Cleon Chan
Biography
Cleon Chan is the Vice President, Business Development for the Panel Solutions for Onto Innovation since 2019 after merger between Rudolph Technologies and Nanometrics. He worked with many companies on FOPLP, Interposer and Substrate (2.xD, 2.5D and 3D Heterogeneous Integration) to identify challenges and how Onto Steppers, Inspection/Metrology and Yield solutions can enable the Advanced IC Substrate and Packaging roadmap. Previously, he was with Rudolph Technologies as Global Sales and Applications in 2015. Prior to Rudolph, he was with Applied Materials as Strategic Marketing GM and was responsible for some key process equipment for both Advanced Packaging and Frontend processes. He also held management positions at Varian Semiconductor and STEAG Microtech before joining Applied Materials. Cleon graduated with Bachelor of Electrical and Electronics Engineering (Hons) from National University of Singapore.
Company Profile
Onto Innovation
Company Profile
Onto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading-edge technologies that include: Un-patterned wafer quality; 3D metrology spanning chip features from nanometer scale transistors to large die interconnects; macro defect inspection of wafers and packages; elemental layer composition; overlay metrology; factory analytics; and lithography for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain helps our customers solve their most difficult yield, device performance, quality, and reliability issues. Onto Innovation strives to optimize customers’ critical path of progress by making them smarter, faster and more efficient. Headquartered in Wilmington, Massachusetts, Onto Innovation supports customers with a worldwide sales and service organization.
General Telephone: +1 978 253 6200
General email: info@ontoinnovation.com
Website: www.ontoinnovation.com
