Audrey Charles

SVP Corporate Strategy & Advanced Packaging
Lam Research

Biography

Audrey Charles is senior vice president of corporate strategy and advanced packaging, and president of Lam Capital at Lam Research. In this position, she is responsible for leading the executive management team in the development of strategic priorities and key initiatives that support the company’s long-term profitable growth. She is also responsible for accelerating the company’s market-leading position in advanced packaging to deliver differentiated technology and support to customers. Additionally, Audrey oversees Lam’s Corporate Development team and investment arm, Lam Capital, which invests in disruptive companies that advance the semiconductor ecosystem through next generation industrial automation, technology and product innovation, and new market opportunities. She brings a broad base of experience to her role, including engineering, customer technology management and investor relations. Since joining Lam in 1995, she has served in a range of leadership positions including senior vice president of Global Human Resources and vice president of corporate initiatives. Audrey earned an M.B.A. from the MIT Sloan School of Management and a B.S. in applied physics from Dublin City University.

Company Profile

Lam Research

Company Profile

Lam Research Corporation is a trusted global supplier of innovative wafer fabrication equipment and services to the semiconductor industry. Our strong values-based culture fuels our progress, and it’s through collaboration, precision, and delivery that we are driving semiconductor breakthroughs that define the next generation. Lam Research (Nasdaq: LRCX) is a FORTUNE 500® company headquartered in Fremont, California, with operations around the globe. Learn more at www.lamresearch.com

Product & Service

We combine superior systems engineering, technology leadership, and a commitment to customer success to advance the global semiconductor industry. Our broad portfolio of market-leading deposition, etch, strip, and wafer cleaning solutions helps customers achieve success on the wafer by enabling device features that are 1,000 times smaller than a grain of sand—it’s why nearly every chip today is built with Lam technology.