiconductor ecosystem—bringing together executives, innovators, and policymakers across regions including the United States, Europe, Asia, and the Middle East.
Salah has been instrumental in expanding ISIG’s reach and impact, curating high-level summits and initiatives that drive dialogue and progress across critical areas such as semiconductor manufacturing, AI, MEMS, automotive electronics, and advanced packaging. His vision continues to position ISIG as a key platform for thought leadership, networking, and strategic industry alignment.
Earlier in his career, Salah held positions at Credit Suisse, Goldman Sachs, Worldwide Business Research, and the International Business Development Group. He studied International Relations and Economics at Oxford University and Loughborough University, and in 2024 became a Stanford University alumnus after completing the Stanford Executive Program. In addition to his role at ISIG, Salah also serves on the Advisory Board of Atlant3D, a pioneer in atomic-layer advanced manufacturing solutions.

VP & Founding Partner

VP & Founding Partner
Mr. Dei is a founding partner of I.S.I.G., and is currently serving as Vice President overseeing strategy and business development. Mr. Dei has over 15 years of corporate sales and consulting experience in the High-Tech services sector spanning markets such as Solar PV, OLED, MEMS and Semiconductors.
Throughout his tenure at I.S.I.G., he has served multinational clients helping them to expand and deepen their commercial channels and customer relationships at the executive level through strategic partnerships.

VP Programs & Director

VP Programs & Director

VP of Asia

VP of Asia

GM China

GM China
Michelle Yan is a seasoned executive with over 16 years of proven leadership in the meetings and events industry. As the General Manager of I.S.I.G. China, she brings a track record of delivering high-impact, large-scale events while driving sustained growth and fostering strong collaborations in diverse cultural and professional environments.
Throughout her career, Michelle has spearheaded cross-functional teams to execute complex, high-profile events for international conferences, corporate summits, and association-driven gatherings. Her meticulous planning and seamless execution consistently exceed client expectations, while her strategic insight ensures that each event achieves its objectives—be it brand elevation, stakeholder engagement, or global market expansion.
A visionary marketer, Michelle possesses a deep understanding of market trends and leverages targeted campaigns to amplify event visibility, engagement, and return on investment. Her initiatives have significantly increased brand awareness, attracted industry-leading participants, and solidified key partnerships on a global scale.
Committed to forging robust industry networks, Michelle has played a pivotal role in expanding the international presence of associations in China. She cultivates lasting collaborations and strategic alliances that drive long-term success, ensuring that every partnership delivers mutual value and measurable impact.
Renowned for her innovative spirit, Michelle integrates cutting-edge technology and creative solutions to enhance the attendee experience. Under her leadership, events not only captivate audiences but also generate tangible business outcomes. Her passion for pushing boundaries, coupled with her unwavering attention to detail, continues to set new standards of excellence in the meetings and events industry.

Membership Consultant

Membership Consultant

Head of Marketing and Communications

Head of Marketing and Communications

Head of Operations

Head of Operations

Senior Vice President, Advanced Packaging and Foundry


Senior Vice President, Advanced Packaging and Foundry
Dr. Hamid R. Azimi is Senior Vice President of Advanced Packaging and Foundry at Marvell. In this role, he leads the development and deployment of next-generation packaging technologies and foundry strategies to support Marvell’s data infrastructure products.
Prior to joining Marvell, Hamid spent nearly 30 years at Intel, where he most recently served as Corporate Vice President and Director of Substrate Packaging Technology Development. He led global R&D and manufacturing teams and delivered industry-leading innovations including die-embedded panel level fanout, EMIB and glass packaging for AI and high-performance computing.
A recognized pioneer in semiconductor packaging, Hamid holds over 40 U.S. patents, including the patent on first-generation organic flip-chip ABF-based substrate. He has received multiple Intel Achievement Awards and is widely known for building high-performing, inclusive teams and mentoring future industry leaders.
Hamid earned a Ph.D. and M.S. in Materials Science from Lehigh University and a B.S. in Materials Engineering from Sharif University of Technology.

Advisory Board Member


Advisory Board Member
Education :
Experience :

Sr. VP FeoL Operations


Sr. VP FeoL Operations

President of South East Asia


President of South East Asia
Ir Bernard Limis currently the Vice Presidentand co-founder of Appscard Group AS and Appscard Global Research & Innovation Center, a technology startup company working on biometric smartcard with R&D and Operation facility based out Penang, Malaysia. He has over 27 years’ experience and have held various senior management rolesin manufacturing in different industry. He was also co-founder in multiple technology startup companies in Penang. He obtained his bachelor’s degree (B. Eng (Hons) In Electrical & Electronics) at Nottingham Trent University, United Kingdom and is currently pursuing his Doctorate in Business Administration at Wawasan Open University. He is a Professional Engineer and Fellow of Institution of Engineers, Malaysia, a senior member of the IEEE and an Associate Fellow of ASEAN Academy of Engineering and Technology (AAET). Ir Bernard is currently the Management Council of Penang Skill Development Center, the Chair-elect IEEE Malaysia Section, the Chairman of The Institution of Engineers Malaysia (Penang Branch), Executive Committee of IEM, IEM Council Member, Committee Member of IEM Material Engineering Technical Division. At IEM, he is also the Deputy Chair of Standing Committee of activity. Ir Bernard is also an ASEAN Engineer Register (AER) Executive Committee and the permanent member for the technical committee on Innovation Management (NSC Y/TC11).
For more information please visit: https://www.linkedin.com/in/bernard-lim-18893510/

President of USA


President of USA

President of Taiwan


President of Taiwan
Eric Lee is the CEO of Scientech Corp. and Chairman of Yayatech. He joined Scientech in 2004, following nearly a decade at UMC, where he held positions in both Taiwan and Singapore from 1995 to 2004.
In addition to his leadership roles at Scientech and Yayatech, Eric serves as President of the International Semiconductor Executive Summit (ISES) Taiwan. He is also a part-time professor in the Advanced Packaging Master’s Program at National Taiwan University of Science and Technology.
Eric contributes actively to the industry through his roles as a member of the SEMI Taiwan Advanced Packaging Committee and as a director of the Taiwan Electronic Equipment Industry Association.

President of Korea


President of Korea
Yong Hoon (Joshua) Yoo has been involved in the static control industry since 1994 for ionization, ESD measurement and high voltage power business operation in semiconductor, flat panel displays and automotive industry. He has been a member of EOS/ESD Association since 2000 and served as an Elected Board of Director in 2016 – 2018. He is the founder and president of Korea EOS/ESD Association since 2011. He is a member of Institute of Electronics and Information Engineers (Korean IEEE) since 2021. He is serving industry as Korea President of International Semiconductor Executive Summits (ISES) since 2024.
He started his volunteering activities on EOS/ESD Association since 2013 as an active working group members and technical program committee members of annual symposium for multiple events of ESD Association. With his leadership, Korea EOS/ESD Association very strongly presents and annual events over 10 years. He is pioneer for flat panel display (FPD) static issue analysis and resolved problems. In recently, he found a root cause of ESD yield losses in AI chip manufacturing environment and improved yield over double digits.
He is an iNARTE certified ESD Engineer in 2007 and the EOS/ESD Association certified Professional ESD Program Manager in 2011. He has 14 patents for ionization system and ESD testing technologies.

President of EU


President of EU

Chair of ISIG Japan


Chair of ISIG Japan
Education:
・Bachelor, Economics, Doshisha University, Japan, 1983
Experience:
・TSSC, CEO, 2023/5~
・JSR Corporation, Managing Officer, 2019~2023
・Screen Semiconductor Solutions , CEO, 2014~2019
・Dainippon Screen Manufacturing , 1983~2014

President of China


President of China
Dr. Tong Wu is leading the onsemi Automotive Application and Marketing team in China. He graduated from Shanghai Jiao Tong University with a bachelor in Semiconductor Physics, minoring in Mathematics, and holds a Ph.D. in Electrical Engineering from the University of Tennessee, USA. Dr. Wu has over 10 years of R&D and industrial experience in semiconductor packaging and the design and application of silicon carbide.
He is now responsible for automotive technology engagement in China, covering from product definition, manufacturing, marketing, to system applications. He maintains in-depth cooperation with multiple automotive OEMs and Tier 1 suppliers.
Dr. Wu previously worked at the Oak Ridge National Laboratory (ORNL) in Oak Ridge, Tennessee, USA, and also with solid industrial R&D backgrounds. He has published more than 40 papers in international conferences and journals and has also been granted multiple US patents in the field of semiconductors.

Co-founder and CEO
Celestial AI


Dave Lazovsky is the Co-founder and CEO of Celestial AI, the creators of the Photonic FabricTM. Celestial AI, founded in April 2020, has developed the optical interconnectivity technology platform for AI computing.
Prior to founding Celestial AI, Mr. Lazovsky was a Venture Partner at Khosla Ventures. He has 30 years of experience in the semiconductor industry and over two decades of experience building andleading successful start-ups.
In 2004 Mr. Lazovsky founded Intermolecular, a semiconductor and clean energy R&D and Intellectual Property licensing company. He served as the company’s Chief Executive Officer,President and as a member of the board of directors from September 2004 through October 2014. As President and CEO, Mr. Lazovsky led all aspects of the business through its lifecycle from early-stage start-up to public company. Intermolecular (IMI) went public on the NASDAQ in 2011.
He currently has over 80 issued and pending U.S. patents.

SVP/GM Silicon Photonics
GlobalFoundries


Kevin Soukup is Senior Vice President of Silicon Photonics Product Line at GF, a position he was appointed to in 2024. In this role, Mr. Soukup leads the company’s Silicon Photonics business that enables customers to transport enormous volumes of data through high-speed, power efficient electro-optical systems.
Prior to his current role, he served as Chief Strategy Officer developing the company’s integrated strategy and ensuring that GF has the management systems in place to deliver. Mr. Soukup joined GF in 2011 and held positions of increasing responsibility in technology development and manufacturing operations for the next seven years. In 2018, Kevin transitioned to VP of Business Transformation and helped prepare GF for IPO in 2021.
Before his career with GF, Mr. Soukup spent eleven years with Samsung Electronics’ semiconductor unit in engineering and operations management positions.
Mr. Soukup holds a Bachelor of Science in Chemical Engineering from the University of Florida. He currently serves as a member of the board of directors of VueReal.

Director, LinkX Products
NVIDIA


Ashkan Seyedi received a dual bachelor’s in electrical and computer engineering from the University of Missouri-Columbia and a Ph.D. from University of Southern California working on photonic crystal devices, high-speed nanowire photodetectors, efficient white LEDs, and solar cells. With a decade of industry experience at Intel, Hewlett Packard Enterprise and now NVidia, Dr. Seyedi has been working on developing high-bandwidth, efficient optical interconnects for exascale, and high-performance computing applications.

Vice President IC-Link | imec silicon solutions
imec


At IC-Link / imec silicon solutions, Philippe Absil leads programs enabling custom ASIC design, prototyping, and advanced semiconductor integration. With over 20 years of experience in CMOS technology development and system design, Philippe has driven innovation in advanced nodes, 3D integration, and heterogeneous packaging. He holds a Ph.D. in Electrical Engineering and has authored numerous publications and patents in semiconductor process technology. At imec, Philippe focuses on bridging research and industry to accelerate time-to-market for next-generation chips in AI, automotive, and high-performance computing applications.

SVP & CTO, Optics/Data Center Engineering
Marvell Technology


Dr. Radha Nagarajan is Senior Vice President and Chief Technology Officer of Marvell’s Optical Engineering Group. In this role, he manages the development of the company’s optical platform technology and products. Radha joined Marvell from Inphi, where he served as the Senior Vice President and Chief Technology Officer of Platforms.
In 2025, Radha was elected to the National Academy of Engineering (NAE, US) for his contributions to the advances in high-speed lasers and photonic integration technologies. He has been awarded more than 250 US patents and is a Fellow of the IEEE, OSA and IET (UK). He has also been awarded the IEEE/LEOS Aron Kressel Award, the IPRM (Indium Phosphide and Related Materials) Award and the OPTICA David Richardson Medal, in recognition of breakthrough work in the development and manufacturing of large scale photonic integrated circuits. Radha was named to Electro Optics’ The Photonics100 which honors the industry’s most innovative people. Radha holds a B.Eng. from the National University of Singapore, M.Eng. from the University of Tokyo, and Ph.D. from the University of California, Santa Barbara, all in Electrical Engineering.

CEO and Co-Founder
Ayar Labs


Mark is Chief Executive Officer and Co-Founder of Ayar Labs. His prior roles at Ayar Labs include Chief Technology Officer and Senior Vice President of Engineering. He is recognized as a pioneer in photonics technologies and, prior to founding the company, led the team that designed the optics in the world’s first processor to communicate using light. He and his co-founders invented breakthrough technology at MIT and UC Berkeley from 2010-2015 which led to the formation of Ayar Labs. He holds a PhD from University of Colorado.

SVP, Engineering & Operations
Lightmatter


Ritesh Jain is Senior Vice President, Engineering & Operations at Lightmatter leading cross-functional engineering organizations responsible for driving innovation and delivering products. Previously as VP at Intel, Ritesh led hardware development for data centers. He holds a master’s in semiconductor packaging and during the two plus decades of experience in the semiconductor industry, he drove several generations of data center products into high volume deployments while driving major technology transitions and leading global engineering teams.


















