Dr. Bill En
CVP, Foundry Technology and Operations
Biography
26 years of experience in the Semiconductor Industry ranging from silicon wafer R&D, process technology, circuit design and foundry technology with over 65 patents and 30 publications. He graduated from Univ. of California Berkeley with a Ph.D in Electrical Engineering and Computer Sciences in 1996. He is currently Corporate Vice President at Advanced Micro Devices overseeing Foundry technology from initial R&D through production for all AMD products.
Company Profile
For 50 years, AMD has driven in high-performance computing, graphics, and visualization technologies – the building blocks for gaming, immersive platforms, and the datacenter. Hundreds of millions of consumers, leading Fortune 500 businesses and cutting-edge scientific research facilities around the world rely on AMD technology daily to improve how they live, work and play. AMD employees around the world are focused on building great products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit AMD (NASDAQ:AMD) on their website, blog, Facebook and Twitter pages.
Walter Chen
SVP, Greater China Sales & Marketing
Biography
Walter joined Amkor in 2020 and currently serves as Senior Vice President of Sales & Marketing for Greater China. Before Amkor, he spent 17 years at Cree, Inc., where he was Vice President of Global LED Chips Marketing and LED Component Marketing for Asia. He also represented Cree as a Board member at Lextar. Walter’s career includes 6 years at an IC design house, bringing his total semiconductor industry experience to 28 years, primarily in Sales & Marketing. He holds a Master’s degree in Engineering Business Management from the University of Warwick, UK.
Company Profile
Amkor Technology, Inc. is the world’s largest US headquartered OSAT (outsourced semiconductor assembly and test). Since its founding in 1968, Amkor has pioneered the outsourcing of IC packaging and test services and is a strategic manufacturing partner for the world’s leading semiconductor companies, foundries, and electronics OEMs. Amkor provides turnkey services for the communication, automotive and industrial, computing, and consumer industries, including but not limited to smartphones, electric vehicles, data centers, artificial intelligence and wearables. Amkor’s operational base includes production facilities, product development centers and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the United States. Learn more at https://amkor.com
Jian Zhang
VP, Engineering
Biography
Jian is a semiconductor industry veteran with more than 25 years of experience in process technology development, foundry operations, product engineering. Jian has extensive experience in leading and integrating global teams from various regions and businesses, having spent more than a decade in the U.S. and Asia.
Jian is the Vice President in Qualcomm, leading the Product Test Engineering (PTE) in APAC, responsible for new product test development, characterization, and test deployment, yield management, integrating and optimizing performance for all products across the BUs. She also oversees technical and management coordination with the PTE teams in the U.S.
Prior to Qualcomm, Jian served as VP of technology at NXP, responsible for technology roadmap planning and execution, both for in-house fabs and foundries. She also partnered with foundry and internal teams to ensure all new products and foundry processes would meet the automotive quality requirements and work
Jian held various management positions, including Global Foundries and Hewlett Packard. She holds master’s and bachelor’s degree in Electrical Engineering from Purdue University
Company Profile
Qualcomm is the world’s leading wireless technology innovator and the driving force behind the development, launch, and expansion of 5G. When we connected the phone to the internet, the mobile revolution was born. Today, our foundational technologies enable the mobile ecosystem and are found in every 3G, 4G and 5G smartphone. We bring the benefits of mobile to new industries, including automotive, the internet of things, and computing, and are leading the way to a world where everything and everyone can communicate and interact seamlessly.
Albert Lan
Global Packaging Account TD Head
Biography
Experience:
- Over 30 years of job experience in semiconductor industry, especially focusing on advanced packaging technologies.
- Senior Engineering Center RD Head, 13 years, SPIL, which is top 3 biggest assembly house in the world.
- PD, Quality, & Sales, 5 years, Amkor Taiwan(Bumping)
- Vice Chairman of SEMI Taiwan PKG&TEST Committee.
- Executive Co-Chair – PKG Committee of IMPACT / TPCA.
- Chairman of TILA (Taiwan Intelligent Leader Association).
Company Profile
We are the leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. Our expertise in modifying materials at atomic levels and on an industrial scale enables customers to transform possibilities into reality. At Applied Materials, our innovations Make Possible® a Better Future.
Stephen Coates
GM & VP Global Operations
Biography
Stephen has previously held executive level engineering & operations roles in silicon & compound semiconductor & displays technology companies including VP Operations at DigiLens, VP Operations at Symmorphix Thin Films Inc, VP Operations at Fultec Semiconductor Inc/Bourns & VP Production Engineering at MaxQ Technology heading up power module design & manufacture. A seasoned technology executive with 30 years’ experience in engineering, manufacturing operations, supply chain management and quality. Stephen has substantial experience in establishing and developing strategic supply chain relationships to support full product commercialization and high volume manufacturing, while also being an expert in device packaging, process development and integration. Stephen also previously held lead assessor qualifications for 3rd party audit to ISO 9000 & equivalent standards (eg TS16949/AS9100).
Company Profile
Ian Chan
CTO & Managing Director
Biography
Education
- PhD EECS, University of Michigan USA (1992)
Professional Experience:
- CEO, Episil Holding Inc. (2013-2016)
- CSO, Hermes-Epitek (2016-2018)
- Independent Director, UNIVERSAL CEMENT CORPORATION(2017~ )
- CTO&Managing Director, Cyntec Co., Ltd. (2019~ )
- Chairman, Power Forest Technology Corporation(2019~ )
- Independent Director, Excelliance MOS Corporation(2021~ )
Company Profile
Since 1991 Cyntec’s team of scientists and engineers have been known to lead the way in the research and development of the miniaturized and highly integrated products and solutions. The product lines consist of magnetic components, passive components, power modules, RF & optical modules which serve the client, cloud computing equipment, automotive, IOT, industry, and other market segments.
Using our insight into market trends and the in depth knowledge of electronic materials and processes, we have been able to produce a wide variety of products with the highest levels of performance, high power handling, high density packaging and tight accuracy.
Bruce Lu
VP Asia Technology
Biography
Bruce Lu joined Goldman Sachs in 2018 as a Vice President and works in the Global Investment Research team where he is responsible for covering Asia technology stocks. He previously worked at Barclays, HSBC and CLSA, with a combined experience of 17 years in equity research covering semiconductor industry. Prior to equity research, Bruce worked at UMC, Applied Materials and JAFCO Asia as a senior investment manager. Bruce has a Master’s degree in Mechanical Engineering from Cornell University.
Company Profile
The Goldman Sachs Group, Inc. is a leading global financial institution that delivers a broad range of financial services to a large and diversified client base that includes corporations, financial institutions, governments and individuals.
Founded in 1869, the firm is headquartered in New York and maintains offices in all major financial centers around the world.
Dr. Wei-Chung Lo
Deputy General Director, Electronic & Optoelectronic System Research Laboratories (EOSL)
Biography
Dr. Lo received his Ph.D. from National Taiwan University and joined Industrial Technology Research Institute to work in advanced electronic packaging, such as WLP, 3D IC/3D stacking, fan-out, heterogeneous integration technology for more than 20 years, 85 papers and 40 patent granted. Currently, he also serves as TWG chair of IoT Chapter of IEEE Heterogenous Integration Roadmap(HIR) and chairman of International Microelectronics Assembly and Packaging Society (IMAPS)-Taiwan chapter.
Company Profile
ITRI is a world-leading applied technology research institute with more than 6,000 outstanding employees. Its mission is to drive industrial development, create economic value, and enhance social well-being through technology R&D. Founded in 1973, it pioneered in IC development and started to nurture new tech ventures and deliver its R&D results to industries. ITRI has set up and incubated companies such as TSMC, UMC, Taiwan Mask Corp., Epistar Corp., Mirle Automation.
Dr. Kuan-Neng Chen
Dean/Chair Professor
Biography
Dr. Kuan-Neng Chen is Dean of International College of Semiconductor Technology and Chair Professor at Institute of Electronics at National Yang Ming Chiao Tung University (NYCU) in Taiwan. He received his Ph.D. degree in Electrical Engineering and Computer Science, as well as his M.S. degree in Materials Science and Engineering, both from Massachusetts Institute of Technology (MIT). Dr. Chen has held several prominent positions including Vice President for International Affairs, Associate Dean of International College of Semiconductor Technology at NYCU, Program Director of the Micro-Electronics Program at National Science and Technology Council in Taiwan, Adjunct R&D Director at Industrial Technology and Research Institute (ITRI), and Research Staff Member at IBM Thomas J. Watson Research Center.
Dr. Chen has received numerous awards and honors throughout his career, including IEEE EPS Exceptional Technical Achievement Award, IMAPS William D. Ashmon – John A. Wagnon Technical Achievement Award, National Industrial Innovation Award, MOST/NSTC Outstanding Research Award (twice), MOST/NSTC Futuristic Breakthrough Technology Award (twice), Pan Wen Yuan Foundation Outstanding Research Award, CIE Outstanding Professor Award, CIEE Outstanding Professor Award, and IBM Invention Achievement Awards (5 times). He has authored over 400 publications, including 3 books and 7 book chapters, and holds 88 patents. Dr. Chen served as Guest Editor for the MRS Bulletin, IEEE Transactions on Components, Packaging, and Manufacturing Technology, and Materials Science in Semiconductor Processing, and has held leadership roles in various conferences and committees, such as IEEE IITC General Chair. Dr. Chen is Fellow of National Academy of Inventors (NAI), IEEE, IET, IMAPS, and CIEE and member of Phi Tau Phi Scholastic Honor Society.
Additionally, Dr. Chen is Specially Appointed Professor at Institute of Tokyo Science (previously Tokyo Tech). His current research interests focus on three-dimensional integrated circuits (3D IC), advanced packaging, and heterogeneous integration.
Company Profile
3DIC Lab is led by Prof. Kuan-Neng Chen. The research topics include three-dimensional integrated circuits (3D IC), heterogeneous integration, and advanced packaging technology. As the scaling of transistor size faces its physical limits, 3D IC becomes the mainstream candidate to extend “Moore’s Law” and fulfill “More than Moore” applications. The vision is to demonstrate a highly prolific spirit of innovation in creating or facilitating outstanding inventions. The research goal is to make a tangible impact on the quality of life, economic development, and the welfare of society. The members firmly believe 3D IC is the key to leading semiconductor technology and electronic applications in the future innovation.
The research team and Prof. Kuan-Neng Chen have published more than 440 publications, including 3 books and 7 book chapters, and holds 91 patents. Attributed to our innovation and diligence, many of our significant research achievements have been published in IEDM, VLSI, and ISSCC. In addition to our outstanding academic achievements, 3DIC Lab has strong relationship with industries world-wide. Through the formats of joint development project (JDP) and non-exclusive technology transfer, 28 worldwide companies have benefited and further upgraded their technology and products. As a global leading research team in 3D IC field, 3DIC Lab collaborates world-wide universities, research institutes, and companies!
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