23 April
Silicon Valley

"I have been to many conferences and symposiums through your my carrier. I find ISIG summits be an excellent balance between technical and high level strategies. In addition, rarely you can find these number of executives in one place and so much opportunities for building strong networks that matter. "

"The quality of the materials and subject matter experts present together with the wealth of experience was totally worth the investment put into attending and participating - the drive to make everyone interact and build a safe environment to exchange ideas is very unique to Salah's branding."
20-21 April
Silicon Valley


"I have been to many conferences and symposiums through your my carrier. I find ISIG summits be an excellent balance between technical and high level strategies. In addition, rarely you can find these number of executives in one place and so much opportunities for building strong networks that matter. "

"The quality of the materials and subject matter experts present together with the wealth of experience was totally worth the investment put into attending and participating - the drive to make everyone interact and build a safe environment to exchange ideas is very unique to Salah's branding."
20-21 April
Silicon Valley

Day 2 / 08:30 - 08:50
Dr. James Chambers is Vice President of Silicon Engineering and Sourcing at NVIDIA. In this role, he leads efforts to optimize semiconductor manufacturing in collaboration with external partners, driving improvements in yield, performance/power, reliability, quality, and delivery across NVIDIA’s GPU and CPU silicon product portfolio. He is responsible for the end-to-end supply of internal and external NPI SoC samples, managing the silicon engineering interface with CPU, GPU, and memory vendors, and overseeing NVIDIA’s silicon failure analysis labs. Dr. Chambers has a proven track record of leading technology, manufacturing, product development, and product management teams to deliver some of the industry’s most innovative solutions. At AMD, he oversaw the Foundry Technology and Operations team, with responsibility for end-to-end process technology—from pathfinding through high-volume manufacturing—including AMD’s failure analysis labs. Prior to AMD, he held various roles at Texas Instruments, contributing to Silicon Technology R&D for advanced low- and high-power process nodes. He is the inventor or co-inventor of more than 50 patents and has authored 45 publications and technical presentations covering SiON, high-k dielectrics, metal gate electrodes, and advanced device architectures.
Since its founding in 1993, NVIDIA (NASDAQ: NVDA) has been a pioneer in accelerated computing. The company’s invention of the GPU in 1999 sparked the growth of the PC gaming market, redefined computer graphics, ignited the era of modern AI and is fueling the creation of the metaverse. NVIDIA is now a full-stack computing company with data-center-scale offerings that are reshaping industry.

Day 1 / 08:55 - 09:15
Naga Chandrasekaran is responsible for Intel Foundry’s technology development, worldwide manufacturing, customer service and ecosystem operations, including research, development, and deployment of next-generation silicon logic, packaging and test technologies, as well as front-end and back-end manufacturing, foundry services, strategic planning, corporate quality and reliability and supply chain.
Chandrasekaran earned a bachelor’s degree in mechanical engineering from the University of Madras; a master’s degree and doctorate in mechanical engineering from Oklahoma State University; a master’s degree in information and data science from the University of California, Berkeley; and dual executive MBAs from the University of California, Los Angeles, and the National University of Singapore.
Intel’s systems foundry approach offers full-stack optimization from the factory network to software. Intel and its ecosystem empower customers to innovate across the entire system through continuous technology improvements, reference designs and new standards. Intel Foundry is an independent foundry business that meets our customers’ unique product needs, including our industry-leading sort and test capabilities. Whether front-end or back-end design is needed, when integrated with our foundry co-optimized development kits based on industry-standard tools and flows and powerful silicon IPs, the result is true innovation.

Day 2 / 08:55 - 09:15
We believe that infrastructure powers progress. That execution is as essential as innovation. That better collaboration builds better technology. At Marvell, We go all in with you.
Focused and determined, we unite behind your goals as our own. We leverage our unrivaled portfolio of infrastructure technology to identify the best solution for your unique needs. And we sit shoulder-to-shoulder with your teams to build it. Agile in our thinking, and our partnerships, we look for unexpected connections that deliver a competitive edge and reveal new opportunities. At Marvell, we’re driven by the belief that how we do things matters just as much as what we do. Because, with a foundation built on partnership, anything is possible.

Day 2 / 14:05 - 15:15
Ravi Agarwal is an accomplished professional with extensive experience in advanced technology development and research. Currently serving as Director of Advanced Technology Development R&D at Meta since October 2019, Ravi specializes in AI/ML chip co-design, chiplet strategy, and advanced packaging architecture. Previous leadership roles include Chair of EPS – IEEE Electronics Packaging Society, ODSA Chiplet Business Working Group Lead at Open Compute Project Foundation, and Director of Strategy at Intel Corporation. Ravi’s background includes significant contributions in product management, supply chain strategy, and research assistant roles across various institutions, including North Carolina State University and the Indian Institute of Science. Ravi holds a PhD in Materials Science and Engineering, an MBA from the University of California, Berkeley, and multiple degrees in related fields, demonstrating a strong foundation in both technical and business disciplines.
Meta builds technologies that help people connect, find communities, and grow businesses. When Facebook launched in 2004, it changed the way people connect. Apps like Messenger, Instagram and WhatsApp further empowered billions around the world. Now, Meta is moving beyond 2D screens toward immersive experiences like augmented and virtual reality to help build the next evolution in social technology.

Day 2 / 09:20 - 09:40
Dr. Raja Swaminathan is the Corporate Vice President of Packaging at AMD, spearheading the development of AMD’s advanced packaging and heterogeneous integration roadmap. With a distinguished career spanning roles at Intel, Apple, and now AMD, Dr. Swaminathan’s expertise in design-technology co-optimization and dedication to optimizing power, performance, area, and cost (PPAC) have led to significant technological advancements such as EMIB, Apple’s Mx packages, 3D V-Cache, and 3.5D architectures for AI accelerators. Dr. Swaminathan holds a PhD from Carnegie Mellon University and an undergraduate degree from IIT Madras. With over 100 patents and more than 40 published papers to their name, Dr. Swaminathan was recently recognized as an IEEE Fellow and serves as a technical advisor to multiple startups. His unwavering commitment to heterogeneous integration continues to drive the boundaries of silicon technology.
For 50 years, AMD has driven in high-performance computing, graphics, and visualization technologies – the building blocks for gaming, immersive platforms, and the datacenter. Hundreds of millions of consumers, leading Fortune 500 businesses and cutting-edge scientific research facilities around the world rely on AMD technology daily to improve how they live, work and play. AMD employees around the world are focused on building great products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit AMD (NASDAQ:AMD) on their website, blog, Facebook and Twitter pages.

Day 1 / 11:30 - 12:20
Dr. Near Margalit has held several executive positions in the optical connectivety industry. He founded Zaffire Inc., a metro DWDM Optical Networking company before moving on to lead Source Photonics as CEO from 2002-2013, growing the company to one of the premier optical transceiver vendors. He was the CTO and Head of Product Development for Intel’s Silicon Photonics for the commercial introduction of Silicon Photonics in 2015-2016. From 2018 to present he has been with the Optical Systems Division of Broadcom where he is currently the VP and General Manager of the division. He holds a Ph.D in Optoelectronics from UC Santa Barbara and a B.S. in Applied Physics from CalTech.
Broadcom Inc. designs, develops, and markets digital and analog semiconductors. The Company offers wireless RF components, storage adapters, controllers, networking processors, switches, fiber optic modules, motion control encoders, and optical sensors. Broadcom markets its products worldwide.

Day 2 / 11:40 - 11:50
Samer Kabbani is the CEO of AEM, where he leads the company’s global strategy, innovation agenda, and operational execution as AEM evolves into a platform technology leader serving advanced semiconductor and electronics markets. With over 25 years of experience across semiconductor test, thermal systems, automation, and complex capital equipment, he has driven AEM’s diversification since joining in 2020. He was appointed President and CTO in 2022, before assuming the role of CEO in 2025. Samer holds nearly 40 patents in semiconductor automation, test, and thermal management. He earned his engineering degree from McGill University, with executive training from the Kellogg School of Management.
With the rise of artificial intelligence (AI), the demand for powerful AI chips continues to surge, driving the semiconductor industry toward a trillion-dollar market. These next-generation chips require advanced packaging, high-power thermal management, and rigorous test coverage.
As a leader in Active Thermal Control technology, AEM provides innovative full-stack test solutions designed to enhance test cell throughput and lower test costs. PiXL™ – our patented, intelligent thermal management technology – provides rapid, precise control of test environments. PiXL™ is utilised across all testing stages, from engineering labs to high-volume manufacturing, thus accelerating time-to-market and enhancing yield insights. Together with our automation capabilities and application-specific test instruments, our Test 2.0 solutions are revolutionising 2.5D/3D advanced packaging testing for AI and high-performance computing (HPC) devices.
Through our innovative, highly parallel, high-power test solutions, AEM empowers customers to realise the full potential of AI and future semiconductor advancements.
AEM has a global presence across Asia, Europe, and the Americas. Our R&D centers are crucial in innovating and advancing our in-house engineering capabilities to deliver technologies and solutions for the next generation of semiconductor testing needs. AEM’s R&D centers are situated in Singapore, Malaysia, Finland, France, South Korea, and the United States of America.
Thermal technology is the critical test enabler for Artificial Intelligence (AI) and Advanced Packaging. PiXL™ is AEM’s patented, intelligent thermal management technology that provides rapid, precise control of test environments and is the common thermal architecture that is uniquely integrated across multiple test insertions. With our application-specific test instruments and advanced automation, we enable our customers in the AI and High-Performance Compute (HPC) spaces to optimise their test processes across multiple test insertions, significantly reducing the testing cost per packaged device.

Day 1 / 16:45 - 16:55
Giacomo is the global leader of AlixPartners’ Technology, Media, and Telecommunications practice, with over 25 years of experience driving large-scale transformation for hardware, software, and business services clients. Renowned for rapidly achieving results, he helps organizations reverse performance decline, navigate disruption, and optimize operations. His transformative philosophy: understand, reflect, and take action, combines intuitive strategy with innovative analytics to deliver sustainable change. A passionate advocate for diversity and inclusion, Giacomo sponsors AlixPartners’ PrideMatters employee group and serves as a Trustee of the Committee for Economic Development, the public policy center of The Conference Board.
AlixPartners is a results-driven global consulting firm that specializes in helping businesses respond quickly and decisively to their most critical challenges—from urgent performance improvement to complex restructuring, from risk mitigation to accelerated transformation. These are the moments when everything is on the line—a sudden shift in the market, an unexpected performance decline, a time-sensitive deal, a fork-in-the-road decision. We stand shoulder to shoulder with our clients until the job is done, and only measure our success in terms of the results we deliver.
Clients call us when they need pragmatism and cut-through to solve their most complex challenges arising from a continually disrupted world. Our services cover Artificial Intelligence, Corporate Strategy & Transformation, Data Governance, ESG, Growth, Investigations, Disputes & Advisory Services, Mergers & Acquisitions, Organizational Transformation, Supply-Chain Management & Operations, Technology, Transformative Leadership and Turnaround and Restructuring.

Day 2 / 16:50 - 17:00
Ami Eitan received his B.Sc. in Chemical Engineering from Ben-Gurion University, Israel, his M.Sc. in Chemistry from the Weizmann Institute of Science, Israel, and his Ph.D. in Materials Science and Engineering from Rensselaer Polytechnic Institute, Troy, NY.
His work experience includes 16 years at Intel Corporation, as the head of the Technology Development of assembly interconnect department, 5 years as a director in the Advanced Packaging Technology and Service organization at TSMC, Taiwan, leading bonding technology development efforts, and now Ami is a SVP, Chief Scientific Officer at ASMPT SEMI solutions. Among his leading edge development programs, Ami led the Thermo-Compression Bonding technology development at Intel.
Ami’s areas of expertise include polymer-based composites, characterization of polymer systems, materials and process development for semiconductor packaging applications, TCB, HB, and other interconnect technology development.
ASMPT Limited, founded in 1975, is headquartered in Singapore and is listed in Hong Kong Stock Exchange since 1989.
ASMPT is the only company in the world that offers high-quality equipment for all major steps in the electronics manufacturing process – from carrier for chip interconnection to chip assembly and packaging to SMT. No other supplier offers a comparable range and depth of process expertise.
Semiconductor Solutions Segment Business of ASMPT offers a diverse product range from bonding to molding and trim & form to the integration of these activities into complete in-line systems for the microelectronics, semiconductor, camera modules, advanced packaging, photonics, and optoelectronics industries.
The group has successfully established itself as the leading player in the back-end assembly and packaging market with its innovative solutions and constant focus on customer value creation.

Day 2 / 17:05 - 17:15
Dr. Maksym Plakhotnyuk, is the CEO and Founder of ATLANT 3D, a pioneering deep-tech company at the forefront of innovation, developing the world’s most advanced atomic-scale manufacturing platform. Maksym is the inventor of the first-ever atomic layer advanced manufacturing technology, enabling atomic-precision development of materials, devices, and microsystems. A scientist with a Ph.D. in Nanotechnology, he has deep expertise in nanotechnologies, renewable and exponential technologies, semiconductor processing, solid-state physics, and material science. A Fulbright scholar, Hello Tomorrow Grand Winner, and proud Ukrainian, Maksym has earned global recognition for his work.
ATLANT 3D has mastered control of matter at the atomic scale, ushering in a new era in manufacturing. For research teams and manufacturers working at the frontiers of technology, we’ve created what was once thought unattainable: a system that builds materials and devices, atom by atom, with unprecedented precision and speed.
While others are constrained by traditional manufacturing limits, our breakthrough technology makes it possible to create the seemingly impossible, from next-generation quantum computers to devices that can operate in the harsh conditions of space. By replacing complex, resource-heavy processes with precise atomic-scale fabrication, we’re transforming technology while making manufacturing sustainable. We’re providing innovative teams the power to build technologies today that will define tomorrow’s world, using fewer resources to achieve greater possibilities.
Based in Copenhagen and London, with operations in the US, ATLANT 3D partners with research institutions and industrial companies to expand the boundaries of technological possibility.
ATLANT 3D is redefining microfabrication with its patented Direct Atomic Layer Processing (DALP®) technology. Our NANOFABRICATOR™ platform enables localized atomic layer processing for rapid material discovery, prototyping, and scalable device fabrication—bridging the gap from lab to fab.
Beyond hardware, we offer Pilot Projects and Joint Development Services to validate new materials and device architectures. A-HUB, our Microfabrication-as-a-Service (MaaS) centre, provides R&D teams with atomic-scale precision without the need for costly infrastructure.
From concept to fabrication, ATLANT 3D partners with academia and industry to drive next-generation innovations beyond conventional limits.

Day 1 / 13:45 - 13:55
Day 1 / 14:00 - 14:45
Audrey Charles is senior vice president of corporate strategy and advanced packaging, and president of Lam Capital at Lam Research. In this position, she is responsible for leading the executive management team in the development of strategic priorities and key initiatives that support the company’s long-term profitable growth. She is also responsible for accelerating the company’s market-leading position in advanced packaging to deliver differentiated technology and support to customers. Additionally, Audrey oversees Lam’s Corporate Development team and investment arm, Lam Capital, which invests in disruptive companies that advance the semiconductor ecosystem through next generation industrial automation, technology and product innovation, and new market opportunities. She brings a broad base of experience to her role, including engineering, customer technology management and investor relations. Since joining Lam in 1995, she has served in a range of leadership positions including senior vice president of Global Human Resources and vice president of corporate initiatives. Audrey earned an M.B.A. from the MIT Sloan School of Management and a B.S. in applied physics from Dublin City University.
Lam Research Corporation is a trusted global supplier of innovative wafer fabrication equipment and services to the semiconductor industry. Our strong values-based culture fuels our progress, and it’s through collaboration, precision, and delivery that we are driving semiconductor breakthroughs that define the next generation. Lam Research (Nasdaq: LRCX) is a FORTUNE 500® company headquartered in Fremont, California, with operations around the globe. Learn more at www.lamresearch.com
We combine superior systems engineering, technology leadership, and a commitment to customer success to advance the global semiconductor industry. Our broad portfolio of market-leading deposition, etch, strip, and wafer cleaning solutions helps customers achieve success on the wafer by enabling device features that are 1,000 times smaller than a grain of sand—it’s why nearly every chip today is built with Lam technology.

Day 1 / 11:05 - 11:25
Ashkan Seyedi received a dual bachelor’s in electrical and computer engineering from the University of Missouri-Columbia and a Ph.D. from University of Southern California working on photonic crystal devices, high-speed nanowire photodetectors, efficient white LEDs, and solar cells. With a decade of industry experience at Intel, Hewlett Packard Enterprise and now NVidia, Dr. Seyedi has been working on developing high-bandwidth, efficient optical interconnects for exascale, and high-performance computing applications.
Since its founding in 1993, NVIDIA (NASDAQ: NVDA) has been a pioneer in accelerated computing. The company’s invention of the GPU in 1999 sparked the growth of the PC gaming market, redefined computer graphics, ignited the era of modern AI and is fueling the creation of the metaverse. NVIDIA is now a full-stack computing company with data-center-scale offerings that are reshaping industry.

Day 2 / 16:25 - 16:45
Hidenori Abe is CTO for semiconductor materials and Executive Director of Electronics Business Headquarters at Resonac. He leads R&D and strategy for electronic materials in semiconductors, substrates, and displays. Previously, Mr. Abe served as the head of the Electronics R&D Center and Packaging Solution Center, where he contributed to advanced packaging development through open innovation. Notably, in 2021, he directed the launch of JOINT2, a consortium targeting 2.xD and 3D packaging technologies. He received a master’s degree in chemical engineering from Tokyo Institute of Technology, Japan, and a master’s degree in the Executive MBA program from the University of Oxford, UK.
Resonac defines its purpose as “Change society through the power of chemistry.” Resonac aims to be a world-class functional chemical manufacturer, creating functions necessary for the times, supporting technological innovation, and contributing to the sustainable development of our customers. Resonac is Global Leading semiconductor materials supplier. In order to achieve technological innovation for solving various social issues, it is essential for us to make wide-ranging co-creative efforts with partners, and Resonac is open to collaboration including 1on1 co-development with any partner.
We have opened a Packaging Solution Center and are actively engaged in next-generation semiconductor co-creation activities through JOINT2 with many partner companies. Furthermore, starting this year, we will also seek co-creation opportunities in the United States by launching US-JOINT.

Day 2 / 11:15 - 11:35
Skyworks Solutions, Inc. is empowering the wireless networking revolution. Our highly innovative analog semiconductors are connecting people, places and things spanning a number of new and previously unimagined applications within the automotive, broadband, cellular infrastructure, connected home, industrial, medical, military, smartphone, tablet and wearable markets.
Skyworks is a global company with engineering, marketing, operations, sales and support facilities located throughout Asia, Europe and North America.
Skyworks products are used in aerospace, automotive, broadband, cellular infrastructure, connected home, defense, entertainment and gaming, industrial, medical, military, smartphone, tablet, and wearable markets.

Day 1 / 15:55 - 16:40
Lafosse graduated from the Ecole Nationale Supérieure de Chimie de Paris and received a doctorate in material physics from Paris University, France.
Lafosse joined Corning in 1995 as a scientist at the Corning European Technology Center in France. He held several positions in R&D, developing a variety of glass and polymer optical materials and supporting several Corning businesses.
In 2007, he relocated with his family to Corning, NY and was appointed business technology director for Specialty Materials. In this position, he established critical technical capabilities in support of Corning® Gorilla® Glass business growth and contributed to several new product introductions.
In 2019, he was appointed commercial technology director, Advanced Optics. In this role, he works with customers and semiconductor industry leaders to identify new trends and opportunities and to drive the technology road mapping process.
Solving the World’s Toughest Optical Challenges with Innovation, Collaboration, and Precision.
Corning’s diverse Advanced Optics portfolio reflects our deep understanding of the properties of light, its interaction with matter, and the instruments used to detect it. For decades, we have been a trusted optics collaborator with leaders in a wide range of markets, including aerospace and defense, semiconductor materials and optics, telecommunications, and glass ceramics. We offer a diverse set of optics technologies providing solutions to full complex systems. Customer collaboration is the hallmark of our operations.
The Semiconductor Technologies & Solutions business is growing its investments to deliver an innovative and diverse set of glass and crystal components, and advanced optical sub-assemblies for modern lithography scanners, optical inspection systems, and advanced packaging substrates.
Learn more:
Semiconductors: Corning doesn’t just chip in; we help lead the way
Corning’s glass innovations help artificial intelligence enhance the way we work, learn, and live.
About Corning Incorporated
Corning is vital to progress – in the industries we shape and in the world we share. We invent life-changing technologies using materials science. Our scientific and manufacturing expertise, boundless curiosity, and commitment to purposeful invention place us at the center of the way the world interacts, works, learns, and lives. Our sustained investment in research, development, and invention means we’re always ready to solve the toughest challenges alongside our customers.

Day 1 / 11:30 - 12:20
At IC-Link / imec silicon solutions, Philippe Absil leads programs enabling custom ASIC design, prototyping, and advanced semiconductor integration. With over 20 years of experience in CMOS technology development and system design, Philippe has driven innovation in advanced nodes, 3D integration, and heterogeneous packaging. He holds a Ph.D. in Electrical Engineering and has authored numerous publications and patents in semiconductor process technology. At imec, Philippe focuses on bridging research and industry to accelerate time-to-market for next-generation chips in AI, automotive, and high-performance computing applications.
Imec is a world-leading research and innovation hub in advanced semiconductor technologies. Leveraging its state-of-the-art R&D infrastructure and the expertise of over 6,500 employees, imec drives innovation in semiconductor and system scaling, artificial intelligence, silicon photonics, connectivity, and sensing.
Imec’s advanced research powers breakthroughs across a wide range of industries, including computing, health, automotive, energy, infotainment, industry, agrifood, and security. Through IC-Link, imec guides companies through every step of the chip journey – from initial concept to full-scale manufacturing – delivering customized solutions tailored to meet the most advanced design and production needs.
Imec collaborates with global leaders across the semiconductor value chain, as well as with technology companies, start-ups, academia, and research institutions in Flanders and worldwide. Headquartered in Leuven, Belgium, imec has research facilities in Belgium, across Europe and the USA, and representation on three continents. In 2024, imec reported revenues of €1.034 billion.
Further information on imec can be found at www.imec-int.com.

Day 2 / 14:05 - 15:15
Dr. Hamid R. Azimi is Senior Vice President of Advanced Packaging and Foundry at Marvell. In this role, he leads the development and deployment of next-generation packaging technologies and foundry strategies to support Marvell’s data infrastructure products.
Prior to joining Marvell, Hamid spent nearly 30 years at Intel, where he most recently served as Corporate Vice President and Director of Substrate Packaging Technology Development. He led global R&D and manufacturing teams and delivered industry-leading innovations including die-embedded panel level fanout, EMIB and glass packaging for AI and high-performance computing.
A recognized pioneer in semiconductor packaging, Hamid holds over 40 U.S. patents, including the patent on first-generation organic flip-chip ABF-based substrate. He has received multiple Intel Achievement Awards and is widely known for building high-performing, inclusive teams and mentoring future industry leaders.
Hamid earned a Ph.D. and M.S. in Materials Science from Lehigh University and a B.S. in Materials Engineering from Sharif University of Technology.
We believe that infrastructure powers progress. That execution is as essential as innovation. That better collaboration builds better technology. At Marvell, We go all in with you.
Focused and determined, we unite behind your goals as our own. We leverage our unrivaled portfolio of infrastructure technology to identify the best solution for your unique needs. And we sit shoulder-to-shoulder with your teams to build it. Agile in our thinking, and our partnerships, we look for unexpected connections that deliver a competitive edge and reveal new opportunities. At Marvell, we’re driven by the belief that how we do things matters just as much as what we do. Because, with a foundation built on partnership, anything is possible.

Day 2 / 14:05 - 15:15
Suresh joined Amkor in 2016 and currently leads Wafer Level Package and product development, as well as package technology integration. In this role, he partners closely with customers and internal R&D teams to advance High-Density Fan-Out (HDFO) and 2.5D technologies for CPO/XPU integration. He also develops wafer-level integration schemes that enhance the performance of RF front-end, digital, consumer, and high-performance computing products. Prior to joining Amkor, Suresh held senior engineering and product management roles at Deca Technologies. He has more than 25 years of experience in IC package design and manufacturing, including fcCSP, FCBGA, SiP, and Fine Pitch CuP products. Suresh holds a master’s degree in Industrial Engineering.
Amkor Technology, Inc. is the world’s largest US headquartered OSAT (outsourced semiconductor assembly and test). Since its founding in 1968, Amkor has pioneered the outsourcing of IC packaging and test services and is a strategic manufacturing partner for the world’s leading semiconductor companies, foundries, and electronics OEMs. Amkor provides turnkey services for the communication, automotive and industrial, computing, and consumer industries, including but not limited to smartphones, electric vehicles, data centers, artificial intelligence and wearables. Amkor’s operational base includes production facilities, product development centers and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the United States. Learn more at https://amkor.com

Day 1 / 15:55 - 16:40
Jason Conrad is the Chief Operating Officer for Semiconductor Research at ASU. He leads SWAP Hub, SHIELD USA, and MacroTechnology Works, ASU’s premier facility for semiconductor research and development. Jason brings with him more than 23 years of experience in the semiconductor industry. With previous roles at industry-leading companies such as NXP, Global Wafers, and Lam Research, Jason is a proven leader focused on performance and quality.
Jason’s mission is to foster relationships with academic, industry and government partners to not only develop leap ahead technologies but also the workforce of the future.
Jason holds a bachelor’s degree in chemical engineering from the University of Notre Dame.
With 110,000+ undergraduate students, 30,000+ graduate and professional students, and 5,000+ faculty, Arizona State University (ASU) exemplifies a new prototype for the American public research university. At ASU, our culture of innovation and inclusion draws pioneering researchers to our faculty and attracts highly qualified students from all 50 states and more than 130 nations. ASU is expanding academic and entrepreneurial opportunities for every type of learner at all stages of life. Creating a resilient microelectronics innovation ecosystem is critical to America’s security and economic competitiveness. Arizona State University is responding to this need by working with industry and government partners to reestablish America’s capacity for domestic microelectronics and semiconductor manufacturing and innovation. ASU offers traditional degree programs and rapid, low-cost options for upskilling and re-skilling of the existing semiconductor workforce, as well as workers from outside the industry.
ASU is building the semiconductor talent pipeline and mobilizing the expertise and capabilities of the Fulton Schools of Engineering to drive research, development and innovation. The Fulton Schools of Engineering at Arizona State University is the largest and most comprehensive engineering school in the nation, offering 25 undergraduate degree programs, and 48 graduate degree programs. With over 30,000 students within the Fulton Schools of Engineering, 7000+ students studying microelectronics-related fields, and 150+ faculty engaged in microelectronics research and teaching. We offer extensive research facilities including our research in semiconductor manufacturing and advanced semiconductor packaging which is supported by our extensive lads which includes MacroTechnology Works with 250,000 total sq ft capacity, 43,000 sq ft clean rooms, and 23,00 sq ft wet/dry labs. We also offer graduate programs in semiconductor manufacturing, packaging, and assembly as well as certificate programs to support workforce development.

Day 2 / 14:05 - 15:15
Mark is currently a Group Director of IC Packaging Product Management at Cadence Design Systems Inc. and is responsible for the IC Packaging related products. Prior to Cadence, Mark held leadership and technical positions at ASE, Texas Instruments, Motorola/NXP and Maxim Integrated/Dallas Semiconductor supporting industry areas including Mobile, Networking, Automotive and High-Performance Computing/AI. Mark is currently serving on the IMAPS (International Microelectronics and Packaging Society) executive committee as President Elect and has served as Vice President of Technology, Director of the IMAPS Academy for workforce development, and became an IMAPS Fellow in 2018. He holds a bachelor’s degree in mechanical engineering from Texas A&M University, has written +20 papers and holds 40 semiconductor packaging patents.
Cadence is a market leader in AI and digital twins, pioneering the application of computational software to accelerate innovation in the engineering design of silicon to systems. Our design solutions, based on Cadence’s Intelligent System Design™ strategy, are essential for the world’s leading semiconductor and systems companies to build their next-generation products from chips to full electromechanical systems that serve a wide range of markets, including hyperscale computing, mobile communications, automotive, aerospace, industrial, life sciences and robotics.

Day 1 / 11:30 - 12:20
Kevin Soukup is Senior Vice President of Silicon Photonics Product Line at GF, a position he was appointed to in 2024. In this role, Mr. Soukup leads the company’s Silicon Photonics business that enables customers to transport enormous volumes of data through high-speed, power efficient electro-optical systems.
Prior to his current role, he served as Chief Strategy Officer developing the company’s integrated strategy and ensuring that GF has the management systems in place to deliver. Mr. Soukup joined GF in 2011 and held positions of increasing responsibility in technology development and manufacturing operations for the next seven years. In 2018, Kevin transitioned to VP of Business Transformation and helped prepare GF for IPO in 2021.
Before his career with GF, Mr. Soukup spent eleven years with Samsung Electronics’ semiconductor unit in engineering and operations management positions.
Mr. Soukup holds a Bachelor of Science in Chemical Engineering from the University of Florida. He currently serves as a member of the board of directors of VueReal.
GF is one of the world’s leading semiconductor manufacturers and the only one with a truly global footprint. We are redefining innovation and semiconductor manufacturing by developing feature-rich process technology solutions that provide leadership performance in pervasive high growth markets. As a steadfast partner, with a unique mix of design, development and fabrication services, GF works collaboratively alongside our customers to bring a broad range of innovative products to market. With a global customer base, a talented and diverse workforce and an at-scale manufacturing footprint spanning three continents, GF is delivering a new era of more.

Day 2 / 14:05 - 15:15
Dr. Rahul Manepalli is an Intel Fellow, Vice President and Director of the Substrate & Wafer Assembly Technology Development organization in Intel. He currently leads the IC substrate technology development and 3DIC wafer assembly technology development teams in Intel’s Advanced Packaging Technology and Manufacturing Organization. He and his team are driving the pathfinding & development of materials, processes and equipment for the next generation of substrate, wafer level assembly technologies. His team has been the driving force behind many of the technology innovations in Intel’s Embedded Multi-die Interconnect Bridge (EMIB/EMIB-T), Panel ODI, Glass core substrate, Foveros (Solder and HBI die to wafer interconnect) technologies. Over his 25+ year career at Intel, Rahul has also held leadership roles in Intel’s assembly materials development and pathfinding teams leading to several innovations in encapsulants, thermal interface materials and solder alloys. Rahul is the author of over 250 patent publications in semiconductor packaging, over 50 technical papers and invited talks. He has a Ph.D. in Chemical Engineering from the Georgia Institute of Technology.
Intel (Nasdaq: INTC) is an industry leader, creating world-changing technology that enables global progress and enriches lives. Inspired by Moore’s Law, we continuously work to advance the design and manufacturing of semiconductors to help address our customers’ greatest challenges. By embedding intelligence in the cloud, network, edge and every kind of computing device, we unleash the potential of data to transform business and society for the better.
To learn more about Intel’s innovations, go to newsroom.intel.com and intel.com.

Day 2 / 13:15 - 14:00
Phil Martin is Vice President and Director of Sort/Test Technology Development for Intel Foundry. His responsibilities encompass test technology development across wafer, die, and package test, including the Intel High Density Modular Tester platform (HDMT). With over 30 years of experience at Intel, Phil has held multiple positions, all within test technology development. He holds a Masters of Science degree in Mechanical Engineering from the University of Idaho.
Intel’s systems foundry approach offers full-stack optimization from the factory network to software. Intel and its ecosystem empower customers to innovate across the entire system through continuous technology improvements, reference designs and new standards. Intel Foundry is an independent foundry business that meets our customers’ unique product needs, including our industry-leading sort and test capabilities. Whether front-end or back-end design is needed, when integrated with our foundry co-optimized development kits based on industry-standard tools and flows and powerful silicon IPs, the result is true innovation.

Day 1 / 11:30 - 12:20
Ritesh Jain is Senior Vice President, Engineering & Operations at Lightmatter leading cross-functional engineering organizations responsible for driving innovation and delivering products. Previously as VP at Intel, Ritesh led hardware development for data centers. He holds a master’s in semiconductor packaging and during the two plus decades of experience in the semiconductor industry, he drove several generations of data center products into high volume deployments while driving major technology transitions and leading global engineering teams.
Lightmatter is leading the revolution in AI data center infrastructure and enabling the next giant leaps in human progress. The company was founded in 2017 out of MIT, with two of its co-founders – CEO Nick Harris, Ph.D. and Chief Scientist Darius Bunandar, Ph.D. – renowned as preeminent scientists in the field. Lightmatter has raised $850 million in funding by leading investors including Fidelity, Google Ventures, Sequoia, Spark, T Rowe Price, and Viking, and was most recently valued at $4.4 billion. Initially founded in Boston, Lightmatter moved its headquarters to Mountain View in 2023. It currently employs 230 employees across its headquarters in Silicon Valley, as well as offices in Boston, Toronto, Oregon and Arizona.
The company’s groundbreaking Passage™ platform—the world’s first 3D-stacked silicon photonics engine—connects thousands to millions of processors at the speed of light. Designed to eliminate critical data bottlenecks, Lightmatter’s technology enables unparalleled efficiency and scalability for the most advanced AI and high-performance computing workloads, pushing the boundaries of AI infrastructure.

Day 1 / 14:00 - 14:45
Mark Kuemerle is Vice President, Technology, Custom Cloud Solutions at Marvell. In this role, Mark is responsible for defining leading-edge ASIC offerings, drives product competitiveness, and architects system-level solutions. Before joining Marvell, Mark was a Fellow in Integrated Systems Architecture at GLOBALFOUNDRIES and has held multiple engineering positions at IBM.
He has authored numerous articles on die-to-die connectivity and multichip systems and holds multiple patents related to low-power technologies and package integration. Mark earned a Bachelors and Master of Science in Computer Engineering from Case Western Reserve University.
We believe that infrastructure powers progress. That execution is as essential as innovation. That better collaboration builds better technology. At Marvell, We go all in with you.
Focused and determined, we unite behind your goals as our own. We leverage our unrivaled portfolio of infrastructure technology to identify the best solution for your unique needs. And we sit shoulder-to-shoulder with your teams to build it. Agile in our thinking, and our partnerships, we look for unexpected connections that deliver a competitive edge and reveal new opportunities. At Marvell, we’re driven by the belief that how we do things matters just as much as what we do. Because, with a foundation built on partnership, anything is possible.

Day 1 / 11:30 - 12:20
Subal Sahni is Vice President of Technology at Marvell Technology. He joined Marvell through the acquisition of Celestial AI, where, as Vice President of Photonics, he built and led the team responsible for all aspects of photonic integrated circuit (PIC) development, including light sources, fiber interfaces, and optical packaging.
Previously, Subal held senior technical and management roles at Cisco Systems and Luxtera Inc. At Luxtera, he was a seminal member of the technology team that enabled the industry’s first high-volume silicon photonics products for optical transceivers.
Subal has more than 20 years of experience in the development and productization of integrated optics and brings a deep understanding of every phase of the engineering lifecycle, from design through high-volume manufacturing. He has delivered numerous invited talks and published extensively in the field of silicon photonic integration, and he holds more than 30 patents spanning technology and product development.
Subal received his B.Tech. degree in Engineering Physics from the Indian Institute of Technology Bombay, India, and his M.S. and Ph.D. degrees in Electrical Engineering from the University of California, Los Angeles.
We believe that infrastructure powers progress. That execution is as essential as innovation. That better collaboration builds better technology. At Marvell, We go all in with you.
Focused and determined, we unite behind your goals as our own. We leverage our unrivaled portfolio of infrastructure technology to identify the best solution for your unique needs. And we sit shoulder-to-shoulder with your teams to build it. Agile in our thinking, and our partnerships, we look for unexpected connections that deliver a competitive edge and reveal new opportunities. At Marvell, we’re driven by the belief that how we do things matters just as much as what we do. Because, with a foundation built on partnership, anything is possible.

Session info not yet published
Dr. Akshay Singh is vice president of Advanced Packaging Technology Development at Micron Technology. He leads a global team that is responsible for delivering advanced memory packaging solutions for HBM, high performance compute and AI/ML applications. Dr. Singh joined Micron in 2006 as an interposer materials engineer and since then has held number of positions of increasing responsibility in packaging design, integration and technology development. Prior to joining Micron, Dr. Singh held product development positions at Artificial Muscle, Inc. and USDA.
Dr. Singh has authored several keynote publications and patents and has served as an invited panel speaker at several conferences. Dr. Singh holds master’s and doctorate degrees in mechanical engineering from Louisiana State University, bachelor’s degree in mechanical engineering from Maharaja Sayajirao University and is a graduate of the Stanford Graduate School of Business Executive Program.
Education:
Micron is a world leader in innovative memory solutions that transform how the world uses information. For over 40 years, our company has been instrumental to the world’s most significant technology advancements, delivering optimal memory and storage systems for a broad range of applications.

Day 2 / 14:05 - 15:15
John Guzek is a technical leader with over three decades of experience in semiconductor advanced packaging technology development, the majority in the area of substrate technology. He has been at the forefront of major substrate and packaging innovations including C4 assembly, organic flip chip, patch on interposer, coreless substrate, glass core substrate, fan-out panel-level packaging, and EMIB. He was instrumental in establishing Intel’s first internal substrate research and development factory. Currently, John leads Boise site operations for Micron’s Advanced Packaging TD organization which includes management of a $300M+ pilot line and >100 team members. John’s organization is focused on the development of next generation HBM and other heterogenous integration architectures. John holds over 50 patents in the field of packaging and graduated from the Massachusetts Institute of Technology with BS and MS degrees in Materials Science and Engineering.
Micron is a world leader in innovative memory solutions that transform how the world uses information. For over 40 years, our company has been instrumental to the world’s most significant technology advancements, delivering optimal memory and storage systems for a broad range of applications.

Day 2 / 14:05 - 15:15
Sriram Srinivasan is a Partner and General Manager in Silicon Manufacturing and Packaging Engineering at Microsoft, within the Azure Hardware team. Their team is responsible for overseeing the entire process of Silicon Manufacturing, Packaging/Test technologies, Signal/Power Integrity, Power Delivery Technologies, and ensuring the Quality and Reliability of Microsoft Azure and custom products. Prior to joining Microsoft, Sriram spent 21 years at Intel Corporation, where he focused on Advanced Packaging, Package Architecture, and technology pathfinding. His primary interest lies in Manufacturing and Package architecture and technology definition, particularly in silicon-package-platform co-design to create optimized product and technology solutions. Sriram holds a B.Tech from the University of Madras, India, and an M.S from the University of Kansas, Lawrence.
Microsoft is a technology company whose mission is to empower every person and every organization on the planet to achieve more. Founded in 1975, we develop and support software, services, devices, and solutions that deliver new value for customers and help people and businesses realize their full potential. We offer an array of services, including cloud-based solutions that provide customers with software, services, platforms, and content, and we provide solution support and consulting services. We also deliver relevant online advertising to a global audience.
Our products include operating systems, cross-device productivity and collaboration applications, server applications, business solution applications, desktop and server management tools, software development tools, and video games. We also design and sell devices, including PCs, tablets, gaming and entertainment consoles, other intelligent devices, and related accessories.

Session info not yet published
In Dong Kim is Vice President of DRAM Product Planning and Business Enabling, responsible for validation and design-win for Samsung’s DRAM products including DDR5 and HBM for key US customers.
Since he began his career as a process integration engineer in 2003, In Dong has successfully managed multiple roles at Samsung and has worked extensively with major customers in Server/PC, Mobile and other applications to enable Samsung’s latest DRAM & NAND products.
In Dong holds Ph.D. degree in Electrical and Computer Engineering from North Carolina State University.
Samsung Electronics Co., Ltd. engages in the manufacturing and selling of electronics and computer peripherals. The company operates through following business divisions: Consumer Electronics, Information Technology & Mobile Communications and Device Solutions. The Consumer Electronics business division provides cable television, monitor, printer, air-conditioners, refrigerators, washing machines and medical devices. The Information Technology & Mobile Communications business division offers handheld products, communication systems, computers and digital cameras. The Device Solutions business division comprises of memory, system large scale integrated circuit and foundry. The company was founded on January 13, 1969 and is headquartered in Suwon, South Korea.

Day 1 / 14:00 - 14:45
Dr. Jaesik Lee is Vice President of Package Engineering at SK hynix America. In this role, Jaesik is responsible for the research and development of advanced packaging for next generation High Bandwidth Memory (HBM) and pathfinding initiatives which enrich SK hynix’s innovations. He also focuses on the collaborations with customers to overcome HBM challenges associated with System in Packages (SIPs).
Prior to joining SK hynix America, Jaesik has held various key technical positions through Meta, Google, Nvidia, and Qualcomm where he drove advanced packaging technology developments, Packaging and System Co-optimization, and Manufacturing in Mobile, AI, and HPC applications. He received a PhD in mechanical engineering from University of Waterloo.
An AI First Mover Leading the Global AI Memory Era
With our global technology leadership, SK hynix aims to provide greater value to all stakeholders, including our customers, partner companies, investors, local communities, and employees.
Moreover, we are working to strengthen our ESG management to create even more value, by moving away from the conventional business model of seeking only economic benefits, in pursuit of more social value and a healthier governance structure.
SK hynix will grow into a Full Stack AI Memory Provider, offering customized solutions tailored to the diverse needs of global customers, covering both DRAM and NAND flash, in the era of full-scale AI.

Day 1 / 11:30 - 12:20
Geeta Athalye is the VP of Silicon Photonics Test at Teradyne, where she leads the development of test equipment for Silicon Photonics devices—key enablers for the data centers powering AI. With 25 years of experience in product development and management, business development, and strategy, Geeta has established a strong track record in test equipment technology for emerging markets and strategic customers.
Throughout her tenure at Teradyne, Geeta has held multiple leadership roles within the semiconductor, memory, and storage test business units, spanning both engineering and marketing. She holds an MS in Electrical Engineering from The Ohio State University and an MBA from Babson College.
Teradyne designs, develops, and manufactures automated test equipment and advanced robotics systems. Its test solutions for semiconductors and electronics products enable Teradyne’s customers to consistently deliver on their quality standards. Its advanced robotics business includes collaborative robots and mobile robots that support manufacturing and warehouse operations for companies of all sizes.
Teradyne delivers manufacturing automation across industries, applications and the world. Teradyne solves complex test and automation challenges and enables businesses to achieve higher production volumes, higher quality and higher ROI. Teradyne designs, develops, and manufactures automatic test equipment used to test semiconductors, wireless products, data storage and complex electronics systems in a number of industries, including consumer electronics, wireless, automotive, industrial, computing, communications, and aerospace and defense. The industrial automation portfolio includes collaborative robotic arms, autonomous mobile robots (“AMRs”) and advanced robotic control software used by global manufacturing, logistics and industrial customers to improve quality, increase manufacturing and material handling efficiency, and decrease manufacturing and logistics costs. The automatic test equipment products include:

Day 2 / 13:15 - 14:00
Roy Chorev is the vice president of product development for the semiconductor test division at Teradyne, where he is responsible for product development for Teradyne’s semiconductor test products. With more than twenty years of experience in the automated test equipment industry, he has held a number of roles in software development, systems engineering and product marketing at Teradyne. Roy holds a Bachelor of Arts in computer science from McGill University and Master of Business Administration from Babson College.
Teradyne designs, develops, and manufactures automated test equipment and advanced robotics systems. Its test solutions for semiconductors and electronics products enable Teradyne’s customers to consistently deliver on their quality standards. Its advanced robotics business includes collaborative robots and mobile robots that support manufacturing and warehouse operations for companies of all sizes.
Teradyne delivers manufacturing automation across industries, applications and the world. Teradyne solves complex test and automation challenges and enables businesses to achieve higher production volumes, higher quality and higher ROI. Teradyne designs, develops, and manufactures automatic test equipment used to test semiconductors, wireless products, data storage and complex electronics systems in a number of industries, including consumer electronics, wireless, automotive, industrial, computing, communications, and aerospace and defense. The industrial automation portfolio includes collaborative robotic arms, autonomous mobile robots (“AMRs”) and advanced robotic control software used by global manufacturing, logistics and industrial customers to improve quality, increase manufacturing and material handling efficiency, and decrease manufacturing and logistics costs. The automatic test equipment products include:

Day 1 / 15:55 - 16:40
Subramanian S. Iyer is a Distinguished Professor at the UCLA Samueli School of Engineering, holding the Charles P. Reames Endowed Chair in Electrical Engineering. He directs the Center for Heterogeneous Integration and Performance Scaling (CHIPS) at UCLA. Before joining UCLA in 2015, he was an IBM Fellow with over 30 years of experience in semiconductor technology, including pioneering work on silicon germanium transistors and 3D integration. His research focuses on advanced packaging, heterogeneous integration, and computing technologies. He is a National Academy of Inventors Fellow and an IEEE Daniel Noble Award recipient, among other honors. In 2023, he was appointed director of the National Advanced Packaging Manufacturing Program (NAPMP).
As a public research university, our mission revolves around the creation, dissemination, preservation and application of knowledge for the advancement of global society. UCLA combines the close-knit, engaging atmosphere of a spirited public institution with the expansive opportunities found in a world-class city. Located in the picturesque Westwood neighborhood, just minutes from Hollywood and downtown Los Angeles, UCLA offers a comprehensive environment that supports academic and personal growth. The university’s setting provides students with access to a rich cultural landscape and a range of professional and recreational activities that enhance their educational experience.

Day 1 / 17:00 - 17:30
Hitachi Ventures is the global venture capital arm of Hitachi Group, a global industrial player active in a broad range of technology sectors.
While founders are initially drawn to our vast global network through Hitachi, they tell us our true value lies in our collaborative partnership. We get that building something bold takes time, hustle, and support. We’re not just investing in companies; we’re backing the visionaries behind them – empowering bold ideas to break through and drive meaningful innovation. And we’re in it for the long haul – offering guidance, mentorship, and resources every step of the way.
Focus areas:
Digital: Foundational digital technologies like AI, next-gen data, and enterprise software. Environment: Decarbonization and circular economy solutions. Industry: Industry 5.0 advancements in automation and manufacturing. Healthcare: TechBio platforms combining software and biology for precision healthcare. Other: We will explore new frontier technologies (space-tech / quantum / fusion and more).
With a total of USD 1 billion AUM, we invest in early stage rounds in globally leading startups. From our offices in Munich, Germany, Boston, and Palo Alto, USA, we work tirelessly to develop close ties and effective collaboration with leading innovative technology hubs and like-minded co-investors.

Day 1 / 17:00 - 17:30
Yvonne joined Lam Capital in October 2024 as Investment Director, bringing over 7 years of venture capital experience from Bosch Ventures USA, where she led investments in deep tech fields like AI, quantum computing, semiconductors, sensors, and industrial technology. She also has 13+ years of operational experience at Bosch, having served in leadership roles across technology scouting, business development, engineering, and manufacturing in both mobility as well as consumer electronics. Yvonne holds a PhD in Applied Physics from University of Tuebingen and a Diploma in Experimental Physics from University of Siegen, both Germany.
Lam Capital invests in innovative companies that are addressing some of today’s most challenging, high-impact problems. From semiconductor subsystems to AI chips and Industry 4.0 technologies, we invest in and partner with startups that are disrupting their respective industries.

Day 1 / 17:00 - 17:30
Robin Davis is Director of Business Development at Syenta, where she leads U.S. customer engagement and industry partnerships focused on next-generation interconnect and advanced packaging technologies. She is an inventor on multiple issued and pending patents covering semiconductor packaging structures and manufacturing methods, including fan-out, panel-level processing, and advanced interconnect architectures. Prior to joining Syenta, she held senior roles in semiconductor packaging, working with Tier 1 fabless IC designers, foundries, OSATs, and research institutions across AI, HPC, RF, and defense applications.
Syenta has developed a breakthrough advanced packaging technology that addresses the critical AI memory bandwidth bottleneck by enabling high-resolution copper interconnects.
We are actively exploring strategic partnerships in the AI accelerator space to demonstrate how our technology can overcome existing chip design constraints and potentially increase chip bandwidth by up to 10x.
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