ISES Japan 2025 – Speakers Profiles

Keynote Speaker

Yasushi Araki

Corporate Officer

Brightening the Future with Advanced Semiconductor Packaging Technologies

Day 2 / 09:00 - 09:20

At the forefront of semiconductor technology development, the evolution of back-end processes is essential. In particular, “advanced semiconductor packaging technology” is responding to the demand for high performance and multi-functionality of semiconductors and promoting high integration. In this presentation, we will introduce the latest technological trends.

Panel Discussion: How Far Can Package and Substrate Scaling Go Beyond 2028?

Day 2 / 11:25 - 12:10

Biography

Graduated from Applied Chemistry, Nagoya University in 1989.
1989-2000: Joined Fujitsu Ltd. Engaged in IC assembly technology.
2000-2021: Joined Shinko Electric Industries Co., Ltd. Engaged in IC Assembly technology.
From 2021: Engaged in Research and Development in the R&D Div.

Company Profile

SHINKO is a worldwide semiconductor packaging supplier with diverse technology driven initiatives and industry leading manufacturing capabilities.

Speaker

Kinya Ichikawa

Technical Director

Revisiting the Necessity and Challenges of Glass Substrates in 3DIC Advanced Packaging

Day 2 / 09:20 - 09:40

In 3DIC and HPC packaging, achieving both high-precision assembly and reliability demands a careful balance of material properties. Glass offers low CTE, high flatness, and low dielectric loss, yet faces trade-offs such as TGV reliability and stress management. This study argues that, without clearly defining the necessity of glass, application development lacks momentum. By analyzing these inherent contradictions, we discuss how to interpret and manage the trade-offs between material properties and system reliability, providing insights toward the future direction of glass utilization in advanced packaging.

Panel Discussion: How Far Can Package and Substrate Scaling Go Beyond 2028?

Day 2 / 11:25 - 12:10

Biography

Kinya Ichikawa retired from TSMC Japan 3DIC R&D Center Inc. as Technical Director in September 2024 and subsequently founded 3DIC Research Lab LLC, providing technical consulting for Japan’s semiconductor packaging ecosystem. At TSMC, he led the establishment of the Tsukuba R&D Center, aligned R&D with Taiwan headquarters, and managed NEDO project planning and execution. Before joining TSMC, he directed a joint development project at Nichia Corporation with European partners on next-generation high-definition micro-LED headlamps, which entered mass production in 2024. Earlier, he spent 24 years at Intel, pioneering FCBGA (OLGA) and EMIB technologies.

Company Profile

3DIC Research Lab LLC is a specialized consulting firm dedicated to advancing semiconductor packaging technologies with a focus on 3D integration. Founded by experts with decades of experience in wafer-level packaging, TSV, hybrid bonding, and advanced substrate technologies, the company provides deep technical insights and strategic guidance to semiconductor manufacturers, material suppliers, and equipment vendors. 3DIC Research Lab operates as a bridge between cutting-edge academic research and industrial applications, helping partners accelerate innovation, reduce risks, and optimize manufacturing processes. With strong expertise in areas such as HBM integration, fan-out packaging, and chiplet-based architectures, the company supports its clients in addressing key challenges in power, performance, thermal management, and reliability. By combining technical consulting with market perspectives, 3DIC Research Lab contributes to the realization of next-generation semiconductor solutions for AI, HPC, and consumer electronics.

3DIC Research Lab LLC offers a comprehensive range of consulting services tailored to the semiconductor packaging ecosystem. Its core services include technology evaluation, material selection support, process integration strategies, and roadmap development for advanced packaging solutions. The company provides in-depth technical analysis on critical areas such as wafer thinning, TSV formation, RDL scaling, underfill materials, and thermal interface solutions. Additionally, 3DIC Research Lab delivers customized training programs, workshops, and technical seminars to support knowledge transfer and skill development within client organizations. By leveraging a strong global network and hands-on expertise, the firm helps clients benchmark emerging technologies, assess competitive landscapes, and establish collaborations across the supply chain. Whether guiding material suppliers to meet stringent reliability requirements or advising device makers on cost-performance trade-offs, 3DIC Research Lab ensures that its partners are equipped to navigate the complexities of heterogeneous integration and advanced packaging.

Speaker

Nelson Fan

VP of AP Product Portfolio Management and Business Development

Interconnects of complex heterogeneous integration structures

Day 1 / 16:50 - 17:00

Major trend and interconnection technology development direction for complex heterogeneous integration structures

Biography

Vice President, Advanced Packaging Product Portfolio Management and Business Development of ASMPT SEMI, is a distinguished leader and innovator with over three decades of impactful contributions to the semiconductor industry. His career is characterized by a unique blend of entrepreneurial vision, deep technical expertise, and a proven track record in senior executive management.

Company Profile

ASMPT Limited, founded in 1975, is headquartered in Singapore and is listed in Hong Kong Stock Exchange since 1989.
ASMPT is the only company in the world that offers high-quality equipment for all major steps in the electronics manufacturing process – from carrier for chip interconnection to chip assembly and packaging to SMT. No other supplier offers a comparable range and depth of process expertise.
Semiconductor Solutions Segment Business of ASMPT offers a diverse product range from bonding to molding and trim & form to the integration of these activities into complete in-line systems for the microelectronics, semiconductor, camera modules, advanced packaging, photonics, and optoelectronics industries.
The group has successfully established itself as the leading player in the back-end assembly and packaging market with its innovative solutions and constant focus on customer value creation.

Speaker

Dr. Maksym Plakhotnyuk

CEO & Founder

Advanced Packaging Solutions with Direct Atomic Layer Processing (DALP®) Technology

Day 1 / 17:10 - 17:20

Advanced packaging requires new approaches to achieve heterogeneous integration, energy efficiency, and performance scaling beyond conventional methods. ATLANT 3D’s proprietary Direct Atomic Layer Processing (DALP®) technology delivers a breakthrough by enabling localized, maskless material processing with atomic precision. This unique capability provides unmatched flexibility for next-generation packaging architectures, including 2.5D and 3D integration. By combining speed, cost efficiency, and material versatility, DALP® paves the way for transformative advances in semiconductor manufacturing and packaging innovation.

Biography

Dr. Maksym Plakhotnyuk, is the CEO and Founder of ATLANT 3D, a pioneering deep-tech company at the forefront of innovation, developing the world’s most advanced atomic-scale manufacturing platform. Maksym is the inventor of the first-ever atomic layer advanced manufacturing technology, enabling atomic-precision development of materials, devices, and microsystems. A scientist with a Ph.D. in Nanotechnology, he has deep expertise in nanotechnologies, renewable and exponential technologies, semiconductor processing, solid-state physics, and material science. A Fulbright scholar, Hello Tomorrow Grand Winner, and proud Ukrainian, Maksym has earned global recognition for his work.

Company Profile

ATLANT 3D has mastered control of matter at the atomic scale, ushering in a new era in manufacturing. For research teams and manufacturers working at the frontiers of technology, we’ve created what was once thought unattainable: a system that builds materials and devices, atom by atom, with unprecedented precision and speed.
While others are constrained by traditional manufacturing limits, our breakthrough technology makes it possible to create the seemingly impossible, from next-generation quantum computers to devices that can operate in the harsh conditions of space. By replacing complex, resource-heavy processes with precise atomic-scale fabrication, we’re transforming technology while making manufacturing sustainable. We’re providing innovative teams the power to build technologies today that will define tomorrow’s world, using fewer resources to achieve greater possibilities.
Based in Copenhagen and London, with operations in the US, ATLANT 3D partners with research institutions and industrial companies to expand the boundaries of technological possibility.

ATLANT 3D is redefining microfabrication with its patented Direct Atomic Layer Processing (DALP®) technology. Our NANOFABRICATOR™ platform enables localized atomic layer processing for rapid material discovery, prototyping, and scalable device fabrication—bridging the gap from lab to fab.
Beyond hardware, we offer Pilot Projects and Joint Development Services to validate new materials and device architectures. A-HUB, our Microfabrication-as-a-Service (MaaS) centre, provides R&D teams with atomic-scale precision without the need for costly infrastructure.
From concept to fabrication, ATLANT 3D partners with academia and industry to drive next-generation innovations beyond conventional limits.

Speaker

Koichi Wakata

Dr. Lode Lauwers

Senior Vice President Business Development and Strategy

Imec’s nanoelectronics research platform: Collaborative approach for breakthrough innovations

Day 1 / 13:20 - 13:40

Day 1 / 14:40 - 15:00

Day 1 / 16:30 - 16:50

The cutting-edge semiconductors necessary for the evolution of AI are supported by advances in equipment and material technology. The emergence of chiplet package structures has led to increased complexity in packaging, making collaboration between materials manufacturers and equipment manufacturers more critical than ever.

Resonac, a co-creative chemical company that provides a variety of semiconductor materials such as CMP slurry, etching gas, materials for HBM, epoxy molding compounds, substrate core materials, and more, is advancing materials technology development through open innovation activities. Resonac has started a Packaging Solution Center to propose one-stop solutions for customers and has established the co-creative packaging evaluation platform “JOINT2” with leading companies to accelerate the development of advanced materials, equipment, and substrates for 2.xD and 3D packages. Furthermore, in 2025, the company launched the open innovation initiative “US-JOINT” in Silicon Valley, USA, and launched a new co-creation platform, “JOINT3,” in Japan to accelerate technology development through co-creation. This presentation will introduce Resonac’s co-creation strategies.

Panel Discussion: How Far Can Package and Substrate Scaling Go Beyond 2028?

Day 2 / 11:25 - 12:10

Biography

Hidenori Abe is CTO for semiconductor materials and Executive Director of Electronics Business Headquarters at Resonac. He leads R&D and strategy for electronic materials in semiconductors, substrates, and displays. Previously, Mr. Abe served as the head of the Electronics R&D Center and Packaging Solution Center, where he contributed to advanced packaging development through open innovation. Notably, in 2021, he directed the launch of JOINT2, a consortium targeting 2.xD and 3D packaging technologies. He received a master’s degree in chemical engineering from Tokyo Institute of Technology, Japan, and a master’s degree in the Executive MBA program from the University of Oxford, UK.

Company Profile

Resonac defines its purpose as “Change society through the power of chemistry.” Resonac aims to be a world-class functional chemical manufacturer, creating functions necessary for the times, supporting technological innovation, and contributing to the sustainable development of our customers. Resonac is Global Leading semiconductor materials supplier. In order to achieve technological innovation for solving various social issues, it is essential for us to make wide-ranging co-creative efforts with partners, and Resonac is open to collaboration including 1on1 co-development with any partner.
We have opened a Packaging Solution Center and are actively engaged in next-generation semiconductor co-creation activities through JOINT2 with many partner companies. Furthermore, starting this year, we will also seek co-creation opportunities in the United States by launching US-JOINT.

Speaker

Dr. Takashi Kariya

Corporate Vice President, Head of Lab.

The Future of Advanced Package for AI Application

Day 1 / 14:20 - 14:40

Advances in heterogeneous chip packages are needed to empower today’s device manufacturers to pursue tomorrow’s breakthroughs. Samsung Advanced Package Platform is to be introduced in terms of technology roadmap, challenges and opportunities for emerging high-end computing, memory and mobile applications.

Biography

Received PhD in Electronic Engineering from Tohoku university.
1991-2015
Ibiden Corporation
– Management for Package Substrate Development Leaded substrate technology pathfinding with major semiconductor IDM, Fab less, Foundry, OEMs more than 10 years.
2015-2022
TDK Corporation
– Management for Development and business operation of Thin film component and Module. Leaded cutting edge components, MEMS and embedded IC modules.
2022-
Samsung Japan Corporation, Device Solutions R&D Japan
– Head of Advanced Package Lab of Samsung Japan Corporation and also Corporate Vice President of Samsung Electronics Corporation.
– Launch Advanced Package lab in Yokohama and setting up R&D environment at MinatoMirai.

Company Profile

Samsung Electronics Co., Ltd. engages in the manufacturing and selling of electronics and computer peripherals. The company operates through following business divisions: Consumer Electronics, Information Technology & Mobile Communications and Device Solutions. The Consumer Electronics business division provides cable television, monitor, printer, air-conditioners, refrigerators, washing machines and medical devices. The Information Technology & Mobile Communications business division offers handheld products, communication systems, computers and digital cameras. The Device Solutions business division comprises of memory, system large scale integrated circuit and foundry. The company was founded on January 13, 1969 and is headquartered in Suwon, South Korea.

Speaker

Dr. Christophe Maleville

Chief Technology Officer and Senior Executive Vice President of Soitec’s Innovation

Smart Materials, Smarter Systems: Enabling 3D Integration with Engineered Substrates

Day 2 / 14:35 - 14:45

The semiconductor industry is entering a decisive phase where traditional 2D scaling is no longer sufficient to sustain performance, energy efficiency, and cost targets. The path forward lies in 3D integration, where materials innovation and substrate engineering play a pivotal role. At Soitec, our mission is to provide the foundational technologies that make this transition possible.

Day 1 / 08:40 - 09:00

Panel Discussion: Workforce of the Future: Building, Training, and Inspiring Semiconductor Talent for Long-Term Competitiveness for Japan

Day 2 / 15:55 - 16:35

Biography

Salah Nasri is the CEO and Co-Founder of the International Semiconductor Industry Group (ISIG), a global organization founded in 2010 that connects and empowers semiconductor decision-makers through strategic leadership platforms, executive summits, and collaborative initiatives. ISIG has become a trusted global hub for industry leaders driving innovation and progress across the semiconductor value chain.
With extensive experience across the semiconductor sector, Salah has played a pivotal role in fostering global collaboration among industry leaders. Under his leadership, ISIG has evolved into one of the most influential communities in the semiconductor ecosystem—bringing together executives, innovators, and policymakers across regions including the United States, Europe, Asia, and the Middle East.
Salah has been instrumental in expanding ISIG’s reach and impact, curating high-level summits and initiatives that drive dialogue and progress across critical areas such as semiconductor manufacturing, AI, MEMS, automotive electronics, and advanced packaging. His vision continues to position ISIG as a key platform for thought leadership, networking, and strategic industry alignment.
Earlier in his career, Salah held positions at Credit Suisse, Goldman Sachs, Worldwide Business Research, and the International Business Development Group. He studied International Relations and Economics at Oxford University and Loughborough University, and in 2024 became a Stanford University alumnus after completing the Stanford Executive Program. In addition to his role at ISIG, Salah also serves on the Advisory Board of Atlant3D, a pioneer in atomic-layer advanced manufacturing solutions.

Company Profile

Established in 2010, the International SemiconductorIndustry (I.S.I.G.) is a prestigious & trusted associationwithin the semiconductor industry, renowned fororchestrating major regional summits across the globe,ranging from the U.S, the Middle East & Asia via ourdivision, the International Semiconductor ExecutiveSummits (I.S.E.S.). Our summits are fully endorsed bylocal governments and leading companies in all areas ofthe semiconductor supply chain.
Moreover, I.S.E.S. serves as the Premier platform for senior executives in technology, manufacturing, and R&D from diverse semiconductor companies, technology providers, and affiliated industries.
Our events are instrumental helping to shed light onto key industry trends, drive innovation and influence key decisions to help shape, and advance the growth of the semiconductor sector.

Panelist

Dr. Nahomi Aoto

Professor by Special Designation

Panel Discussion: Workforce of the Future: Building, Training, and Inspiring Semiconductor Talent for Long-Term Competitiveness for Japan

AI and semiconductors are one of the 17 strategic industries under the growth strategy of the new Takaichi Administration.

Ministry of Economy, Trade and Industry (METI) has been advancing policies based on the Semiconductor and Digital Industry Strategy formulated in 2021 and revised in 2023. In the semiconductor sector, Japan aims to achieve a total domestic semiconductor industry sales of over 15 trillion yen by 2030.

To reach this goal, efforts are underway to secure a robust semiconductor manufacturing base, establish production technologies for next-generation semiconductors including 2nm logic chips, and develop future technologies such as photonics-electronics convergence that have the potential to be game-changers.

This presentation will provide an overview of the latest developments in Japan’s semiconductor strategy, as well as the role of semiconductors in Japan-U.S. relations and strategic investment initiatives.

Biography

Mr. Tomoshige NAMBU has served as the Director for IT Industry Division at the Ministry of Economy, Trade, and Industry (METI) in Japan since July 2025. He leads METI’s AI and semiconductor strategy.
Prior to his current position, he spent 3.5 years in NYC and Washington D.C. from December 2021 to June 2025, serving as Special Advisor for METI at the New York Office of the Japan External Trade Organization (JETRO). He was a senior METI representative in the US, covering trade and economic security policies.
During a more than 20-year career at METI, Mr. Nambu has held responsibilities across a diverse range of public policy areas. He was involved in the formulation of Japan’s economic policy in 2018-2021 as the Director for Macroeconomic Policy at METI. He also assumed the duty of Cabinet Counselor, drafting policy proposals on economic growth strategy under the direction of the Prime Minister’s office.
He was stationed in Washington D.C. as the Trade Attaché at the Embassy of Japan in the U.S. from 2012 to 2015 and worked on several bilateral trade issues such as TPP and energy exports from the U.S.
He joined METI in 2002 after receiving a Bachelor of Law from the University of Tokyo. He also holds an L.L.M from Harvard Law School. He served as the Asia Program Fellow at the Rajawali Foundation Institute for Asia in Harvard Kennedy School in 2009-2010. He currently lives in Tokyo with his wife.

Company Profile

METI has been transforming itself to respond to the needs of the times.
METI has a history of responding to the changing needs of society. Therefore, its history is the history of Japan’s progress.
In 1949, the Ministry of Commerce and Industry was reorganized and the Ministry of International Trade and Industry was established. Its internal subdivisions consisted of eight bureaus: Minister’s Secretariat, Trade Bureau, Trade Promotion Bureau, Enterprise Trade Bureau, Textile Trade Bureau, General Merchandise Trade Bureau, Machinery Trade Bureau, Chemical Trade Bureau, and Iron and Steel Trade Bureau.
In addition, four agencies, the Resources Agency, Small and Medium Enterprise Agency, Industrial Technology Agency, and Patent Office; eight regional trade and industry bureaus; and four regional coal bureaus were established as external subdivisions.

Panelist

Hitoshi Wakabayashi

Professor

Panel Discussion: Workforce of the Future: Building, Training, and Inspiring Semiconductor Talent for Long-Term Competitiveness for Japan

Day 2 / 15:55 - 16:35

Biography

He is the Leader and Professor of Integrated Green-niX+ Research Unit, Institute of Integrated Research (IIR), Institute of Science Tokyo. He has joined the Tokyo Tech since 2013 after NEC Corp., MIT and Sony Corp. He also serves as the Research Supervisor of JST-PRESTO on Information Carriers and Their Integrated Materials/Devices/Systems, the Deputy Leader of Device Technology Division, Leading-edge Semiconductor Technology Center (LSTC), and Associate Member of Science Council of Japan. He had served as the Director of Research Institute for the Earth Inclusive Sensing (2018-2022) and the Member of the Education and Research Council (2022-2023) in Tokyo Tech. He had also engaged in the Research Representative at JST-CREST, the Directors of JSAP (2019-2020), JIEP (2019-2020) and Japan MOT Society since 2019. He had served as the Chairs in Symposium on VLSI Technology 2013, IEEE/EDTM 2018, IEEE/IWJT (2017/2019/2021/2023) and IEEE/EDS/VLSI Technology & Circuits Committee (2020-2022).

Company Profile

Institute of Science Tokyo (former Tokyo Institute of Technology)

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2025 Speakers

Terushi Shimizu

Director and Chairman

Norishige (Noly) Morimoto

Vice President and Chief Technology Officer

Hiroshi Iwatsubo

CTO and Executive Deputy President

Dr. Deepak Kulkarni

Senior Fellow Advanced Packaging

Dr. Rahul Manepalli

Intel Fellow & Vice President : Advanced Packaging Technology Development

Dr. Kazunari Ishimaru

Senior Managing Executive Officer & CTO, IEEE Fellow

Yasushi Araki

Corporate Officer

Kinya Ichikawa

Technical Director

Nelson Fan

VP of AP Product Portfolio Management and Business Development

Dr. Maksym Plakhotnyuk

CEO & Founder