Dr. James Chambers
Vice President of Silicon Engineering & Sourcing
Biography
Dr. James Chambers is Vice President of Silicon Engineering and Sourcing at NVIDIA. In this role, he leads efforts to optimize semiconductor manufacturing in collaboration with external partners, driving improvements in yield, performance/power, reliability, quality, and delivery across NVIDIA’s GPU and CPU silicon product portfolio. He is responsible for the end-to-end supply of internal and external NPI SoC samples, managing the silicon engineering interface with CPU, GPU, and memory vendors, and overseeing NVIDIA’s silicon failure analysis labs. Dr. Chambers has a proven track record of leading technology, manufacturing, product development, and product management teams to deliver some of the industry’s most innovative solutions. At AMD, he oversaw the Foundry Technology and Operations team, with responsibility for end-to-end process technology—from pathfinding through high-volume manufacturing—including AMD’s failure analysis labs. Prior to AMD, he held various roles at Texas Instruments, contributing to Silicon Technology R&D for advanced low- and high-power process nodes. He is the inventor or co-inventor of more than 50 patents and has authored 45 publications and technical presentations covering SiON, high-k dielectrics, metal gate electrodes, and advanced device architectures.
Company Profile
Since its founding in 1993, NVIDIA (NASDAQ: NVDA) has been a pioneer in accelerated computing. The company’s invention of the GPU in 1999 sparked the growth of the PC gaming market, redefined computer graphics, ignited the era of modern AI and is fueling the creation of the metaverse. NVIDIA is now a full-stack computing company with data-center-scale offerings that are reshaping industry.
Sandeep Bharathi
President Data Center Group
Biography
Company Profile
We believe that infrastructure powers progress. That execution is as essential as innovation. That better collaboration builds better technology. At Marvell, We go all in with you.
Focused and determined, we unite behind your goals as our own. We leverage our unrivaled portfolio of infrastructure technology to identify the best solution for your unique needs. And we sit shoulder-to-shoulder with your teams to build it. Agile in our thinking, and our partnerships, we look for unexpected connections that deliver a competitive edge and reveal new opportunities. At Marvell, we’re driven by the belief that how we do things matters just as much as what we do. Because, with a foundation built on partnership, anything is possible.
Naga Chandrasekaran
Chief Technology and Operations Officer, EVP & GM
Biography
Naga Chandrasekaran is responsible for Intel Foundry’s technology development, worldwide manufacturing, customer service and ecosystem operations, including research, development, and deployment of next-generation silicon logic, packaging and test technologies, as well as front-end and back-end manufacturing, foundry services, strategic planning, corporate quality and reliability and supply chain.
Chandrasekaran earned a bachelor’s degree in mechanical engineering from the University of Madras; a master’s degree and doctorate in mechanical engineering from Oklahoma State University; a master’s degree in information and data science from the University of California, Berkeley; and dual executive MBAs from the University of California, Los Angeles, and the National University of Singapore.
Company Profile
Intel’s systems foundry approach offers full-stack optimization from the factory network to software. Intel and its ecosystem empower customers to innovate across the entire system through continuous technology improvements, reference designs and new standards. Intel Foundry is an independent foundry business that meets our customers’ unique product needs, including our industry-leading sort and test capabilities. Whether front-end or back-end design is needed, when integrated with our foundry co-optimized development kits based on industry-standard tools and flows and powerful silicon IPs, the result is true innovation.
Dr. Raja Swaminathan
CVP, Advanced Packaging
Biography
Dr. Raja Swaminathan is the Corporate Vice President of Packaging at AMD, spearheading the development of AMD’s advanced packaging and heterogeneous integration roadmap. With a distinguished career spanning roles at Intel, Apple, and now AMD, Dr. Swaminathan’s expertise in design-technology co-optimization and dedication to optimizing power, performance, area, and cost (PPAC) have led to significant technological advancements such as EMIB, Apple’s Mx packages, 3D V-Cache, and 3.5D architectures for AI accelerators. Dr. Swaminathan holds a PhD from Carnegie Mellon University and an undergraduate degree from IIT Madras. With over 100 patents and more than 40 published papers to their name, Dr. Swaminathan was recently recognized as an IEEE Fellow and serves as a technical advisor to multiple startups. His unwavering commitment to heterogeneous integration continues to drive the boundaries of silicon technology.
Company Profile
For 50 years, AMD has driven in high-performance computing, graphics, and visualization technologies – the building blocks for gaming, immersive platforms, and the datacenter. Hundreds of millions of consumers, leading Fortune 500 businesses and cutting-edge scientific research facilities around the world rely on AMD technology daily to improve how they live, work and play. AMD employees around the world are focused on building great products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit AMD (NASDAQ:AMD) on their website, blog, Facebook and Twitter pages.
End of content
End of content
