Dr. Mike Slessor
President and Chief Executive Officer
Biography
Michael D. Slessor has served as our Chief Executive Officer of FormFactor, Inc. since 2014, and as a Director since 2013. Mike served as President from 2013 to 2014, and as Senior Vice President and General Manager, MicroProbe Product Group from 2012 to 2013. Before joining FormFactor, he was President and Chief Executive Officer of MicroProbe from 2008 through the 2012 closing of FormFactor’s acquisition of MicroProbe. Prior to joining MicroProbe, he held various management, product-marketing, and applications-engineering positions in the semiconductor industry, primarily with KLA.
Mike received his Ph.D. in Aeronautics and Physics from the California Institute of Technology and his B.A.Sc. in Engineering Physics from the University of British Columbia.
Company Profile
FormFactor is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design debug, to qualification and production test. Semiconductor companies rely upon FormFactor’s products and services to accelerate profitability.
FormFactor’s leading-edge probe stations, probes, probe cards, advanced thermal subsystems, quantum cryogenic systems and integrated systems deliver precision accuracy and superior performance both in the lab and during production manufacturing.
Visit www.formfactor.com or follow us on LinkedIn.
Dr. Bonnie Tsim
Head of Strategic Initiatives and Growth
Biography
Dr. Bonnie Tsim is Head of Strategic Initiatives at ATLANT 3D and holds a PhD in Theoretical Physics on the electronic properties of twistronic graphene from the University of Manchester. With expertise across deep-tech strategy, advanced materials, and international ecosystem building, she has led AI strategy and digital transformation at Turner & Townsend and convened global stakeholders in exponential technologies such as quantum and semiconductors at MATTER.
Company Profile
ATLANT 3D has mastered control of matter at the atomic scale, ushering in a new era in manufacturing. For research teams and manufacturers working at the frontiers of technology, we’ve created what was once thought unattainable: a system that builds materials and devices, atom by atom, with unprecedented precision and speed.
While others are constrained by traditional manufacturing limits, our breakthrough technology makes it possible to create the seemingly impossible, from next-generation quantum computers to devices that can operate in the harsh conditions of space. By replacing complex, resource-heavy processes with precise atomic-scale fabrication, we’re transforming technology while making manufacturing sustainable. We’re providing innovative teams the power to build technologies today that will define tomorrow’s world, using fewer resources to achieve greater possibilities.
Based in Copenhagen and London, with operations in the US, ATLANT 3D partners with research institutions and industrial companies to expand the boundaries of technological possibility.
ATLANT 3D is redefining microfabrication with its patented Direct Atomic Layer Processing (DALP®) technology. Our NANOFABRICATOR™ platform enables localized atomic layer processing for rapid material discovery, prototyping, and scalable device fabrication—bridging the gap from lab to fab.
Beyond hardware, we offer Pilot Projects and Joint Development Services to validate new materials and device architectures. A-HUB, our Microfabrication-as-a-Service (MaaS) centre, provides R&D teams with atomic-scale precision without the need for costly infrastructure.
From concept to fabrication, ATLANT 3D partners with academia and industry to drive next-generation innovations beyond conventional limits.
Catherine Liu
Co-Founder
Biography
Catherine is the Co-Founder of Kelvin Cooling, which builds high-efficiency nano-film evaporation cooling solutions for data centers. She has a background in data engineering and product development and is passionate about turning advanced thermal technologies into scalable, real-world solutions. Catherine leads business operations, bridging deep-tech innovation with practical execution. She has had the opportunity to collaborate with researchers at UC Berkeley for further test validations. Catherine is deeply driven by sustainability and the need for energy-efficient cooling in next-gen computing. She also works closely with company partners and advisors to support customer discovery, fundraising, and strategic growth.
Company Profile
Bassel Haddad
SVP & General Manager, Advanced Packaging
Biography
Bassel Haddad is Sr Vice President and General Manager of Advanced Packaging at SkyWater Technology. He leads all aspects of SkyWater’s advanced packaging business including technology development, engineering, marketing and Florida fab operations. He is responsible for building and scaling the business serving both the defense and commercial market sectors. He is focused on strengthening collaborations with the advanced packaging ecosystem, such as equipment and material vendors, government partners and research institutes & consortia, while driving the growth trajectory of the business.
Before joining SkyWater, Haddad was with Intel since 2011 holding various engineering and business leadership roles. Most recently, he was the Vice President and General Manager of edge device and AI products, in the network and edge group. In this role, he managed a multi-billion dollar P&L, and leading innovations in edge AI and Internet of Things, or IoT. Earlier in his career, he held roles in platform architecture, silicon development, systems and software engineering, delivering leadership products to various end markets.
Haddad holds a Bachelor’s and Master’s degree in electrical engineering from Technion – Israel Institute of Technology. He is the inventor of five USPTO-issued patents in the areas of digital communication and systems architecture.
Company Profile
SkyWater Technology (NASDAQ: SKYT) is securing America’s silicon foundation as the largest U.S.-based, pure-play semiconductor foundry. A trusted partner to both commercial customers and federal defense programs, SkyWater’s Technology as a Service model empowers innovators to bring emerging technologies like quantum computing and next-generation systems from concept to reality. With state-of-the-art facilities in Minnesota, Florida, and Texas, SkyWater specializes in foundational nodes and advanced packaging to support the nation’s critical infrastructure, strengthen supply chain resilience, and ensure long-term U.S. technology leadership. SkyWater is a DMEA-accredited Category 1A Trusted Foundry. To learn more, visit www.skywatertechnology.com.
SkyWater provides secure, U.S.-based semiconductor manufacturing, advanced packaging, and technology development services that enable commercial and government customers to design, prototype, and produce mission-critical silicon at scale.
David Lazovsky
Co-founder and CEO
Biography
Dave Lazovsky is the Co-founder and CEO of Celestial AI, the creators of the Photonic FabricTM. Celestial AI, founded in April 2020, has developed the optical interconnectivity technology platform for AI computing.
Prior to founding Celestial AI, Mr. Lazovsky was a Venture Partner at Khosla Ventures. He has 30 years of experience in the semiconductor industry and over two decades of experience building andleading successful start-ups.
In 2004 Mr. Lazovsky founded Intermolecular, a semiconductor and clean energy R&D and Intellectual Property licensing company. He served as the company’s Chief Executive Officer,President and as a member of the board of directors from September 2004 through October 2014. As President and CEO, Mr. Lazovsky led all aspects of the business through its lifecycle from early-stage start-up to public company. Intermolecular (IMI) went public on the NASDAQ in 2011.
He currently has over 80 issued and pending U.S. patents.
Company Profile
AI is touching our lives and driving breakthroughs in healthcare, finance, autonomous systems, and countless other domains. Its ability to process vast data, derive insights, and automate complex tasks unlocks new levels of efficiency and innovation. However, the exponential growth of AI workloads demands greater computational power and more efficient data movement. Traditional electronic interconnects are struggling to keep up, necessitating a paradigm shift in AI infrastructure.
The answer is like night and day.
Celestial AI’s Photonic Fabric is a revolutionary technology that scales AI compute within package and package-to-package across multiple racks. It forms the foundation for an optical scale-up network, overcoming the physical limitations of electronic interconnects. Offering terabytes of low-latency bandwidth, in-network computing, and high-performance memory, Photonic Fabric heralds a new dawn in AI infrastructure.
Switching to optical interconnects enables larger multi-die packages and bigger scale-up domains, creating a leap into the next decade. Photonic Fabric-based products transform AI data centers, scaling thousands of XPUs across racks, enabling larger models, better reasoning, and more efficient inference. By reducing total cost of ownership, this innovation unlocks new use cases and more profitable GenAI business models.
With an aggressive roadmap, a robust ecosystem of partners, and a tier-one supply chain, Celestial AI isn’t just reimagining AI data centers, it’s delivering an AI-driven, sustainable future. At its core, AI isn’t just about algorithms or hardware, it’s about people. Unlocking creativity, solving humanity’s biggest challenges, and making the impossible possible. The future of AI is here. Intelligence, illuminated.
Quick Tsai
Executive Director
Biography
Quick Tsai (Shiann-Tsong Tsai) received a Bachelor’s degree in Physics in Taiwan and a Master’s degree in Electrical Engineering from Syracuse University in 2001. He began his career at UTAC Taiwan, where he worked for nine years as the R&D and Engineering Department Manager. During this time, he pioneered the pressure oven devoid process in die attachment, which laid the foundation for the widespread application of pressure oven technology in assembly processes today.
In 2011, he joined MediaTek as the Technical Manager for Package Technology, where he worked for thirteen years. He led initiatives in multi-tier Cu wire bonding packaging technology, enhancing the performance, cost reduction, and efficiency of semiconductor devices.
He then moved to Whalechip Technology, serving as a consultant and board member for six years. Whalechip Technology, a TSMC partner, accomplished the world’s first computing device using Wafer on Wafer technology.
Currently, he is the Executive Director at Amazing Cool Technology, where he drives Covetics material innovation and mass production in various areas, including semiconductors. Throughout his career, he has helped companies obtain several patents in numerous area.
Company Profile
ACOOL uses a patented process to produce graphene-modified copper, which is a new material after graphene and copper form a covalent-metallic bond.
The world‘s only mass-producible graphene copper material, all properties exceed those of oxygen-free copper, we named ACOOL COPPER, that are transcendent.
It is formed by graphene and copper. It has dozens of excellent characteristics such as improved mechanical properties, electrical conductivity, thermal conductivity, corrosion resistance, oxidation resistance, EMI resistance, bending resistance, fusible current resistance, high voltage and low leakage, and low temperature coefficient.
Roy Chorev
Vice President and General Manager, Compute Test Division
Biography
Roy Chorev is the vice president of product development for the semiconductor test division at Teradyne, where he is responsible for product development for Teradyne’s semiconductor test products. With more than twenty years of experience in the automated test equipment industry, he has held a number of roles in software development, systems engineering and product marketing at Teradyne. Roy holds a Bachelor of Arts in computer science from McGill University and Master of Business Administration from Babson College.
Company Profile
Teradyne designs, develops, and manufactures automated test equipment and advanced robotics systems. Its test solutions for semiconductors and electronics products enable Teradyne’s customers to consistently deliver on their quality standards. Its advanced robotics business includes collaborative robots and mobile robots that support manufacturing and warehouse operations for companies of all sizes.
Teradyne delivers manufacturing automation across industries, applications and the world. Teradyne solves complex test and automation challenges and enables businesses to achieve higher production volumes, higher quality and higher ROI. Teradyne designs, develops, and manufactures automatic test equipment used to test semiconductors, wireless products, data storage and complex electronics systems in a number of industries, including consumer electronics, wireless, automotive, industrial, computing, communications, and aerospace and defense. The industrial automation portfolio includes collaborative robotic arms, autonomous mobile robots (“AMRs”) and advanced robotic control software used by global manufacturing, logistics and industrial customers to improve quality, increase manufacturing and material handling efficiency, and decrease manufacturing and logistics costs. The automatic test equipment products include:
- Semiconductor test systems
- Storage and system-level test systems; Defense and aerospace test instrumentation and systems; Circuit-board test and inspection systems
- Wireless test systems
Shiva Esturi
Vice President of Global Supply Chain Management
Biography
Shiva Esturi is the Vice President of Global Supply Chain Management at Micron Technology, Inc. In this role, Shiva is responsible for overseeing the end-to-end orchestration of the supply chain to achieve customer service levels, time-to-market, and cost-to-serve objectives. Throughout his career, Shiva has made significant contributions to the field, authoring several publications and frequently lecturing at universities and conferences. He is also an active member of multiple industry advisory boards, where he shares his expertise and insights to help shape the future of supply chain management.
Company Profile
Micron is a world leader in innovative memory solutions that transform how the world uses information. For over 40 years, our company has been instrumental to the world’s most significant technology advancements, delivering optimal memory and storage systems for a broad range of applications.
Matt Traverso
Distinguished Engineer
Biography
Matt Traverso is a Distinguished Engineer for Marvell Technology with a focus on next generation optical interconnect solutions based on silicon photonics. He has led the development of multiple high volume optical module products at 100Gbps and beyond. Matt has been active in the development and definition of optical communications standards and optical form factors since 2000 including as the original editor of the CFP MSA (Multi-Source Agreement). He has dozens of journal publications and has over 30 patents awarded and pending. He graduated from Stanford University in Materials Science & Engineering.
Company Profile
We believe that infrastructure powers progress. That execution is as essential as innovation. That better collaboration builds better technology. At Marvell, We go all in with you.
Focused and determined, we unite behind your goals as our own. We leverage our unrivaled portfolio of infrastructure technology to identify the best solution for your unique needs. And we sit shoulder-to-shoulder with your teams to build it. Agile in our thinking, and our partnerships, we look for unexpected connections that deliver a competitive edge and reveal new opportunities. At Marvell, we’re driven by the belief that how we do things matters just as much as what we do. Because, with a foundation built on partnership, anything is possible.
Todd Foulds
CVP, Product Engineering Operations
Biography
Todd Foulds is the Corporate Vice President of Product Engineering Operations at AMD with nearly 30 years of experience in the semiconductor industry. His team’s responsibilities cover Product Management, Product & Test engineering, Hardware & Infrastructure development, and Engineering Lab operations. Prior to joining AMD, Todd was a technical consultant at Hewlett Packard/Agilent Technologies in the ATE Test & Measurement division. Todd holds a Bachelor of Science degree in Electrical Engineering from Texas A&M University.
Company Profile
For 50 years, AMD has driven in high-performance computing, graphics, and visualization technologies – the building blocks for gaming, immersive platforms, and the datacenter. Hundreds of millions of consumers, leading Fortune 500 businesses and cutting-edge scientific research facilities around the world rely on AMD technology daily to improve how they live, work and play. AMD employees around the world are focused on building great products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit AMD (NASDAQ:AMD) on their website, blog, Facebook and Twitter pages.
Dr. Hamid Sadjadpour
Founder
Biography
Hamid Sadjadpour received the Ph.D. degree from University of Southern California. In 1995, he joined the AT&T Shannon Research Laboratory, as a Technical Staff Member and later as a Principal Member of Technical Staff. In 2001, he joined the University of California at Santa Cruz where he is currently a Professor. He has over 240 publications and 25 patents. He is a co-recipient of the best paper awards at the 2007 International Symposium on Performance Evaluation of Computer and Telecommunication Systems, 2008 Military Communications conference, 2010 European Wireless Conference, and 2017 Conference on Cloud and Big Data Computing.
Company Profile
Practical OTP Encryption Inc. was founded by Professor Hamid Sadjadpour from the University of California, Santa Cruz (UCSC). The company’s innovative encryption technology stems from extensive research conducted at UCSC with support from the Army Research Office. Practical OTP Encryption specializes in advanced information-theoretic solutions designed to provide corporations, financial institutions, and government organizations with unmatched, unconditional data security. Its mission is to safeguard sensitive information stored in public clouds or transmitted over networks against state adversaries and cybercriminals, even those with unlimited computational resources. Unlike conventional encryption methods, Practical OTP Encryption ensures immunity from future scientific breakthroughs, offering protection against harvest-now-decrypt-later attacks. Its unique solution is highly adaptable, seamlessly integrating with devices of any size, making it an ideal choice for addressing the dynamic challenges of modern cybersecurity. Practical OTP Encryption is committed to redefining data security with its groundbreaking, future-proof technology.
Samer Kabbani
CEO
Biography
Samer Kabbani is the CEO of AEM, where he leads the company’s global strategy, innovation agenda, and operational execution as AEM evolves into a platform technology leader serving advanced semiconductor and electronics markets. With over 25 years of experience across semiconductor test, thermal systems, automation, and complex capital equipment, he has driven AEM’s diversification since joining in 2020. He was appointed President and CTO in 2022, before assuming the role of CEO in 2025. Samer holds nearly 40 patents in semiconductor automation, test, and thermal management. He earned his engineering degree from McGill University, with executive training from the Kellogg School of Management.
Company Profile
With the rise of artificial intelligence (AI), the demand for powerful AI chips continues to surge, driving the semiconductor industry toward a trillion-dollar market. These next-generation chips require advanced packaging, high-power thermal management, and rigorous test coverage.
As a leader in Active Thermal Control technology, AEM provides innovative full-stack test solutions designed to enhance test cell throughput and lower test costs. PiXL™ – our patented, intelligent thermal management technology – provides rapid, precise control of test environments. PiXL™ is utilised across all testing stages, from engineering labs to high-volume manufacturing, thus accelerating time-to-market and enhancing yield insights. Together with our automation capabilities and application-specific test instruments, our Test 2.0 solutions are revolutionising 2.5D/3D advanced packaging testing for AI and high-performance computing (HPC) devices.
Through our innovative, highly parallel, high-power test solutions, AEM empowers customers to realise the full potential of AI and future semiconductor advancements.
AEM has a global presence across Asia, Europe, and the Americas. Our R&D centers are crucial in innovating and advancing our in-house engineering capabilities to deliver technologies and solutions for the next generation of semiconductor testing needs. AEM’s R&D centers are situated in Singapore, Malaysia, Finland, France, South Korea, and the United States of America.
Thermal technology is the critical test enabler for Artificial Intelligence (AI) and Advanced Packaging. PiXL™ is AEM’s patented, intelligent thermal management technology that provides rapid, precise control of test environments and is the common thermal architecture that is uniquely integrated across multiple test insertions. With our application-specific test instruments and advanced automation, we enable our customers in the AI and High-Performance Compute (HPC) spaces to optimise their test processes across multiple test insertions, significantly reducing the testing cost per packaged device.
Dr. Near Margalit
VP & GM
Biography
Dr. Near Margalit has held several executive positions in the optical connectivety industry. He founded Zaffire Inc., a metro DWDM Optical Networking company before moving on to lead Source Photonics as CEO from 2002-2013, growing the company to one of the premier optical transceiver vendors. He was the CTO and Head of Product Development for Intel’s Silicon Photonics for the commercial introduction of Silicon Photonics in 2015-2016. From 2018 to present he has been with the Optical Systems Division of Broadcom where he is currently the VP and General Manager of the division. He holds a Ph.D in Optoelectronics from UC Santa Barbara and a B.S. in Applied Physics from CalTech.
Company Profile
Broadcom Inc. designs, develops, and markets digital and analog semiconductors. The Company offers wireless RF components, storage adapters, controllers, networking processors, switches, fiber optic modules, motion control encoders, and optical sensors. Broadcom markets its products worldwide.
Dr. M. Ashkan Seyedi
Director, LinkX Products
Biography
Ashkan Seyedi received a dual bachelor’s in electrical and computer engineering from the University of Missouri-Columbia and a Ph.D. from University of Southern California working on photonic crystal devices, high-speed nanowire photodetectors, efficient white LEDs, and solar cells. With a decade of industry experience at Intel, Hewlett Packard Enterprise and now NVidia, Dr. Seyedi has been working on developing high-bandwidth, efficient optical interconnects for exascale, and high-performance computing applications.
Company Profile
Since its founding in 1993, NVIDIA (NASDAQ: NVDA) has been a pioneer in accelerated computing. The company’s invention of the GPU in 1999 sparked the growth of the PC gaming market, redefined computer graphics, ignited the era of modern AI and is fueling the creation of the metaverse. NVIDIA is now a full-stack computing company with data-center-scale offerings that are reshaping industry.
Dr. Vincent Kim
Head of DSRA-PKG
Biography
Dr. Vincent (WooPoung) Kim is the Corporate EVP, Head of Packaging at Samsung Device Solutions Research America based in San Jose, California. Dr. Kim is responsible for leading the packaging division at Samsung Device Solutions Research America, dedicated to meeting industry’s needs for advanced chip packaging in high-performance systems. Prior to joining Samsung, he served as a System Architect for Signal Integrity and Power Integrity at Apple, where he played a crucial role in developing consumer computers. Before his tenure at Apple, Dr. Kim worked as an SI Manager in Snapdragon packaging at Qualcomm. Prior to that, he was a Co-Design Engineer in the Wireless Business Unit of Texas Instruments, where he specialized in optimizing the electrical design of OMAP packages and systems. Dr. Kim also gained valuable experience as an SI Engineer at Rambus, where he designed and analyzed memory systems.
Dr. Kim received his Ph.D degree in Electrical and Computer Engineering (ECE) at Georgia Tech in 2004, and his M.S. & B.A. degrees from KAIST, Korea in 1999 and 1997.
Company Profile
Samsung Electronics Co., Ltd. engages in the manufacturing and selling of electronics and computer peripherals. The company operates through following business divisions: Consumer Electronics, Information Technology & Mobile Communications and Device Solutions. The Consumer Electronics business division provides cable television, monitor, printer, air-conditioners, refrigerators, washing machines and medical devices. The Information Technology & Mobile Communications business division offers handheld products, communication systems, computers and digital cameras. The Device Solutions business division comprises of memory, system large scale integrated circuit and foundry. The company was founded on January 13, 1969 and is headquartered in Suwon, South Korea.
Najwa Khazal
Chief Operating Officer
Biography
Najwa Khazal is the Chief Operating Officer for Busch Group USA and a global business leader with 20+ years of experience across America, China, EMEA, India, and Mexico. She specializes in supply chain management, program management, and digital transformation for $3B organizations in industries such as aerospace, automotive, energy, medical, and more. Najwa excels in leading complex, multimillion-dollar projects from concept to commercialization, while driving cost optimization and sustainable performance. A passionate educator with 12+ years of teaching international business, she is trilingual and recognized for her exceptional leadership, strategic execution, and commitment to operational excellence across global markets.
Company Profile
Pfeiffer Vacuum+Fab Solutions delivers best-in-class vacuum and semiconductor fabrication solutions for a wide range of industries, including semiconductor manufacturing, analytics, research, and other high-tech applications. We combine advanced vacuum technologies, such as pumps, leak detection systems, and measurement instruments, with specialized fab solutions to support critical processes with maximum precision and reliability.
As part of the Busch Group, one of the world’s largest manufacturers of vacuum pumps, vacuum systems, blowers, compressors, and gas abatement systems, we have access to a global network of expertise and innovation. The Busch Group brings together three industry-leading brands: Busch Vacuum Solutions, Pfeiffer Vacuum+Fab Solutions, and centrotherm clean solutions.
With over 8,000 employees in 44 countries, the Busch Group is committed to delivering superior service and cutting-edge technologies worldwide. The group operates 23 production plants across key regions, including China, Germany, the USA, Vietnam, and others, ensuring global reach with local support.
Dr. Philippe Absil
Vice President IC-Link | imec silicon solutions
Biography
At IC-Link / imec silicon solutions, Philippe Absil leads programs enabling custom ASIC design, prototyping, and advanced semiconductor integration. With over 20 years of experience in CMOS technology development and system design, Philippe has driven innovation in advanced nodes, 3D integration, and heterogeneous packaging. He holds a Ph.D. in Electrical Engineering and has authored numerous publications and patents in semiconductor process technology. At imec, Philippe focuses on bridging research and industry to accelerate time-to-market for next-generation chips in AI, automotive, and high-performance computing applications.
Company Profile
Imec is a world-leading research and innovation hub in advanced semiconductor technologies. Leveraging its state-of-the-art R&D infrastructure and the expertise of over 6,500 employees, imec drives innovation in semiconductor and system scaling, artificial intelligence, silicon photonics, connectivity, and sensing.
Imec’s advanced research powers breakthroughs across a wide range of industries, including computing, health, automotive, energy, infotainment, industry, agrifood, and security. Through IC-Link, imec guides companies through every step of the chip journey – from initial concept to full-scale manufacturing – delivering customized solutions tailored to meet the most advanced design and production needs.
Imec collaborates with global leaders across the semiconductor value chain, as well as with technology companies, start-ups, academia, and research institutions in Flanders and worldwide. Headquartered in Leuven, Belgium, imec has research facilities in Belgium, across Europe and the USA, and representation on three continents. In 2024, imec reported revenues of €1.034 billion.
Further information on imec can be found at www.imec-int.com.
Srini Chinamilli
Co Founder & CEO
Biography
Srini Chinamilli is the Co-founder and CEO of Tessolve. He has more than 25 years of experience in semiconductor Test and Product engineering and held management and technical positions at Cirrus Logic and Centillium communications prior to co-founding Tessolve. Under his leadership, Tessolve has evolved to be the largest standalone semiconductor engineering solutions company, with over 3200 employees across 10 countries worldwide.
Company Profile
Tessolve is a leading semiconductor & systems engineering services company founded in 2004. With a global presence and over 3,200 employees, they support major technology companies. Tessolve offers a wide range of services including ASIC design, chip design, test engineering, complex PCB design, and embedded systems design. Their focus on emerging areas like AI, hyperscalars, semiconductor design and testing, avionics and automotive solutions helps clients bring high-quality products to market faster and more cost-effectively.
Dr. Mark Wade
CEO and Co-Founder
Biography
Mark is Chief Executive Officer and Co-Founder of Ayar Labs. His prior roles at Ayar Labs include Chief Technology Officer and Senior Vice President of Engineering. He is recognized as a pioneer in photonics technologies and, prior to founding the company, led the team that designed the optics in the world’s first processor to communicate using light. He and his co-founders invented breakthrough technology at MIT and UC Berkeley from 2010-2015 which led to the formation of Ayar Labs. He holds a PhD from University of Colorado.
Company Profile
Ayar Labs is disrupting the traditional performance, cost, and efficiency curves of the semiconductor and computing industries by driving a 1000x improvement in interconnect bandwidth density at 10x lower power. Ayar Labs’ patented approach uses industry standard cost-effective silicon processing techniques to develop high speed, high density, low power optical based interconnect “chiplets” and lasers to replace traditional electrical based I/O. The company was founded in 2015 and is funded by a number of domestic and international venture capital firms as well as strategic investors. For more information, visit www.ayarlabs.com.
Address: 695 River Oaks Parkway, San Jose, CA 95134
Phone: 650-963-7200
Email: info@ayarlabs.com
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