David Forer
Biography
David is a seasoned technology executive with over two decades of leadership across the semiconductor and high-tech sectors. Currently serving as the Global Semiconductor Strategy Director at Physik Instrumente (PI). David is also the Founder of 719 Consulting, a bespoke consulting firm concentrating on delivering scalable strategies in sales, marketing, and operations to his clients. David has held senior leadership roles at EKK, Applied Materials, VAT Group, and COMET Technologies, with responsible for multi-million dollar business segments, global product lines, and developed competitive market strategies. David’s early career as a U.S. Navy Fire Control Technician (SW) laid the foundation for his disciplined approach to problem-solving and leadership.
Company Profile
PI
Company Profile
Since its foundation in 1970, PI (Physik Instrumente) has established itself as a leading manufacturer of precision positioning technology. The key element and motivation of the entrepreneurial behavior have always remained the same: Finding the best possible solution for the customer.
PI is well known for the quality of its products and has been one of the leading players in the global market for precision positioning technology for many years. One of the most important building blocks for this is the team spirit within the international PI family, which is based on mutual understanding and support that goes beyond international borders and functional restrictions.
PI is a privately owned company with healthy growth, 1,790 employees worldwide and a flexible, vertically integrated organization, which enables it to fulfill almost any request in the field of innovative precision positioning technology. The foremost priority for PI is to be a reliable and highly qualified partner for the customer.
Product & Service
PI Supports Semiconductor Equipment Suppliers Worldwide with High-Precision and Reliable Motion and Control Solutions for Applications Such As:
- Photomask production: Mask writing, inspection, and repair
- Wafer cutting: Sawing the wafer from the silicon monocrystal (ingot)
- Resist structuring: DUV and EUV lithography, nanoimprint lithography (NIL)
- Wafer and mask inspection (optical/electron microscopy): Detection of structural failures, defects, and particles
- Wafer metrology: Measurement of the critical dimension (CD), overlay offset, and layer thickness
- Wafer probing: Testing functionality and quality of photonic structures of photonic integrated circuits (PICs)
- Wafer dicing: Laser-based separation of chips from the silicon wafer
- Back-end production: Die and wire bonding, packaging, chip testing, and die-attachments
