23 April
Silicon Valley
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Building on decades of experience and an unfailing passion for technology, Comet Yxlon is a globally leading company for industrial X-ray and CT system solutions. Manufacturers in the aerospace, automotive, electronics, and semiconductor industries rely on Comet Yxlon to maximize their product quality and the efficiency of their production. From cutting-edge inspection systems to the award-winning user interface Geminy – at Comet Yxlon, we support our customers with innovative products and services that help them shape future markets.
From single die traditional packages to wafers and advanced packaging devices – we supply manufacturers with X-ray inspection systems that meet the high standards of semiconductor quality control. Speed, resolution, 2D or 3D – depending on the application, manufacturers have different priorities for the inspection of semiconductor products. We offer a variety micro- and nano-focus inspection systems providing digital radioscopy, computed laminography, and computed tomography for optimum test results for increased yield.
Lam Research Corporation is a trusted global supplier of innovative wafer fabrication equipment and services to the semiconductor industry. Our strong values-based culture fuels our progress, and it’s through collaboration, precision, and delivery that we are driving semiconductor breakthroughs that define the next generation. Lam Research (Nasdaq: LRCX) is a FORTUNE 500® company headquartered in Fremont, California, with operations around the globe. Learn more at www.lamresearch.com
We combine superior systems engineering, technology leadership, and a commitment to customer success to advance the global semiconductor industry. Our broad portfolio of market-leading deposition, etch, strip, and wafer cleaning solutions helps customers achieve success on the wafer by enabling device features that are 1,000 times smaller than a grain of sand—it’s why nearly every chip today is built with Lam technology.
Okmetic, founded in 1985, has a comprehensive 150-300 mm silicon wafer portfolio catering to MEMS, sensor, RF, power, memory, logic, and digital and analog IC devices. Okmetic tailors silicon wafers to customer product, process, and technology needs, enabling enhanced device performance, advanced design possibilities, improved yield, and cost-effective manufacturing.
Okmetic Headquarters are located in Vantaa, Finland, where the majority of its silicon wafers are manufactured. The Vantaa site focuses on 150–200 mm polished silicon, bonded SOI, and Cavity SOI wafers. A large fab expansion focusing on 200 mm polished wafers was completed in 2025. Subcontracting partners in Asia complement Okmetic’s product offering with 300 mm and epi wafers.
Okmetic’s worldwide sales and technical support organization ensures quick local service and rapid prototyping, delivering highly optimized wafer solutions. The company’s operations are certified under ISO 9001:2015, ISO 14001:2015, and IATF 16949:2016, reflecting its commitment to quality and sustainability.
The Okmetic Vantaa site produces 150–200 mm silicon and SOI wafers for MEMS, sensor, RF, power, and GaN device applications. Okmetic is the leading supplier of advanced silicon wafers for MEMS, RF, and power devices, offering one of the most extensive 150–200 mm wafer portfolios in the market, including High Resistivity RFSi® wafers, SSP and DSP wafers, Bonded SOI and Cavity SOI wafers, patterned wafers, and TSV wafers.
In addition, Okmetic offers 300 mm and epi wafers via its subcontracting partners for memory, power, logic, RF, digital and analog IC. The product portfolio include 300 mm polished, high purity wafers, 300 mm high resistivity wafers, 300 mm test and monitor wafers, and 150-300 mm epi wafers.
Onto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading-edge technologies that include: Un-patterned wafer quality; 3D metrology spanning chip features from nanometer scale transistors to large die interconnects; macro defect inspection of wafers and packages; elemental layer composition; overlay metrology; factory analytics; and lithography for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain helps our customers solve their most difficult yield, device performance, quality, and reliability issues. Onto Innovation strives to optimize customers’ critical path of progress by making them smarter, faster and more efficient. Headquartered in Wilmington, Massachusetts, Onto Innovation supports customers with a worldwide sales and service organization.
General Telephone: +1 978 253 6200
General email: info@ontoinnovation.com
Website: www.ontoinnovation.com
Established in 1974, Plasma-Therm is a global manufacturer of advanced plasma processing equipment, providing tailored solutions to the specialty semiconductor markets, including wireless, power devices, photonics, sensors, and MEMS, advanced packaging, memory, and R&D. Plasma-Therm’s products have been adopted globally and have earned their reputation for value, reliability, and world-class support. Sales and service locations throughout North America, Europe, and Asia-Pacific meet the diverse needs of Plasma-Therm’s global customer base.
Phone: +1 727-577-4999 or information@plasmatherm.com
Plasma-Therm’s product portfolio includes single wafer, batch, and cluster solutions for Etch (ICP, RIE, DSE, IBE, ALE); Deposition (PECVD, HDPCVD, F.A.S.T); Material Modification (HDRF, RTP); and Die Singulation Applications (PPDOT). Sales and service locations throughout North America, Europe, and Asia-Pacific meet the diverse needs of our global customer base.
STRATUS Automation was founded by Ryo Narisawa in 1998 and currently being headquartered in Penang, Malaysia since 2016. STRATUS strive to be the global leader and trusted partner in AMHS by providing the best AMHS solution and continuous support for cleanroom fabs tailored to customer needs. Uniquely in its own way, Stratus Automation has been deploying an AMHS that is termed Hybrid System. The major systems in the Hybrid System mainly involve Overhead Hoist Transport (OHT) and a conveyor system. In this Hybrid System, conveyors are being used for Interbay transfers while the OHT main purpose is to serve for direct loading. Last but not least, Stratus also deploys its very own Transport Control System (TCS), IntelliMove in this Hybrid System which undoubtedly one of the best TCS in the market as it provides an interface to MCS and capable of traffic control.
Stratus Automation specializes in providing sustainable cleanroom AMHS solutions to support the increasing throughput demand of semiconductor industry. To support the rapidly expanding demand of semiconductor market, Stratus’ Hybrid AMHS is specifically designed to substantially increase throughput while halving initial and running costs. Hybrid AMHS combines all the advantages of Conveyor, Overhead Hoist Transport (OHT) and overhead storage (buffer shelves) in a single system where the Conveyor performs interbay transfers while OHT serves for intrabay transfers which requires direct loading/unloading of the carriers. Overhead buffer shelves provide overhead WIP storage and near tool buffer for carriers pending to be processed. Alternatively, Stratus provides multiple Automated Storage & Retrieval System (ASRS) solutions which caters for either massive capacity, multi-level, or overhead storage requirements. All Stratus products are controlled by Stratus’ in-house Transport Control System (TCS), IntelliMove – a smart control system packed with carrier real-time tracking and dynamic rerouting.
Teradyne designs, develops, and manufactures automated test equipment and advanced robotics systems. Its test solutions for semiconductors and electronics products enable Teradyne’s customers to consistently deliver on their quality standards. Its advanced robotics business includes collaborative robots and mobile robots that support manufacturing and warehouse operations for companies of all sizes.
Teradyne delivers manufacturing automation across industries, applications and the world. Teradyne solves complex test and automation challenges and enables businesses to achieve higher production volumes, higher quality and higher ROI. Teradyne designs, develops, and manufactures automatic test equipment used to test semiconductors, wireless products, data storage and complex electronics systems in a number of industries, including consumer electronics, wireless, automotive, industrial, computing, communications, and aerospace and defense. The industrial automation portfolio includes collaborative robotic arms, autonomous mobile robots (“AMRs”) and advanced robotic control software used by global manufacturing, logistics and industrial customers to improve quality, increase manufacturing and material handling efficiency, and decrease manufacturing and logistics costs. The automatic test equipment products include:
Tignis specializes in AI-powered process control with a physics and engineering foundation. Headquartered in Seattle, the company develops and sells innovative software solutions that use AI and machine learning to enable next-generation manufacturing processes. Tignis gives semiconductor equipment manufacturers, wafer fabs, and components and materials suppliers unprecedented automation and process control—increasing manufacturing yield, decreasing process downtime, and reducing costs. Working with the world’s top semiconductor equipment manufacturers and fabricators, Tignis also has a proven track record of empowering other large-scale mission-critical industries. Tignis solutions are deployed in hundreds of facilities worldwide. Learn more at tignis.com.
Tignis’ PAICe product suite provides the precise insights of physics with the most advanced AI and ML data science to give semiconductor equipment manufacturers, wafer fabs, and components and materials suppliers unprecedented automation and process control. Tignis delivers the ability to know what equipment will do, select the best states of operation, and continually optimize processes.
Tignis’ PAICe Maker enables semiconductor equipment makers, components manufacturers and materials suppliers to accelerate time to market and solve previously unsolvable problems. PAICe Maker also empowers your current and next-generation tools to automatically make sophisticated optimization adjustments on a per-wafer or even continuous basis, significantly reducing process variance.
Tignis’ PAICe Monitor allows semiconductor fab users, components manufacturers and materials suppliers to achieve far beyond advanced process control. PAICe Monitor enables you to immediately identify complex and non-linear multivariate relationships between process variables and target metrics, automatically generate analytics to monitor for complex process deviations, and prevent future occurrences.
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