Suresh Jayaraman
Biography
Suresh joined Amkor in 2016 and currently leads Wafer Level Package and product development, as well as package technology integration. In this role, he partners closely with customers and internal R&D teams to advance High-Density Fan-Out (HDFO) and 2.5D technologies for CPO/XPU integration. He also develops wafer-level integration schemes that enhance the performance of RF front-end, digital, consumer, and high-performance computing products. Prior to joining Amkor, Suresh held senior engineering and product management roles at Deca Technologies. He has more than 25 years of experience in IC package design and manufacturing, including fcCSP, FCBGA, SiP, and Fine Pitch CuP products. Suresh holds a master’s degree in Industrial Engineering.
Company Profile
Amkor Technology, Inc.
Company Profile
Amkor Technology, Inc. is the world’s largest US headquartered OSAT (outsourced semiconductor assembly and test). Since its founding in 1968, Amkor has pioneered the outsourcing of IC packaging and test services and is a strategic manufacturing partner for the world’s leading semiconductor companies, foundries, and electronics OEMs. Amkor provides turnkey services for the communication, automotive and industrial, computing, and consumer industries, including but not limited to smartphones, electric vehicles, data centers, artificial intelligence and wearables. Amkor’s operational base includes production facilities, product development centers and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the United States. Learn more at https://amkor.com
