Claudionor N. Coelho is the Chief Artificial Intelligence Officer and SVP of Engineering at Advantest, being responsible for AI strategy for Advantest and leading engineering for ACS.

Previously, he was the VP/Fellow for AI – Head of AI Labs at Palo Alto Networks, where he led AI and Neurosymbolic innovation for AIOps products at Palo Alto Networks. He also led the creation of next-generation time series analysis tools at scale (MLOps on GCP) integrated with knowledge graphs and formal technology.

He worked on Machine Learning/Deep Learning at Google. He is the creator of QKeras, a Deep Learning package for quantization on top of Keras with support for automatic quantization, being used by CERN (which made it to the cover page of Nature Machine Intelligence in August 2021). He was the VP of Software Engineering, Machine Learning, and Deep Learning at NVXL Technology. He did seminal work on AI at Synopsys Inc, and he opened the site for Cadence Design Systems in Brazil, being the GM for the site, following the acquisition of Jasper Design Automation, where he was the Worldwide SVP of R&D. Under his leadership, Jasper was awarded one of the most innovative companies in the US in 2013, according to Red Herring.

He created the initial strategy for Kunumi (when he was an angel investor), and he is an investor and is on the TAB of ConDati. He has more than 100 papers, patents, academic, and industry awards. He is currently an Invited Professor for Deep Learning at Santa Clara University, and previously, he was an Associate Professor of Computer Science at UFMG, Brazil, when he took the ACM Programming Contest to the Southern Hemisphere. He has a Ph.D. in EE/CS from Stanford University, an MBA from IBMEC Business School, and an MSCS and BSEE (summa cum laude) from UFMG, Brazil.

Len Tedeschi is vice president and general manager, Core Packaging Products at Applied Materials. Len is directly responsible for the Metals Packaging Products (MPP), Packaging Plating & Cleans (PPC), Tango & Plasma Dicing product groups. His focus is ensuring customers are successful with their current products, while simultaneously solving customer’s future high value problems.

Len has worked at Applied for >20 years and has over 27 years of semiconductor experience in roles ranging from product development & support, productivity, technical strategy, marketing, and general management. Len has worked with a variety of products and technologies including etch, deposition, lithography, metrology, and inspection.

Prior to joining Packaging, Len spent 14 years in Applied’s Etch Business Unit in a wide variety of customer focused positions. Len has >10 patents granted, mainly as the lead author.

Len began his career in 1995 as a lithography equipment engineer at IDT in Santa Clara, California.

He earned a bachelor of science degree in industrial technology from San Jose State University in 1995, where he served as captain of the university’s judo team, winning two collegiate national titles, and competing in the 1996 Olympic Judo Trials.

Jon Hander is Assistant Vice President of Panel Products for ASM NEXX. He has worked at NEXX since 2011 and in the semiconductor industry since 1996. In his career, Jon has served in manufacturing, service, process, sales, development & product management roles. Jon has a BS in Engineering Technology from Texas A&M University.

Enrico Haertel is the Director of Global Key Account Management at Comet YXLON. Focusing on x-ray inspection tasks, he is working with customers on solutions to reduce time-to-market and increase yield.

He began his career in the FinTech industry, introducing, among others, contactless payment technology into the European market. Then, switching gears in 2011, he joined the field of inspection solutions for the Semiconductor and SMT world, gaining expertise in testing solutions like wafer probe cards and optical and x-ray inspection.

Ramin Farjadrad, president and co-founder of Eliyan Corporation. Ramin, a previous speaker at ISES, is the founding CEO of Eliyan, a start-up focused on addressing interconnect challenges in multi-die architectures. He is the inventor of over 140 granted and pending patents in communications and networking and has a successful track record of creating differentiating connectivity technologies adopted by the industry as international standards (including two Ethernet standards at IEEE, and the BoW chiplet connectivity adopted by OCP.) Prior to Eliyan, Ramin co-founded Velio Communications, which led to a Rambus/LSI Logic acquisition, and Aquantia, which IPO’d and was acquired by Marvell Technologies. Ramin has a Ph.D. EE from Stanford.

Mr. Chakrabarti is a Managing Director in the firm’s corporate advisory business focusing on the Technology sector.

Mr. Chakrabarti has advised leading technology firms and financial sponsors on M&A and capital markets transactions including Mobileye on its $961M IPO, NxEdge on its $850M sale to Enpro, AvePoint on combination with Apex Technology and subsequent public listing, Conservice on sale of TA Associates’ equity stake to Advent International, Conservice on its sale of majority stake to TA Associates, Enersys on the $750M acquisition of Alpha Technologies Group of Companies, Akamai on its defense and cooperation agreement with Elliott Management, Cobham on its $455M divestiture of AvComm and Wireless businesses to Viavi, Samsung on the $9B acquisition of Harman, Qualcomm on the $49B announced (and subsequently cancelled) acquisition of NXP Semiconductors, Sonus on a merger of equals with Genband, Siris Capital’s $943M acquisition of PGi, Cbeyond on its $323M sale to Birch, and financing of TPG led group’s acquisition of Cirque du Soleil.

Prior to Evercore, Mr. Chakrabarti was an Associate Director at UBS in their Technology, Media and Telecommunications Group in New York. He holds a MBA from Cornell University’s SC Johnson Graduate School of Management and a BA in Economics from University of Delhi, India.

Tom Stokes is a Senior Managing Director of Evercore’s corporate advisory business and co-leads the Technology Banking Group in New York.

Tom is focused on advising clients across the technology sector.

Prior to joining Evercore in 2015, Tom was a Managing Director in the Investment Banking Division at Goldman, Sachs & Co., where he served as global head of Electronics and Industrial Technology Investment Banking. With over 25 years of relevant experience and over 13 years at Goldman Sachs, Tom has extensive experience advising companies across the technology industry. In particular, he has advised on a number of the most notable recent transactions across the semiconductor, electronics and industrial tech subsectors. Clients represented by Tom include Advanced Energy, Aeroflex, Anaren, Amphenol, AZ Electronic Materials, Azenta, Belden, Brooks, CDW, Cobham, Corning, Dover, Dupont, Edwards, Entegris, Fortive, Freescale, IBM, Lam Research, Lexmark, Macom, Molex, Keysight, Koch Industries, TE Connectivity, Samsung, Sensata, Solectron, Tokyo Electron, Universal Display and Viasystems, among others.

Tom received his BA, MA and MEng degrees (First Class) in Engineering from Cambridge University and received his MBA degree from Kellogg School of Management.

Tal Levin serves as the Executive Vice President at Green Technology Investments LLC (GTi), headquartered in Scottsdale, Arizona, USA. GTI specializes in AMAT Metrology, encompassing a range of cutting-edge technologies such as SEMVision, Defect Review “DR-SEM,” VeritySEM, Critical Dimension SEM “CD-SEM”, and Compass & ComPLUS, Darkfield Inspection systems.

Having co-founded GTI in 2012, Tal has played a pivotal role in driving global sales initiatives until recently, when he shifted his focus to overseeing the technology roadmap and strategic procurement activities for both domestic and international clients.

In line with GTI’s growth strategy in 2023, the company underwent a transformation, establishing two distinct divisions: Metrex and RT-Ex. Additionally, GTI secured exclusive representation rights for the etrology™ software measurement solutions.

With over 32 years of experience in the semiconductor industry, Tal Levin is a seasoned executive with a profound understanding of semiconductor processes. His expertise extends to establishing and managing global service and sales networks, particularly in key regions such as China, Taiwan, and Southeast Asia.

Throughout his extensive career, Tal has held significant positions at notable companies including H.T.M., Norcimbus Inc., OEM Group, and GTI, where he and the team have developed several patent applications aimed at process enhancement and measurement refinement.

Tal Levin exemplifies excellence in management, strategic planning, and international business development within the semiconductor industry, serving as a benchmark for leadership and innovation.

Mario Morales is the group vice president of IDC’s enabling technologies, semiconductor, storage, and DataSphere research.

He is responsible for in-depth analysis, evaluation of emerging markets and trends, forecasting, and research of major semiconductor industry segments such as embedded and intelligent systems, wireless, personal computing, networking and cloud infrastructure, automotive electronics, and AI semiconductors.

BACKGROUND

Mr. Morales is an accomplished program vice president, manager, and industry expert with over 25 years of experience in building a multinational top-tier consulting, sales, and research team and driving a set of established businesses. Solid experience in managing strategic partnerships and advisory services with IDC’s largest multinational clients. Strong analytical, strategic planning skills, and managing complex projects involving strong collaboration across geographies, functional groups, and business units. Proven leadership skills and instrumental at establishing research and business KPIs.

Mr. Morales is a trusted advisor to leading high tech company executives, financial investors, and bankers on market landscape and direction, product and technology positioning, competitive benchmarking, M&A, HW, and SW technology, and brand health and sustainability. Established relationships with technology suppliers including Intel, Samsung, TSMC, Qualcomm, Huawei, HP, AMD, NVIDIA, Microsoft, Facebook, TI, Micron, UMC, SoftBank, ARM, NXP, and others.

Mr. Morales is the leading advisor and expert analyst for IDC’s largest Wall Street clients including investment banking, VC’s, and mutual and hedge funds across every major financial region.

Over his career, Mr. Morales has authored and co-authored over 240 reports and studies in the area of semiconductors, mobile, PC, wireless, embedded, IoT, and IT marketplace. His team is responsible for some of the most interesting and evolving tech in our industry including coverage of microprocessors, accelerated computing, storage, memory, sensors and connectivity. His team has been responsible for initiating coverage of emerging technologies for IDC, and driving new research business practices, and creating leading industry market models in DRAM, NAND, Embedded processors and controllers, AI ML architectures, cellular baseband modems, WiFi, cellular broadband, digital consumer, foundry, EMS, and intelligent systems.

His career includes past positions with NEC Electronics and Dataquest.

EDUCATIONAL ACCOMPLISHMENTS

• B.S. in Finance and Accounting from San Jose State University
• Fluent in English and Spanish
• Frequent presenter and advisor to CEOs and executive teams across his portfolio of clients
• Strong reputation as an advisor and industry expert on Wall Street
• IDC executive analyst for Intel and Qualcomm
• Frequent speaker, presenter, and moderator at IDC Directions events in Asia and semiconductor industy conferences including ISS, GSA, CASPA, CISES, and SEMI

Sri Samavedam is SVP of CMOS Technologies at imec since Aug 2019. His responsibilities include programs in logic, memory, photonics and 3D integration. Prior to that, he was senior director of technology development at Globalfoundries in Malta, NY, where he led qualification of 14nm FinFET technology and derivatives into volume production and early development of 7nm CMOS.

He began his research career at Motorola in Austin, TX, working on strained silicon, metal gates, high k dielectrics and fully-depleted SOI devices. He holds a Ph.D. in Materials Science and Engineering from MIT and a masters from Purdue University.

Shekhar Chandrashekhar has over 30 years’ experience as a leader, strategist, and innovator with a history of driving improvements that streamline operations, drive growth and increase profitability on a global scale.

Prior to joining iNEMI, Shekhar was responsible for managing the national network of Smart Manufacturing Innovation Centers (SMICs) for the Clean Energy & Smart Manufacturing Institute (CESMII). He has also worked with the American Society of Mechanical Engineers (ASME) as managing director, programs, for the association’s executive leadership team. Shekhar began his career as a member of technical staff of AT&T Bell Labs and held several management positions with Bell Labs/Lucent Technologies/Alcatel-Lucent, including senior manager for the Network Solutions Group and Bell Labs/Supply Chain Networks. He eventually became director of the company’s CTO Group, where he created the footprint for Global Engineering Centers.

He received the Advanced Technology Excellence Award from Bell Laboratories and the Outstanding Young Manufacturing Engineer Award from SME. He has published over 25 papers in international journals and conferences.

Darcy Renfro is Vice Chancellor of Community, Government Relations, & Economic Development for the Maricopa County Community College District (MCCCD). She oversees workforce and economic development strategies for MCCCD and advises the Chancellor on government and community affairs. MCCCD is one of the largest community college systems in the nation serving approximately 200,000 students and nearly 10,000 faculty and staff members across 10 colleges in the metropolitan Phoenix area. As part of the Chancellor’s executive team, Ms. Renfro is helping to lead the Maricopa Transformation to fundamentally transform the student experience to meet the education and employment needs of the community.

Prior to her current role, Ms. Renfro served as the policy advisor to Governor Janet Napolitano for workforce, economic development, and higher education, and was founding Director of The Arizona We Want Institute at the Center for the Future of Arizona where she was responsible for strategic direction and development of a series of “Progress Meters” to establish clear metrics for Arizona in achieving its citizens’ goals. She previously worked as the founding Director of the Arizona STEM Education Network at Science Foundation Arizona.

Ms. Renfro is a licensed attorney in Arizona and has practiced at the Phoenix offices of Fennemore Craig, P.C. Prior to law school, she worked on Capitol Hill for U.S. Senators Dennis DeConcini (AZ) and Howard Metzenbaum (OH).

Ms. Renfro is a native of Tucson and received both her undergraduate and Juris Doctor Degrees from the University of Arizona.

Wolfgang is a Distinguished Engineer in Marvell’s ASIC Business Unit. He works on advanced package solutions and chip interface definition for all ASIC products that require integration of multiple active components.

Before he started at Marvell Semiconductor, Wolfgang worked as a Packaging Engineer at IBM, and as a Customer Product Solutions Architect at Globalfoundries and at Avera Semi.

Wolfgang has authored more than 30 industry papers and publications, and holds more than 130 patents.

Edith Beigné is the Research Director of AR/VR Silicon at Meta Reality Labs where she leads silicon research projects driving the future of AR devices. Her main research interests are low power digital and mixed-signal circuits and design with emerging technologies. Over the past 20 years, she has been focusing her research on low power and adaptive circuit techniques, exploiting new design techniques and advanced technology nodes for different applications ranging from high performance multi-processors to ultra-low power SoC, and, more recently, AR/VR applications. She was the technical chair of ISSCC 2022 and part of ISSCC TPC since 2014, she was part of VLSI symposium TPC between 2015 and 2020. Distinguished Lecturer for the SSCS in 2016/2017, Women-in-Circuits Committee chair and JSSC Associate Editor in 2018. She visited Stanford University in 2018 to research on emerging technologies and new architectures.

For more than 35 years, Keith Best has held a range of semiconductor processing and applications positions for both device manufacturing and capital equipment companies, of which 13 years were with ASML where he held the position of Director, Applications Engineering. Most recently, Keith was Advanced Packaging Process Development Engineering Manager at SkyWater Florida. He is currently the Director of Product Marketing, Lithography, at Onto Innovation supporting the JetStep® advanced packaging lithography stepper. Keith holds a B.Sc. Honors Degree in Materials Science from the University of Greenwich, UK. He has numerous publications and holds 22 US patents in the areas of photolithography and process integration.

• Vice President of Advance Packaging Technology and Assembly Engineering Operations & Managing all IoT and Infrastructure (IIBU) support (~ $7B Rev) for Renesas World Wide.
• 35 Years in Semiconductor Industry
• Prior to being at Renesas, part of the Acquisition of IDT by Renesas(VP , Sr. Dir, Dir) , Maxim (now ADI), Cirrus Logic, and Allegro Microsystem.
• Hold BS in Mechanical Engineering & Mathematics from University of Massachusetts , Amherst.
• Hold More than 15 USA and International issued Patents, and have published several articles in Advance Packaging and Thermal management of Semiconductors.

Dr Yun Zhang, founder and CEO of Shinhao Materials LLC, has been active in materials innovation, R&D, marketing and sales for over 28 years, holding 34 granted patents, and numerous peer-reviewed journal publications and awards. She started her career at AT&T Bell labs in 1994, carrying out materials research and development. Her work on tin whisker growth won international recognition for demonstrating experimentally for the first time its driving force and for developing mitigation solutions. In 2002, she was appointed global R&D director by Cookson Electronics Enthone for its electronics business. In the subsequent 10 years, her insight and leadership in fundamental understanding of electrodeposition process at a molecule level, combined with a deep appreciation of technology trends and customer needs has won Dr. Zhang many friends and willing partners at top tier equipment manufacturers and key customers. Those close and collaborative partnerships resulted in win-win to all parties for RDL, copper pillar and TSV plating. She received a BS in chemistry from Nanjing University, and a PhD in chemistry from Brown University.

Mark is President and General Manager of TEL Manufacturing and Engineering of America (TMEA), a group company of Tokyo Electron Limited.

Prior to joining TEL in April 2020 he was the VP of module engineering and manufacturing operations at GLOBALFOUNDRIES Fab 8, where he led a 10X increase in manufacturing capacity, ramping production volume and yield to world class levels.

Mark spent over 20 years in IBM’s semiconductor unit, working as a process and integration engineer before holding progressively larger management responsibilities in module engineering, process control, manufacturing operations, and unit process development.

He holds a BS in Chemical Engineering from Clarkson University, where he was formerly a member of the Industry Advisory Board for the Center for Advanced Materials Processing (CAMP), and currently serves as the chair of the Dean’s Leadership Council for the Wallace H Coulter School of Engineering.

Mark and his wife Amy reside in Minneapolis, and have four children.