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Dr. Yu-Hua Chen

VP Carrier SBU/RD Division
Unimicron Technology Corp

Biography

Education:

  • Ph.D. Chemistry, 2001, National Taiwan University

Experience:

  • 2012~2021, Vice President, Unimicron Technology Corp.
  • Advanced substrate, panel level RDL and glass substrate Technology
  • 2001~2012, Deputy R&D Director. ITRI/EOSL
  • 3DIC, wafer level stacked & 8” and 12” CIS TSV package technology
  • Chip embedded in rigid and flexible substrate technology
  • Flexible LED lighting package technology
Company Website

Company Profile

Unimicron Technology Corp

Company Profile

Founded in 1990, Unimicron is a world leading company of printed circuit board (PCB) and IC carrier (substrate) manufacturing. Major products include PCBs, high density interconnection (HDI) boards, flexible PCBs, rigid flex PCBs, and IC substrates. Product applications include AI, HPC data center infrastructure (server, networking), smartphones, PC/NB, optical modules, automotive and more. Unimicron’s global footprint encompass manufacturing sites and/or service centers in Taiwan, China, Germany, Japan and Thailand, delivering high value-added, high quality and high productivity innovation and services to our global customers.

Product & Service

Unimicron’s high-end substrate solutions, FCBGA and FCCSP, provide our valued customers the technologies crucial in meeting today’s fast-growing development of AI, HPC applications. Our customer-oriented service, high quality standards, and innovative breakthroughs have helped Unimicron achieve the honor of No.1 ranking among the global substrate suppliers by market share for the 9th consecutive year since Y2016.

Full Profile