AEM HOLDINGS
Biography
Company Profile
AEM HOLDINGS
Company Profile
With the rise of artificial intelligence (AI), the demand for powerful AI chips continues to surge, driving the semiconductor industry toward a trillion-dollar market. These next-generation chips require advanced packaging, high-power thermal management, and rigorous test coverage.
As a leader in Active Thermal Control technology, AEM provides innovative full-stack test solutions designed to enhance test cell throughput and lower test costs. PiXL™ – our patented, intelligent thermal management technology – provides rapid, precise control of test environments. PiXL™ is utilised across all testing stages, from engineering labs to high-volume manufacturing, thus accelerating time-to-market and enhancing yield insights. Together with our automation capabilities and application-specific test instruments, our Test 2.0 solutions are revolutionising 2.5D/3D advanced packaging testing for AI and high-performance computing (HPC) devices.
Through our innovative, highly parallel, high-power test solutions, AEM empowers customers to realise the full potential of AI and future semiconductor advancements.
AEM has a global presence across Asia, Europe, and the Americas. Our R&D centers are crucial in innovating and advancing our in-house engineering capabilities to deliver technologies and solutions for the next generation of semiconductor testing needs. AEM’s R&D centers are situated in Singapore, Malaysia, Finland, France, South Korea, and the United States of America.
Product & Service
Thermal technology is the critical test enabler for Artificial Intelligence (AI) and Advanced Packaging. PiXL™ is AEM’s patented, intelligent thermal management technology that provides rapid, precise control of test environments and is the common thermal architecture that is uniquely integrated across multiple test insertions. With our application-specific test instruments and advanced automation, we enable our customers in the AI and High-Performance Compute (HPC) spaces to optimise their test processes across multiple test insertions, significantly reducing the testing cost per packaged device.
