Joseph Jiang

CEO & Co-Founder
xMEMS Labs

Biography

Joseph cofounded xMEMS Labs in 2018, pioneering the world’s first solid-state MEMS speakers and μCooling fan-on-a-chip. He previously served as VP of Software Product Management at Knowles, the global leader in MEMS microphones, and as EVP at Fortemedia, where he led the team to win noise suppression solutions at most of world’s leading smartphone makers. Earlier, Joseph was VP of Marketing & Business Development at InvenSense, where he helped secure major smartphone design wins at Samsung, Huawei, Xiaomi and was a key contributor to the company’s IPO in 2011.

Company Website

Company Profile

xMEMS Labs

Company Profile

Founded in January 2018, xMEMS Labs is the “X” factor in silicon MEMS with the world’s most innovative piezoMEMS platform. It began by delivering the world’s first solid-state True MEMS speakers for wireless earbuds and other personal audio devices. xMEMS’ “Sound from Ultrasound” technology delivers high-fidelity and full-bandwidth sound in a 1-mm thin package for earbuds, smart glasses, and smart watches.
xMEMS has evolved its ultrasonic piezoMEMS platform to also produce the world’s first μCooling fan-on-a-chip delivering critical active thermal management to smartphones, SSDs, XR and even isolated areas of datacenter rack servers underserved by conventional cooling technologies.
xMEMS has over 200 granted patents worldwide for its technology. For more information, visit https://xmems.com.

Product & Service

xMEMS applies our novel and patented solid-state, silicon piezoMEMS process to 3 core markets today:
1) Micro speakers for earbuds, headphones and hearing assistance devices. In this market, we are the only MEMS speaker provider in volume production with over 1 million units shipped in 2024.
2) Sycamore loud speakers (“Sound from Ultrasound”) for near-field audio products such as smart glasses, smart watches and open-fit earbuds
3) “Fan-on-a-chip” active micro cooling (µCooling) chip. It is the world’s smallest active cooling device delivering critical thermal management to small, thin systems such as smartphones, XR, SSD storage and datacenter subsystems that conventional fans and liquid cooling cannot reach.
Full Profile