Martin Lim

VP MEMS Technology
xMEMS Labs

Biography

Martin Lim is currently VP of MEMS Technology at xMEMS. His role is to develop a piezoMEMS platform to support microspeakers and to develop ultrasonic air pulse technology which is the foundation for the next generation audio devices and the fan-in-chip air pumps for microcooling.  Prior to xMEMS he was a co-founder of InvenSense where he established the CMOS-MEMS wafer bonding platform for inertial devices with wafer production rates exceeding 5000 wafers/month cumulative across multiple CMOS-MEMS foundries. Previously, he held key roles at Systron Donner Inertial, Sitek, and Xerox PARC, leading process integration for gyroscopes, pressure sensors, and acoustic MEMS. With multiple patents and publications, Martin has been instrumental in advancing MEMS process technologies for consumer electronics, automotive, and industrial applications worldwide.

Company Website

Company Profile

xMEMS Labs

Company Profile

Founded in January 2018, xMEMS Labs is the “X” factor in silicon MEMS with the world’s most innovative piezoMEMS platform. It began by delivering the world’s first solid-state True MEMS speakers for wireless earbuds and other personal audio devices. xMEMS’ “Sound from Ultrasound” technology delivers high-fidelity and full-bandwidth sound in a 1-mm thin package for earbuds, smart glasses, and smart watches.
xMEMS has evolved its ultrasonic piezoMEMS platform to also produce the world’s first μCooling fan-on-a-chip delivering critical active thermal management to smartphones, SSDs, XR and even isolated areas of datacenter rack servers underserved by conventional cooling technologies.
xMEMS has over 200 granted patents worldwide for its technology. For more information, visit https://xmems.com.

Product & Service

xMEMS applies our novel and patented solid-state, silicon piezoMEMS process to 3 core markets today:
1) Micro speakers for earbuds, headphones and hearing assistance devices. In this market, we are the only MEMS speaker provider in volume production with over 1 million units shipped in 2024.
2) Sycamore loud speakers (“Sound from Ultrasound”) for near-field audio products such as smart glasses, smart watches and open-fit earbuds
3) “Fan-on-a-chip” active micro cooling (µCooling) chip. It is the world’s smallest active cooling device delivering critical thermal management to small, thin systems such as smartphones, XR, SSD storage and datacenter subsystems that conventional fans and liquid cooling cannot reach.
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