John Guzek

John Guzek is a technical leader with over three decades of experience in semiconductor advanced packaging technology development, the majority in the area of substrate technology. He has been at the forefront of major substrate and packaging innovations including C4 assembly, organic flip chip, patch on interposer, coreless substrate, glass core substrate, fan-out panel-level packaging, and EMIB. He was instrumental in establishing Intel’s first internal substrate research and development factory. Currently, John leads Boise site operations for Micron’s Advanced Packaging TD organization which includes management of a $300M+ pilot line and >100 team members. John’s organization is focused on the development of next generation HBM and other heterogenous integration architectures. John holds over 50 patents in the field of packaging and graduated from the Massachusetts Institute of Technology with BS and MS degrees in Materials Science and Engineering.