Aldo Bruno
Technical Lead MEMS Sensor System Competence Team
Biography
Aldo Bruno is the Technical Lead MEMS Sensor System Competence Team within the application engineering at Infineon Technologies, specializing in consumer sensors. Before Infineon, he held the role of Digital ASIC Designer at Cirrus Logic UK, where he honed his expertise in DSP, digital filters, audio codec systems, voice activity detection, and speech enhancement algorithms. In 2018, while completing his master’s thesis at Infineon Technologies, he concentrated on the development of ANC systems to explore the potential enhancements Infineon MEMS microphones could bring. Throughout his career and personal pursuits, Aldo’s passion for audio and acoustics has been a driving force since he´s also a musician and music producer.
Company Profile
Here at Infineon, we combine entrepreneurial success with responsible action to make life easier, safer, and greener. Barely visible, semiconductors have become an indispensable part of everyday life. We play a key role in shaping a better future – with microelectronics that link the real and the digital world. Our semiconductors enable efficient energy management, smart mobility, as well as secure, seamless communications in an increasingly connected world. Infineon designs, develops, manufactures and markets a broad range of semiconductors and system solutions. The focus of its activities is on automotive and industrial electronics, communication and information technologies, IoT, sensor technology and security. The product range comprises standard components, software, customer-specific solutions for devices and systems, as well as specific components for digital, analog, and mixed-signal applications.
Pierre Chastanet
Head of Unit of “Microelectronics and Photonics Industry” Unit, DG CNECT
Biography
Pierre Chastanet is Head of the Unit for Microelectronics and Photonics Industry at the European Commission, where he manages the development of European semiconductor policy and the implementation of the European Chips Act.
Mr. Chastanet has been working for over 17 years in the European Commission, supervising different digital policies in the areas of cloud, data flows, software, cybersecurity, privacy, green ICT, and telecom innovation.
Prior to that, Mr. Chastanet gained more than 10 years of ICT experience, mostly in various IT management positions in a large multinational company.
He graduated from Telecom ParisTech, the Free University of Brussels, and the London School of Economics and Political Science. He also earned a Leadership Executive Certificate from Harvard Kennedy School of Government.
Company Profile
The European Commission is the EU’s politically independent executive arm. The Directorate‑General for Communications Networks, Content and Technology is the Commission department responsible to develop a digital single market to generate smart, sustainable and inclusive growth in Europe.
Follow the latest EU tech news on Twitter, Facebook, Instagram and YouTube via @DigitalEU.
The European Commission is the EU’s politically independent executive arm. The Directorate‑General for Communications Networks, Content and Technology is the Commission department responsible to develop a digital single market to generate smart, sustainable and inclusive growth in Europe.
Follow the latest EU tech news on Twitter, Facebook, Instagram and YouTube via @DigitalEU.
Ken Diest
Research Manager and Tech Lead
Biography
Ken Diest is a Research Manager and Tech Lead at Meta’s Reality Labs, where he leads programs focused on MEMS and micro-actuator technologies. His focus is on developing these technologies from early stage through production to address critical opto-mechanical and display challenges in AR/MR.
A Materials Scientist by training, Ken’s prior work focused on tunable devices and materials with an emphasis on optical systems. He was the editor and co-author of the book Numerical Methods for Metamaterial Design, and has previously held technology development roles at Apple, MIT Lincoln Laboratories, and Northrop Grumman that focused on new displays and nano-photonics.
Company Profile
Meta builds technologies that help people connect, find communities, and grow businesses. When Facebook launched in 2004, it changed the way people connect. Apps like Messenger, Instagram and WhatsApp further empowered billions around the world. Now, Meta is moving beyond 2D screens toward immersive experiences like augmented and virtual reality to help build the next evolution in social technology.
Mo Maghsoudnia
Founder & CEO
Biography
Mo Maghsoudnia is the visionary Founder and dedicated CEO at the helm of UltraSense Systems, a pioneering company in the technology and manufacturing sector. With a track record of transformative leadership and innovation, Mo has been instrumental in shaping the industry landscape.
Before founding UltraSense, Mo Maghsoudnia made significant contributions as the Vice President of Technology & Manufacturing at InvenSense. In this influential role, he oversaw global operations and spearheaded the development of cutting-edge Process Technology. Under his guidance, InvenSense achieved remarkable success, culminating in its acquisition by TDK for a staggering $1.4 billion in 2017.
Prior to his tenure at InvenSense, Mo Maghsoudnia served as the Vice President of Manufacturing at NetLogic MicroSystems. Here, he demonstrated his exceptional ability to steer manufacturing operations, elevating the company from a single product line to a diversified product portfolio powerhouse. His adept leadership, combined with a diverse product range, paved the way for Broadcom’s acquisition of NetLogic MicroSystems for a
remarkable $4 billion in 2012.
Mo’s expertise is firmly rooted in his academic pursuits, holding a Master of Science in Electrical Engineering from Santa Clara University. His passion for innovation is further underscored by his impressive intellectual property portfolio, boasting 12 patents, and an extensive list of research papers that he has authored.
Mo Maghsoudnia’s unwavering commitment to technological advancement and his exceptional leadership have left an indelible mark on the tech and manufacturing sectors, solidifying his status as a true industry luminary.
Company Profile
UltraSense Systems is pioneering the next generation of human–machine interface intelligence, built on its proprietary ultrasound and piezoelectric platform that fuses sensing, haptics, and edge processing into compact, solid-state systems. Its multimodal sensor-fusion architecture—integrating touch, force, ultrasound, lighting, and haptic feedback—creates a unified tactile interface layer that transforms how users interact with devices and environments. The company’s silicon and systems portfolio enables software-defined smart surfaces that operate across diverse materials and form factors, delivering the responsiveness, precision, and design freedom demanded by advanced mobility and next-generation consumer electronics. In automotive, UltraSense Systems powers intelligent cabin interfaces that integrate sensing, actuation, and illumination into seamless surfaces for a futuristic in-cabin experience. In high-end consumer devices, including smartphones and AR glasses, its solutions enable thinner, more immersive, and spatially aware user experiences. Built on deep expertise in ultrasound physics, MEMS, and mixed-signal ASIC design, UltraSense Systems is extending its technology platform into new domains where tactile perception and spatial awareness will define the next era of user experience—combining precision sensing, embedded intelligence, and solid-state reliability to bridge the physical and digital worlds. For more information, visit www.UltraSenseSystems.com.
UltraSense Systems delivers the most advanced solid-state HMI technology for the next generation of user interfaces. Our TouchPoint™ family of silicon controllers integrates multi-modal sensing — ultrasound, capacitive, and piezoelectric — with lighting, haptic feedback, and on-chip intelligence.
From TouchPoint C (CapForce™) to Z (UltraForce™), Q (TapForce™), and Edge, each device fuses sensing, control, and communication into a single SoC — enabling touch and force interaction through metal, glass, fabric, and composite surfaces.
Complemented by our UltraSwitch™, UltraSlide™, and UltraTouch™ system modules, UltraSense provides a full-stack platform that transforms static surfaces into intelligent, software-defined interfaces — powering the future of automotive, AR glasses, and high-end consumer devices.
UltraSense Systems — The Future of Solid-State HMI
| Layer | Offering | Description |
| Silicon Platform | TouchPoint™ HMI Controllers | Multi-mode SoCs integrating touch + force sensing, lighting, haptics, and AI-based algorithms |
| C – CapForce™ | Capacitive + Force sensing controller | |
| Z – UltraForce™ | Ultrasound + Force sensing controller | |
| Q – TapForce™ | Piezoelectric Force sensing controller | |
| Edge – Cluster/Slider | Multi-channel HMI SoC with Neural Touch Engine™ + LIN | |
| System Modules | UltraSwitch™ / UltraSlide™ / UltraTouch™ | Complete smart-surface solutions integrating sensing, feedback, and lighting |
| Applications | Automotive • AR Glasses • Consumer Devices | Solid-state, software-defined interfaces that modernize the user experience |
Stefan Rombach
Head of MEMS
Biography
Stefan Rombach received the Phd. degree in microsystems engineering from the University of Freiburg, Freiburg, Germany. He was working as a member of the scientific staff at the chair of microelectronics in the field of readout interfaces for MEMS inertial sensors and MEMS micro-mirrors based on low-power system design and Delta-Sigma modulation. Since 2018, he has been with Northrop Grumman LITEF, Freiburg, Germany, where he is working as Head of the MEMS department in the field of inertial sensor systems development.
Company Profile
LITEF is one of the leading companies in the development and manufacturing of navigation and sensor systems. The company’s expertise is based on German technology for mechanical, fibre optic and micromechanical inertial sensors. This enables ITAR-free distribution of LITEF products around the globe.
Founded in 1961 and headquartered in Freiburg im Breisgau (Germany), the company’s product range includes MEMS sensors based inertial measurement units, attitude and heading reference systems, inertial navigation systems and inertial reference systems. In close dialogue with the customer, specific product solutions are developed for measurement and navigation tasks with maximum precision and reliability requirements.
LITEF inertial navigation products, like MEMS sensors, MEMS inertial measurement units, MEMS based attitude and heading reference systems, are in use worldwide with applications ranging from civil and military aviation, land and marine applications to industrial solutions.
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