Takashi Kariya, Ph.D.
Biography
Received PhD in Electronic Engineering from Tohoku university.
1991-2015
Ibiden Corporation
– Management for Package Substrate Development Leaded substrate technology pathfinding with major semiconductor IDM, Fab less, Foundry, OEMs more than 10 years.
2015-2022
TDK Corporation
– Management for Development and business operation of Thin film component and Module. Leaded cutting edge components, MEMS and embedded IC modules.
2022-
Samsung Japan Corporation, Device Solutions R&D Japan
– Head of Advanced Package Lab of Samsung Japan Corporation and also Corporate Vice President of Samsung Electronics Corporation.
– Launch Advanced Package lab in Yokohama and setting up R&D environment at MinatoMirai.
Company Profile
Samsung
Company Profile
Samsung Electronics Co., Ltd. engages in the manufacturing and selling of electronics and computer peripherals. The company operates through following business divisions: Consumer Electronics, Information Technology & Mobile Communications and Device Solutions. The Consumer Electronics business division provides cable television, monitor, printer, air-conditioners, refrigerators, washing machines and medical devices. The Information Technology & Mobile Communications business division offers handheld products, communication systems, computers and digital cameras. The Device Solutions business division comprises of memory, system large scale integrated circuit and foundry. The company was founded on January 13, 1969 and is headquartered in Suwon, South Korea.
