23 April
Silicon Valley
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Dr. Sanad Bushnaq is a semiconductor and microchip technology expert with a track record of world-first chips. With more than 15 years of experience spanning industry and academia, his groundbreaking inventions at the nanometer–scale shaped the evolution of modern memory and logic chips, driving innovation at Toshiba Memory (Japan) – now Kioxia Corp- , MIT (USA), and Intel (USA). Dr. Bushnaq was vital in developing several cutting-edge breakthroughs, with over 25 patents and publications for his inventions in the world’s first 48-layer 3D flash chip, the world’s first 96-layer 3D flash chip, and the world’s fastest flash memory chip developed by Toshiba in Japan.
Dr. Bushnaq pioneers strategies and solutions that break the conventional trade-off between chip’s performance, power consumption and its area. He led multi-disciplinary design and verification teams across analog, digital, mixed-signal domains to deliver next-generation chips and IPs. Dr. Bushnaq achieved first-time-right silicon with use of AI in chip design, automation techniques, and rigorous sign-off methodologies that prioritizes quality, completeness and on-time deliveries.
With deep ties in the region and impact at the highest levels that strengthened ties between the far East, far West and the Middle East. He has served as an advisor to the president of the Royal Scientific Society in Jordan, HRH Princess Sumaya Bint El Hassan, an advisor to the Board of Trustees of Princess Sumaya University for Technology, and an advisor to Japan Science and Technology Agency. He built relationships between institutions in the region and global semiconductor companies, including initiating a fully-funded scholarship program to dispatch students from Jordan to train in Toshiba in Japan. In 2017, Dr Bushnaq received a royal recognition from His Majesty King Abdullah II Ibn Al Hussein at the 8th World Science Forum, organized by UNESCO, the International Science Council and the Royal Scientific Society of Jordan.
Dr Bushnaq was born and raised in Jordan, before he moved to Japan in 2007. He obtained his Masters and PhD degrees in Electrical Engineering from the University of Tokyo.

•An Electronics and Communication engineer, self-motivated and business professional with over 35 years of experience across industries, cross cultures in various roles & responsibilities and multi-geographic locations.
•Raghu started his career from Semiconductor Complex Ltd.,(SCL, a govt Fab) in 1991 for 10years as R&D engineer. Then as Country Manger for Mentor Graphics (now Siemens EDA) for 20years. Before Kaynes, Raghu was with Tessolve Semiconductor for 3years running the APAC business.
Kaynes Semicon Private Limited, a proud subsidiary of Kaynes Technology India Limited, is leading the charge in India’s semiconductor revolution. With over 35 years of expertise in end-to-end electronics manufacturing services, Kaynes Technology has built a legacy of innovation, quality, and excellence.
Kaynes Semicon marks a historic milestone as the first company in India to package semiconductor chips, a breakthrough that significantly enhances the nation’s capabilities in advanced electronics and manufacturing.
As India accelerates towards self-reliance in the semiconductor sector, in alignment with the Make in India and Atmanirbhar Bharat initiatives, Kaynes Semicon is positioned at the forefront of innovation. With state-of-the-art facilities and a future-focused vision, we are set to transform the semiconductor packaging and testing ecosystem, driving India’s emergence as a global hub in semiconductor technology.

Weiping Li is a seasoned executive in the semiconductor and IT industry with vast experience both in the US and China. He founded Yibu Semiconductor in 2020 that pioneered Si bridge chiplet packaging in China. Prior to that, he served as the Senior Vice President with Unigroup and was the Chairman of the Board of its subsidiary, Unimos. He was Vice President of Jiangsu Changjiang Electronics Technolgy (JCET) for 8 years before Unigroup. He also worked in the US at Amkor, Motorola SPS and Delphi Delco in R&D and product management roles.
Weiping Li held a Ph.D. degree from Georgia Institute of Technology in Materials Science and Engineering. He received the “Extinguished Alumni in Engineering Award” from the same school in 2012. He has over one hundred of patents and numerous technical and industrial publications/talks in electronics packaging.
Established in 2010, the International SemiconductorIndustry (I.S.I.G.) is a prestigious & trusted associationwithin the semiconductor industry, renowned fororchestrating major regional summits across the globe,ranging from the U.S, the Middle East & Asia via ourdivision, the International Semiconductor ExecutiveSummits (I.S.E.S.). Our summits are fully endorsed bylocal governments and leading companies in all areas ofthe semiconductor supply chain.
Moreover, I.S.E.S. serves as the Premier platform for senior executives in technology, manufacturing, and R&D from diverse semiconductor companies, technology providers, and affiliated industries.
Our events are instrumental helping to shed light onto key industry trends, drive innovation and influence key decisions to help shape, and advance the growth of the semiconductor sector.

Seasoned ICT M&A professional leading the Investments for Ithca, branch of the Omani Sovereign Fund OIA, focussed on emerging tech.
ITHCA Group (formerly knows as Oman Information and Communication Technology Group) was established in 2019 to play a key role in ensuring that the investments focus on supporting the technologies of the 4th industrial revolution as well as investing in the necessary infrastructure to achieve this goal. Soon after its inception, ITHCA integrated companies like Oman Broadband, Oman Technology Fund, Oman Towers and Space Communications Technology under its umbrella. After obtaining the approval for the Group’s Strategy in the same year, ITHCA signed in for strategic investment in 2020 with Oracle for building a complete cloud services system as well as with Onsor Technologies. 2021 saw the official launch of Withaq Services, which was basically centralizing the support services.
The core functionalities of ITHCA are to actively work on building Oman’s IT infrastructures, up-scale its networks and enhance Oman’s digital capabilities. Guided by the dictum of accelerate, integrate and centralize, ITHCA would scale up data center/cloud facilities, build up cybersecurity infrastructure, enhance centralized digital capabilities and expand hub for telecom interconnections.

Allan Zhou holds a Ph.D. in Chemistry and Materials Science from the University of Connecticut, USA.
He has served as CEO of Shanghai GTA Semiconductor Co., Ltd., Professor at Fudan University, Distinguished Professor and Adjunct Dean of the School of Excellence in Engineering at Shanghai Dian Ji University, Senior R&D Scientist at Applied Materials Inc. (USA), as well as Senior R&D Manager, Fab Director of Large-Scale Manufacturing, and Senior Director of the Operations Center at Semiconductor Manufacturing International Corporation (SMIC).
With extensive expertise in the engineering principles and methodologies of large-scale production for semiconductor micro-nano devices, he has dedicated his career to the research, development, and industrialization of intelligent manufacturing equipment and materials for semiconductor micro-nano devices—particularly focusing on the large-scale industrialization of domestic semiconductor equipment and materials in China. He is recognized as one of the key pioneers in the large-scale industrialization of copper interconnect technology for semiconductor integrated circuits in China.
He has been awarded the 1st Level Prize of the Shanghai Science and Technology Progress Award, published over 20 academic papers, and holds 21 international patents.
He has been selected as a National and Shanghai Distinguished Expert (Innovation Category), honored as an Outstanding Entrepreneur of the Year by China Electronics Corporation (CEC), and received the inaugural Shanghai Outstanding Talent Award.

Naso Tech founded in 2018, has been focused on designing and manufacturing high-end equipment for advanced materials. Our core team members are from University of Cambridge and well- known industry firms, who bring strong and wealth of expertise to the company.
We are experienced in the field of advanced semiconductor manufacturing equipment, including chemical vapor deposition (CVD), metal organic chemical vapor deposition (MOCVD), Atomic Layer Deposition(ALD) and ETCH(etching).
CVD:NASO TECH’s SiC Epitaxial Reactor is a specialized equipment designed for the epitaxial layer growth—a core process in silicon carbide chip production. This step is critical for manufacturing diodes and power semiconductor devices.
PVD:NASO TECH’s PVD Equipment primarily deposits various metallic and non-metallic thin films on wafer surfaces during semiconductor fabrication. It plays a key role in forming essential conductive pathways, electrode contacts, and protective barriers or integrated circuits.
ALD:NASO TECH’s ALD System is used in perovskite solar cell manufacturing for depositing high-quality functional layers with extreme uniformity and conformity—such as electron transport layers (ETL) and interface passivation layers. It addresses critical challenges in cell stability and efficienc.


Wilson Hong, Chair of ISIG China, Partner and CTO of Wuxi Leapers Semiconductor. He has 20 years R&D experience on power electronic engineering, software engineering, electric drive system and high voltage architecture in EV.
He used to be senior director in NIO, built the power electronic and software team from 1 person in 2015 to ~200 people in 2023. He led the team to deliver over 1.6 million inverters with several classes and different semiconductors, incl. first highest NEDC efficiency SiC Inverter, first 3-in-1 240kW IM system, first 3-in-1 160kW PM system and 4-in-1 HV ECU.
He hold over 50 power electronic, software, electric drive system patents cross China, US and EU. He won the first Prize and second Prize of Science and Technology Progress of China Association of Automobile Manufacturers in 2021 and 2024.
He is now working on power module advanced packaging, super charging and AI power.
Wuxi Leapers Semiconductor Co., Ltd. brings together experienced professionals at home and abroad, including wafer process and device design, module packaging design, product application, marketing and product operation. Major products include high-reliability SiC and IGBT modules for new energy vehicles and industrial applications. Products are used in new energy vehicles, smart grids, renewable energy, industrial motor drives, medical equipment, power supplies and other scenarios and fields; the company is headquartered in Wuxi, China, and has a research and development center in Japan.We adopts innovative packaging materials and processing technology to provide complete module application solutions for the miniaturization, efficiency and light weight of electric drive systems and inverters for new energy vehicles. Meet the needs of high-performance, high-reliability new energy vehicles and high-end industrial power semiconductor modules.


Xi’an Longding Investment Management Co., Ltd. (referred to as “Longding”) was established in 2014. It is a high-end investment management company focused on the needs of national development, with “finance” and “industry” as the core drivers, focusing on hard technology tracks such as semiconductors, new energy, and information technology.
西安龙鼎投资管理有限公司(简称“龙鼎投资”)成立于2014年,是一家以国家发展需求为核心导向,以“金融”+“产业”为核心引擎,专注半导 体、新能源、信息技术等硬科技赛道的精品投资管理公司。
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