Dr. YUPO Wang
Biography
Yu-Po Wang received Ph.D. in Mechanical Engineering from Binghamton University, State University of New York, U.S.A. In 1997, he started career at Gintic Institute of Manufacturing Technology in Singapore. He joins SPIL in 1998 and leads the R&D Package Application and Technology Support Team in substrate/package design, material characterization and advanced package and as Vice President from 2022. In 2025, he joins Prismark as Principal Consultant which covers Semiconductor market from Packaging assembly to PCB industry. He also sever as IEEE Electronics Packaging Society Board of Governors (BoG) member and Taipei Chapter Executive Committee from 2025 Dr. Wang has strong knowledge and experience in packaging characterization including thermal/ electrical simulation, advanced material(co-development), design and advanced packaging development as well as overall semiconductor market. He has over 83 patents in US.
Company Profile
Prismark
Company Profile
Prismark is an electronic industry consulting firm that is privileged to work with more than 150 of the world’s foremost electronics companies. Our clients include many of the leading systems and semiconductor companies, manufacturing services providers, their suppliers of materials, components, and manufacturing tools, and the leading financial institutions that enable industry growth and investment. Prismark’s consulting practice is built on providing pivotal information that is relevant to the emergence of a new technology or the development of a client’s business. Prismark is valued by its clients, because no other resource has a broader outlook or carries out deeper research, and they use Prismark’s knowledge and insight to make confident business decisions about uncertain technology and market developments.
