Stuart Love recently joined DSV Inventory Management Solutions (IMS) in Q4 2024 as the Director of Special Projects. He brings a wealth of knowledge and experience from his 19-year career at Intel Corporation. During his tenure at Intel, Stuart held various leadership roles throughout the Global Supply Chain, ranging from Global Planning of Assembly Materials, Assembly Equipment Sourcing leadership, Business Intelligence Systems development, Global Sourcing, Inventory optimization / procurement and most recently as the Director of Memory Sourcing & Strategy for Intel. Stuart’s broad experience and depth of knowledge within Supply Chain and Semiconductor is paired with collaborations with ASU & APICS. He holds degrees in both Marketing and Production Operations Management from University of New Mexico.

Madhavan Swaminathan is the Department Head of Electrical Engineering and is the William E. Leonhard Endowed Chair at Penn State University. He also serves as the Director for the Center for Heterogeneous Integration of Micro Electronic Systems (CHIMES), an SRC JUMP 2.0 Center chimes.psu.edu. Prior to joining Penn State, he was the John Pippin Chair in Microsystems Packaging & Electromagnetics in the School of Electrical and Computer Engineering (ECE), Professor in ECE with a joint appointment in the School of Materials Science and Engineering (MSE), and Director of the 3D Systems Packaging Research Center (PRC) – a graduated NSF-Engineering Research Center (ERC), Georgia Tech (GT). Prior to GT, he was with IBM working on packaging for supercomputers. Prof. Swaminathan’s interdisciplinary research on semiconductor packaging and systems integration over the years have resulted in 650+ technical publications, 200+ invited presentations (seminars, keynotes, panels), 3 books, 5 book chapters, 31 patents, 33 best paper and student paper awards, 5 GT awards, 2 start-ups, and several international recognitions with the recent one being the 2024 IEEE Rao R. Tummala Electronics Packaging Award (technical field award) for “contributions to semiconductor packaging and system integration technologies that improve the performance, efficiency, and capabilities of electronic systems”. He is also the founder of the IEEE Conference on Electrical Design of Advanced Packaging and Systems (EDAPS), a premier conference sponsored by the IEEE Electronics Packaging Society (EPS). He is a Fellow of IEEE, Fellow of the National Academy of Inventors (NAI), Fellow of Asia-Pacific Artificial Intelligence Association (AAIA), and has served as the Distinguished Lecturer for the IEEE Electromagnetic Compatibility (EMC) society. He received his MS and PhD degrees in Electrical Engineering from Syracuse University, USA.

Roger has more than 30 years of experience in the semiconductor industry and became part of Amkor in 2003. During his tenure at Amkor, he has taken on various leadership positions, and he currently oversees the Chiplet /FCBGA/fcCSP business unit, along with its associated packaging technologies. Prior to joining Amkor, Roger worked at Digital Equipment Corporation and Microchip Technology. He earned a Bachelor of Science in Electrical Engineering from the University of Massachusetts and a Master of Science in Materials Science from Stanford University. Additionally, Roger is an inventor on more than 70 patents related to semiconductor processing, packaging, and applications.

Dr. Chet Lenox is a KLA Fellow and the leader of the Industry and Customer Collaboration Team at KLA, which engages broadly with the semiconductor ecosystem across all of the domains in front-end, packaging, PCB, and Specialty Semi that KLA serves. Previous to KLA, Chet held varies process development and integration roles at Intel, National Semiconductor, and Texas Instruments.

Greg Clemons is a seasoned professional with over 27 years in the semiconductor industry. He currently serves as the Senior Business Development Manager at ASMPT SEMI Solutions in the USA, driving business growth and innovation in advanced packaging. His expertise spans silicon wafer fabrication, advanced packaging, and semiconductor equipment. Greg has held key roles throughout his career, starting as a wet etch process engineer at Intel corporation and progressing from wafer fabrication to facilities construction to advanced packaging R&D where he delivered the 1st HVM TCB process for Intel products. He holds seven advanced packaging patents and continues to innovate in fluxless processing development, and has co-authored many technical papers, including a recent publication in enabling HBM 16H stacks with ASMPT Fluxless AOR technology. Greg holds a Bachelor of Science in Mechanical Engineering and a Master of Science in Materials Engineering from the University of Dayton, Ohio while working at the WPAFB Materials Directorate Labs. His leadership and innovation continue to drive advancements in the semiconductor industry.

Mark is a forward-thinking leader passionate about the rapid evolution of digital transformation and its impact on businesses. In his current role at Schneider Electric, he is responsible for shaping the vision and strategy that guides customers through their digitization journeys. Collaborating with cross-functional teams, Mark strives to deliver comprehensive solutions tailored to address specific customer challenges. Previously, as Segment President for Cloud & Service Providers, he led Schneider Electric’s global data center operations, growing it into the company’s largest and fastest-growing segment from 2015 to 2022. His ultimate goal is to ensure businesses are resilient, connected, and prepared for the future.

Simi Sherman is Co-Founder and CEO of Chips & Wafers, a semiconductor data and research platform, and formerly VP of Research with ISIG.

After six years at a Buy-Side global equities Hedge Fund, where he was a Partner and led semiconductor research, Simi Co-founded Chips & Wafers. Working together with ISIG, Chips & Wafers provides semiconductor companies and investors with timely and actionable data they utilize in making more informed decisions.

Dr. Nokibul Islam is the Sr. Director of STATS ChipPAC Business Unit, where he leads product business development and advanced technology promotion. With over 21 years of experience in semiconductor product management, business development, and advanced packaging, he previously played a key role in Amkor Technology’s R&D team, focusing on product development, simulation, characterization, and process improvement. He is actively involved in leading industry conferences such as IMAPS, ECTC, InterPack, and Chiplet Summit and has contributed extensively to international publications.

Saeed is a seasoned investor and executive with over 30 years of experience growing businesses in numerous industries, including real estate, bottled water, packaging, and technology investing. Following the early success of his various businesses, The Amidi Group initially purchased a building in Palo Alto and decided to rent the extra office spaces to startups.

As the CEO and founder of Plug and Play, Saeed applies his passion for the tech industry daily by working with forward-thinking partners and the best global startups to facilitate positive change worldwide. Since Plug and Play’s launch in 2006, the company has worked with over 90,000 startups, made over 2,000 investments, and boasts over 30 unicorns including Dropbox, PayPal, Lending Club, N26, and Honey. Similar to his unexpected success with the “Lucky Building,” Saeed considered himself lucky overall when he moved to Silicon Valley in the late 70s, where he was then unaware of the ecosystem it would become.

Ben Rathsack is Vice President of 2 US Business Units within Tokyo Electron America (TEA). He is responsible for the US business management (P/L) of the lithography track/ cleaning system BU (CTSPS) and assembly (3DI)/ test systems BU (ATS) including sales, marketing and service within the US. These business units drive advanced FEOL scaling and BEOL advanced packaging equipment sales. He has worked at TEA for 17 years in various roles including VP of Product and Technology Development (R&D), marketing, new product introduction and process development. He has 23 years of semiconductor experience at Tokyo Electron and Texas Instruments (50 publications/ 30 patents). He received his BS in Chemical Engineering from the University of Illinois/UC and his MS/PhD at the University of Texas/Austin.

Christine Dunbar formerly Head of Strategic Business Development at Natcast, the non-profit entity designated by the U.S. Department of Commerce to operate the National Semiconductor Technology Center (NSTC). In this role, she leads strategic initiatives to advance the U.S. semiconductor ecosystem, fostering collaboration between industry, government, and academia.

Before joining Natcast in March 2025, Christine served as Senior Vice President of Global Sales at IQE, a leading provider of compound semiconductor wafer products and advanced materials solutions. Prior to joining IQE in 2022, she held key executive roles at GlobalFoundries and IBM’s Microelectronics Division.

A Cornell University graduate with a bachelor’s degree in Materials Science and Engineering, Christine has dedicated her entire career to advancing the global semiconductor industry. In recognition of her leadership, she was nominated for the Global Semiconductor Association’s inaugural “Rising Woman of Influence” award in 2018.

Beyond her executive roles, Christine is a recognized thought leader and sought-after speaker on the critical issues shaping the future of the semiconductor industry. She is frequently called upon to present at global industry forums, where she has provided insights on technology innovation, supply chain resilience, workforce development, and global policy. A longtime advocate for diversity in tech, she is also deeply committed to mentoring and inspiring the next generation of leaders, helping to shape a more inclusive and dynamic semiconductor ecosystem.