Dr. Gang Duan
Biography
Gang Duan currently serves as Executive Vice President at Samsung Electro-Mechanics America, and is responsible for package substrate technology marketing and application engineering. Prior to his current role, Gang was the Sr. Director of Backend Area and a Sr. Principal Engineer in Substrate Packaging Technology Development at Intel Foundry, leading pathfinding and development efforts in EMIB/EMIB-TSV die embedding, High-Density Interconnect organic/glass substrate backend, and glass carrier-based packaging backend processes. In recognition of his innovative and pioneering contributions, Gang was honored as the 2024 Intel Inventor of the year. He holds 325+ US issued/pending patents (600+ globally) in IC packaging processes, architectures, and materials. Gang has published 50+ technical papers in highly regarded academic journals and industry conferences, garnering over 5000 citations. He received his Ph.D. in Materials Science, and his M.S. in Electrical Engineering from the California Institute of Technology (Caltech).
Company Profile
Samsung Electro-Mechanics
Company Profile
Founded in 1973, Samsung Electro-Mechanics has grown into a world-class company that develops and produces major electronic components.
In our early days, we established the foundation for the self-reliant component industry in Korea through audio and video component production. In the 1980s, we expanded into materials and computer components, and our focus moved on to developing promising next-generation products, such as components for computer chips, mobile communication devices, and optical devices in the 1990s. Since the 2000s, we have been producing MLCC (Multilayer Ceramic Capacitors), power inductors, camera and communication modules, and substrates with world-class core technologies in materials, high-frequency wireless communication, and precision mechanics.
Samsung Electro-Mechanics focuses on investment and development of technological convergence to advance our core products to the highest quality and plans to continuously expand our business portfolio through product development in the growing field of AI computing. We will also nurture our next-generation growth engines early on our way to become the No.1 company in the electronic components industry.
