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3DIC Lab, NYCU
3DIC Lab is led by Prof. Kuan-Neng Chen. The research topics include three-dimensional integrated circuits (3D IC), heterogeneous integration, and advanced packaging technology. As the scaling of transistor size faces its physical limits, 3D IC becomes the mainstream candidate to extend “Moore’s Law” and fulfill “More than Moore” applications. The vision is to demonstrate a highly prolific spirit of innovation in creating or facilitating outstanding inventions. The research goal is to make a tangible impact on the quality of life, economic development, and the welfare of society. The members firmly believe 3D IC is the key to leading semiconductor technology and electronic applications in the future innovation.
The research team and Prof. Kuan-Neng Chen have published more than 440 publications, including 3 books and 7 book chapters, and holds 91 patents. Attributed to our innovation and diligence, many of our significant research achievements have been published in IEDM, VLSI, and ISSCC. In addition to our outstanding academic achievements, 3DIC Lab has strong relationship with industries world-wide. Through the formats of joint development project (JDP) and non-exclusive technology transfer, 28 worldwide companies have benefited and further upgraded their technology and products. As a global leading research team in 3D IC field, 3DIC Lab collaborates world-wide universities, research institutes, and companies!
ACCRETECH
We develop our businesses in two key areas: semiconductor manufacturing equipment and precision measuring systems.
Our philosophy is to generate long-term growth through the creation of “WIN-WIN,” or mutually beneficial, relationships, with all our stakeholders – customers, business partners, shareholders and lnvestors and employees.Products & Services
Dicing machine cut wafers into individual semiconductor chips with blades.
ACCRETECH Laser dicing machines use lasers instead of blades to dicewafers at high speed in a completely dry process.
Probing machine is a wafer transfer and positioning device used for testing the electrical characteristics of chips formed on wafers. This wafer test is used to sort out good and defective chips.
The polish grinder is a single machine that can both slice various device wafers and remove damage, which has been developed from a unique idea of ACCRETECH-Tokyo Seimitsu. In recent years, the grinder also contributes to various grinding and polishing processes required for advanced packaging technologies such as laminated memory and FO/2.5D/3D.
High-rigidity grinder is the device to grind the hard and brittle materials such as sapphire and Sic substrates that are considered to be hard-to-cut materials.
CMPs remove unevenness on wafer surfaces that occur during the production process. Applications are growing due to the increase of layers in semiconductor devices and the growing variety of wiring materials.
Edge Grinding Machines, The requirement for the wafer quality is getting higher and the condition of wafer edge is getting more important. The edge grinders “W-GM series” process edge grinding of various kind of materials such as Silicon, sapphire and SiC. As a solution for that, Our W-GM series are highly rated among manufactures of silicon, compound materials and other wafer shaped materials. Wafer edge grinding machine also draws the attention as a solution for the yield loss due to the knife edge of device wafer in the back end process. In the semiconductor manufacturing process, from the wafer manufacturing to the device manufacturing, the quality improvement of wafer edge is necessary in recent years. We make proposals that achieve the improvement of quality, CoO and yield with our machine.
AEM HOLDINGS
With the rise of artificial intelligence (AI), the demand for powerful AI chips continues to surge, driving the semiconductor industry toward a trillion-dollar market. These next-generation chips require advanced packaging, high-power thermal management, and rigorous test coverage.
As a leader in Active Thermal Control technology, AEM provides innovative full-stack test solutions designed to enhance test cell throughput and lower test costs. PiXL™ – our patented, intelligent thermal management technology – provides rapid, precise control of test environments. PiXL™ is utilised across all testing stages, from engineering labs to high-volume manufacturing, thus accelerating time-to-market and enhancing yield insights. Together with our automation capabilities and application-specific test instruments, our Test 2.0 solutions are revolutionising 2.5D/3D advanced packaging testing for AI and high-performance computing (HPC) devices.
Through our innovative, highly parallel, high-power test solutions, AEM empowers customers to realise the full potential of AI and future semiconductor advancements.
AEM has a global presence across Asia, Europe, and the Americas. Our R&D centers are crucial in innovating and advancing our in-house engineering capabilities to deliver technologies and solutions for the next generation of semiconductor testing needs. AEM’s R&D centers are situated in Singapore, Malaysia, Finland, France, South Korea, and the United States of America.
Products & Services
Thermal technology is the critical test enabler for Artificial Intelligence (AI) and Advanced Packaging. PiXL™ is AEM’s patented, intelligent thermal management technology that provides rapid, precise control of test environments and is the common thermal architecture that is uniquely integrated across multiple test insertions. With our application-specific test instruments and advanced automation, we enable our customers in the AI and High-Performance Compute (HPC) spaces to optimise their test processes across multiple test insertions, significantly reducing the testing cost per packaged device.
Ajinomoto Fine-Techno Corporation USA
Ajinomoto Fine-Techno Co., Inc. (AFT) is a subsidiary of the Ajinomoto Group responsible for the fine chemicals division. AFT (est. 1942) continues to deliver materials that can suit a wide range of customer needs in our four main strengths: molecular design, formulation, process development, and solutions. Our customers have commended us for our electronic materials. We have grown to play a major part in their value chains for electronics, automotive, and a variety of other products. We continue to refine our ability in materials science through research and development to continue creating value with our customers. We strive to provide the highest quality products, services, and information for our customers. Beyond our Ajinomoto Build-up film®, we’ve expanded our material portfolio to include molding, photo dielectric, magnetic, and optoelectronics. To maintain our leadership in our specified industry, we are devoted to providing state-of-the-art material, technology know-how, and customer service.
Products & Services
- Insulation film: Ajinomoto Build-up Film (ABF)
- Magnetic materials (Film and Liquid Format)
- Semiconductor encapsulants (AEF )
- Adhesives & Encapsulants (PLANSET)
- Functional adhesive / encapsulation film “AFTINNOVA EF series”
- Latent curing agent “AJICURE”
- Pigment dispersants, coupling agents
- Flame retardants, polymer co-stabilizer
- Activated carbon
Please visit the website: Product information – Ajinomoto Fine-Techno Co.,Inc. (aft-website.com)
AlixPartners
AlixPartners is a results-driven global consulting firm that specializes in helping businesses respond quickly and decisively to their most critical challenges—from urgent performance improvement to complex restructuring, from risk mitigation to accelerated transformation. These are the moments when everything is on the line—a sudden shift in the market, an unexpected performance decline, a time-sensitive deal, a fork-in-the-road decision. We stand shoulder to shoulder with our clients until the job is done, and only measure our success in terms of the results we deliver.
Products & Services
Clients call us when they need pragmatism and cut-through to solve their most complex challenges arising from a continually disrupted world. Our services cover Artificial Intelligence, Corporate Strategy & Transformation, Data Governance, ESG, Growth, Investigations, Disputes & Advisory Services, Mergers & Acquisitions, Organizational Transformation, Supply-Chain Management & Operations, Technology, Transformative Leadership and Turnaround and Restructuring.
Alpha Power Solutions (Shanghai) Ltd.
Alpha Power Solutions (APS) is China’s leading supplier of wide band gap power semiconductor devices. It is one of the pioneering companies in China to engage in the research and development of SiC devices and is the first to successfully use 6-inch SiC technologies , helping China make a breakthrough in this field.
APS adopts the CIDM strategy and has successfully deployed applications in leading domestic companies in the renew energy, photovoltaic energy storage, and EV-charging industries, providing them with Silicon carbide products and solutions for carbon neutrality.Products & Services
SiC MOSFET, SiC Diode
Amazing Cool Technology Corporation
ACOOL uses a patented process to produce graphene-modified copper, which is a new material after graphene and copper form a covalent-metallic bond.
Products & Services
The world‘s only mass-producible graphene copper material, all properties exceed those of oxygen-free copper, we named ACOOL COPPER, that are transcendent.
It is formed by graphene and copper. It has dozens of excellent characteristics such as improved mechanical properties, electrical conductivity, thermal conductivity, corrosion resistance, oxidation resistance, EMI resistance, bending resistance, fusible current resistance, high voltage and low leakage, and low temperature coefficient.AMD
For 50 years, AMD has driven in high-performance computing, graphics, and visualization technologies – the building blocks for gaming, immersive platforms, and the datacenter. Hundreds of millions of consumers, leading Fortune 500 businesses and cutting-edge scientific research facilities around the world rely on AMD technology daily to improve how they live, work and play. AMD employees around the world are focused on building great products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit AMD (NASDAQ:AMD) on their website, blog, Facebook and Twitter pages.
Amkor Technology, Inc.
Amkor Technology, Inc. is the world’s largest US headquartered OSAT (outsourced semiconductor assembly and test). Since its founding in 1968, Amkor has pioneered the outsourcing of IC packaging and test services and is a strategic manufacturing partner for the world’s leading semiconductor companies, foundries, and electronics OEMs. Amkor provides turnkey services for the communication, automotive and industrial, computing, and consumer industries, including but not limited to smartphones, electric vehicles, data centers, artificial intelligence and wearables. Amkor’s operational base includes production facilities, product development centers and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the United States. Learn more at https://amkor.com
ams OSRAM
At ams OSRAM, we pioneer differentiating light and sensor solutions. Looking back on more than 110 years of industry experience, we combine engineering excellence and global manufacturing capabilities with passion for cutting-edge innovation. Our commitment to pushing the boundaries of illumination, visualization, and sensing has earned us the trust of customers worldwide. Together, we create break-through applications that make our world safer, smarter, and more sustainable.
“Sense the power of light” – our success is based on our deep understanding of the potential of light. We harness its full spectrum – visible and invisible – to illuminate our surroundings as well as gather information from them. By adding intelligence to light, we enable our customers to drive transformative applications.
Our around 19,700 employees worldwide focus on innovation alongside the societal megatrends of digitalization, smart living, energy efficiency, and sustainability. Our light and sensor technologies are setting industry standards in the automotive, industrial, medical and consumer electronics markets. This is reflected in our global portfolio of some 13,000 patents and patent applications. Headquartered in Premstaetten/Graz (Austria) with co-headquarters in Munich (Germany), the group achieved EUR 3.4 billion revenues in 2024.
Products & Services
Our distinct portfolio of advanced light and sensor technologies sets us apart in our industry. It includes high-quality semiconductor-based light emitters, sensors, CMOS ICs and software as well as a range of traditional lighting technologies for automotive and special applications.
ASMPT Semiconductor Solutions
ASMPT Limited, founded in 1975, is headquartered in Singapore and is listed in Hong Kong Stock Exchange since 1989.
ASMPT is the only company in the world that offers high-quality equipment for all major steps in the electronics manufacturing process – from carrier for chip interconnection to chip assembly and packaging to SMT. No other supplier offers a comparable range and depth of process expertise.
Semiconductor Solutions Segment Business of ASMPT offers a diverse product range from bonding to molding and trim & form to the integration of these activities into complete in-line systems for the microelectronics, semiconductor, camera modules, advanced packaging, photonics, and optoelectronics industries.
The group has successfully established itself as the leading player in the back-end assembly and packaging market with its innovative solutions and constant focus on customer value creation.
AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
Technology and digitalisation are having an ever-growing impact on our lives and are increasingly shaping our daily routines at home and at work. The advances achieved in these fields in recent years are truly breathtaking and have created crucial momentum for growth in every sector of the economy.
As a global technology enterprise, AT&S is actively involved in these developments and plays a decisive role in shaping the digital world of tomorrow. The high-end PCBs and IC substrates AT&S supplies influence future industry standards, products and applications in a number of key industries. Our products’ unrivalled quality and constant innovation secures our customers’ long-term competitiveness. AT&S brings its expertise to bear wherever data is processed, transmitted or stored, or complex systems and machinery need to be controlled or supplied with energy. Thanks to our years of experience in microelectronics, we have the engineers and knowledge needed to overcome any technical challenge. We have developed the best products, processes and technologies in the industry – and constantly strive to develop further and make sure we stay one step ahead.Products & Services
Our printed circuit boards and IC substrates represent the very latest technology and can be found in cars, industrial plants, servers, medical technology products and consumer electronics. Video streaming, apps, social media and other cornerstones of everyday digital life would not be possible without AT&S. Our technologies and products are a driving force behind rapidly advancing miniaturisation in the electronics industry and enable maximum performance in the smallest of spaces. Our products: IC substrates, Substrate-like printed circuit boards and modules, Flexible and rigid-flex printed curcuit boards, Thermally enhanced printed circuit boards, HDI printed circuit boards, Cavity printed circuit boards, ECP printed circuit boards, High-frequency & high-speed printed circuit boards, Multilayer printed circuit boards, Test & reference boards, Double-sided printed circuit boards.
ATLANT 3D
ATLANT 3D has mastered control of matter at the atomic scale, ushering in a new era in manufacturing. For research teams and manufacturers working at the frontiers of technology, we’ve created what was once thought unattainable: a system that builds materials and devices, atom by atom, with unprecedented precision and speed.
While others are constrained by traditional manufacturing limits, our breakthrough technology makes it possible to create the seemingly impossible, from next-generation quantum computers to devices that can operate in the harsh conditions of space. By replacing complex, resource-heavy processes with precise atomic-scale fabrication, we’re transforming technology while making manufacturing sustainable. We’re providing innovative teams the power to build technologies today that will define tomorrow’s world, using fewer resources to achieve greater possibilities.
Based in Copenhagen and London, with operations in the US, ATLANT 3D partners with research institutions and industrial companies to expand the boundaries of technological possibility.
Products & Services
ATLANT 3D is redefining microfabrication with its patented Direct Atomic Layer Processing (DALP®) technology. Our NANOFABRICATOR™ platform enables localized atomic layer processing for rapid material discovery, prototyping, and scalable device fabrication—bridging the gap from lab to fab.
Beyond hardware, we offer Pilot Projects and Joint Development Services to validate new materials and device architectures. A-HUB, our Microfabrication-as-a-Service (MaaS) centre, provides R&D teams with atomic-scale precision without the need for costly infrastructure.
From concept to fabrication, ATLANT 3D partners with academia and industry to drive next-generation innovations beyond conventional limits.
AUO Corporation
AUO Corp. is one of the world’s leading providers of optoelectronic solutions. Based on its profound R&D and manufacturing experience, AUO offers a full range of display applications and smart solutions integrating software and hardware, and leverages its core expertise to enter new business areas such as solar, smart retail, general health, circular economy and smart manufacturing service. Additionally, AUO has also been named to the Dow Jones Sustainability World Index since 2010.
AuthenX. Inc
Founded in 2019, AuthenX is an optoelectronic product development company specializing in Silicon Photonics and III-V Photonics key components. Our core technologies include optical design, high-speed circuits, precision packaging, and system integration. Leveraging industrial chain integration, we provide solutions and products for next-generation data centers, AI GPU systems, FTTX, and PON applications.
Products & Services
Our products and services include 400Gbps, 800Gbps, and up to 1.6Tbps optical transceivers, as well as high-power ELS modules for CPO in data centers and AI GPU systems. In silicon photonics, we focus on the hybrid integration of Optical I/O on PICs, including laser-to-PIC and PIC-to-FAU integration, aiming to improve PIC I/O packaging tolerance and throughput. Our products are applicable in fields ranging from PON and FTTX to data centers and AI GPU systems.
Axiom Space
Axiom Space is the leading developer of next-generation orbital infrastructure and provider of human spaceflight services. Axiom Space is building the world’s first commercial space station, Axiom Station, and orbital infrastructure for orbital data centers and in-space manufacturing of semiconductors and pharmaceuticals. The company is pushing the boundaries of technological innovation and providing end-to-end solutions for the semiconductor industry to expand its research and manufacturing capabilities beyond Earth. Axiom Station and its scalable orbital infrastructure will enable the manufacturing of next-generation semiconductor materials for energy, compute, quantum, and automotive applications on the ground. Axiom Space is furthering American leadership in space exploration, elevating national space programs globally, and enabling the industrialization of space by redefining the pathway to sustained presence in the low-Earth orbit.
Beckhoff Automation GmbH & Co. KG
Beckhoff is a German company, founded in 1980 by Mr. Hans Beckhoff. Beckhoff has grown into a global automation leader with subsidiaries operating in 75 countries.
Beckhoff is renowned for innovation and has contributed significantly with the adoption of groundbreaking technologies such as EtherCAT, an astonishingly fast fieldbus system, which in 2007 was approved as a semiconductor industry standard SEMI E54.20.
Beckhoff develops open automation systems built upon proven PC-based control technology. The product range spans from industrial PCs to an extensive portfolio of I/O devices and fieldbus components, to innovative drive technology, modern automation software, control cabinet-free automation, novel planar transportation systems, and hardware for machine vision.
Leading Wafer Equipment Manufacturers adopt Beckhoff new automation technology for innovative, smart tools, resilient against security incursions, to shrink the machine footprint and to drive down cost.
For more information, please visit:
Boltchip
BOLTCHIP builds Innovation Capability Centers (ICCs) for semiconductor and chip design engineering across Asia, enabling organizations to build and scale world-class talents teams for breakthrough innovation. As organizations accelerate their digital initiatives in semiconductors and AI, many struggle to build sustainable capability at scale through traditional outsourcing or hiring models.
At BOLTCHIP, we engineer high-performance ICCs through our proven BOLT Model-Build, Operate, Learn, Transform & Transfer-a strategic framework that ensures centers evolve with your goals, embedding efficient processes, lean structures, and measurable productivity improvements. Our ICCs are designed to move systematically up the value chain: from building world-class talent teams → to enabling IP-driven innovation.
Products & Services
Through our BOLT Model (Build, Operate, Learn, Transform & Transfer) we deliver a comprehensive ecosystem of services:
Research & Advisory – Location and market trends analysis, talent intelligence, and strategic planning to guide your ICC setup and expansion.
Talent Ecosystem – End-to-end talent sourcing, leadership hiring, and Employer of Record (EOR) services to build your world-class engineering teams.
Workspace Services – Custom-built offices, flexible leasing, hospitality services, and IT infrastructure tailored for semiconductor and AI development environments.
Business Enablement – Finance, tax and regulatory support, IP protection, and HR & legal advisory to ensure compliant and secure operations.
Collaborative Learning – Reskilling and upskilling programs with continuous improvement frameworks to keep your teams at the cutting edge.
Transformation – Agentic AI and innovation capabilities, plus specialized IC design services to drive breakthrough results.
Our asset-lite approach moves you systematically from building world-class talent teams → to enabling IP-driven innovation, empowering you to enter the global semiconductor ecosystem with speed and sustained competitive advantage.
Brewer Science, Inc.
Brewer Science is a global leader in developing and manufacturing next-generation materials and processes that foster the technology needed for tomorrow. Since 1981, we’ve expanded our technology portfolio within advanced lithography, advanced packaging, smart devices, and printed electronics to enable cutting-edge microdevices and unique monitoring systems for industrial, environmental, and air applications.
C. Uyemura & Co., Ltd.
Based on the management philosophy that “We are committed to action with sincerity”, Uyemura is a leading company in surface treatment technology and develops business related to “plating” globally in order to contribute to the betterment of people’s lives and society.
Products & Services
The scope of surface treatment business is broadly divided into the three areas of plating chemicals, plating equipment and control systems. Uyemura is one of only a few companies in the industry that develops business in all three of these areas. In order to provide one-of-a-kind products and services that meet the diverse needs of our customers, we support cutting-edge manufacturing from “all the areas related to plating”, with plating chemicals, plating equipment and control systems.
Navat Capital Management LLC
NexStage Ventures
Singapore based advisory on a mission to scale up emerging technologies and enabling companies from startups to larger corporation’s address pain points that lead into new business and revenue streams. Let’s grow together.
Products & Services
Provide tailored assessment to strategic projects, collaborate with cross-functional teams to elaborate paths to enable solutions with business growth in mind. Focus on Semiconductor packaging and test services and its eco-system.
South China Venture Capital
South China Venture Capital (SCVC) is a venture capital company, which manages RMB 5 billion and USD 100 million in assets. SCVC has invested in nearly 100 companies across the globe, including China, Singapore, the United States, Japan, and others.It has been awarded “Best Investment Institution in China,” “Best Early-Stage Investment Institution in China,” “Best Investment Institution in the Industry (Equipment and Materials) of the Year,” by Jiwei.com. and “Best Early-Stage Venture Capital Institution in China” by China Venture.Syenta
Syenta has developed a breakthrough advanced packaging technology that addresses the critical AI memory bandwidth bottleneck by enabling high-resolution copper interconnects.
Products & Services
We are actively exploring strategic partnerships in the AI accelerator space to demonstrate how our technology can overcome existing chip design constraints and potentially increase chip bandwidth by up to 10x.
WindTech Semiconductor Co. Ltd.
WindTech Semi Co. is a start-up that dedicates itself in developing and productizing optical inspection equipment for semiconductor industry for its core competency. We plan and execute to deliver industry-leading high-end process control equipment for SiC, Si and Photomask aspects. Our target is to provide, for our pan-semiconductor manufacturing customers, the most advanced and market-driven solutions on optical technologies, applications and service support
Products & Services
WindTech’s first product offering, Pacific-100, focuses on SiC process control, with the most advanced technical solution in the SiC market segment. With our best inspectio and classification solutions, we can help the industry with yield enhancement optimization that this industry needs.
