Dr. Ami Eitan
Biography
Ami Eitan received his B.Sc. in Chemical Engineering from Ben-Gurion University, Israel, his M.Sc. in Chemistry from the Weizmann Institute of Science, Israel, and his Ph.D. in Materials Science and Engineering from Rensselaer Polytechnic Institute, Troy, NY.
His work experience includes 16 years at Intel Corporation, as the head of the Technology Development of assembly interconnect department, 5 years as a director in the Advanced Packaging Technology and Service organization at TSMC, Taiwan, leading bonding technology development efforts, and now Ami is a SVP, Chief Scientific Officer at ASMPT SEMI solutions. Among his leading edge development programs, Ami led the Thermo-Compression Bonding technology development at Intel.
Ami’s areas of expertise include polymer-based composites, characterization of polymer systems, materials and process development for semiconductor packaging applications, TCB, HB, and other interconnect technology development.
Company Profile
ASMPT Semiconductor Solutions
Company Profile
ASMPT Limited, founded in 1975, is headquartered in Singapore and is listed in Hong Kong Stock Exchange since 1989.
ASMPT is the only company in the world that offers high-quality equipment for all major steps in the electronics manufacturing process – from carrier for chip interconnection to chip assembly and packaging to SMT. No other supplier offers a comparable range and depth of process expertise.
Semiconductor Solutions Segment Business of ASMPT offers a diverse product range from bonding to molding and trim & form to the integration of these activities into complete in-line systems for the microelectronics, semiconductor, camera modules, advanced packaging, photonics, and optoelectronics industries.
The group has successfully established itself as the leading player in the back-end assembly and packaging market with its innovative solutions and constant focus on customer value creation.
