Robin Davis
VP of Strategic Engagements & Applications
Syenta
Biography
Company Profile
Syenta
Company Profile
Syenta has developed a breakthrough advanced packaging technology that addresses the critical AI memory bandwidth bottleneck by enabling high-resolution copper interconnects.
Product & Service
We are actively exploring strategic partnerships in the AI accelerator space to demonstrate how our technology can overcome existing chip design constraints and potentially increase chip bandwidth by up to 10x.
