2025 Speaker Highlights
Tomoshige Nambu
Director for IT and Electronics Industry
Terushi Shimizu
Director and Chairman
Norishige (Noly) Morimoto
Vice President and Chief Technology Officer
Hiroshi Iwatsubo
CTO and Executive Deputy President
Rahul Manepalli, Ph.D.
Intel Fellow & Vice President : Advanced Packaging Technology Development
Deepak Kulkarni
Senior Fellow Advanced Packaging
2025 Speaker Highlights
Tomoshige Nambu
Director for IT and Electronics Industry
Terushi Shimizu
Director and Chairman
Norishige (Noly) Morimoto
Vice President and Chief Technology Officer
Hiroshi Iwatsubo
CTO and Executive Deputy President
Rahul Manepalli, Ph.D.
Intel Fellow & Vice President : Advanced Packaging Technology Development
Deepak Kulkarni
Senior Fellow Advanced Packaging
Venue
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2025 Summit Topics
Powering AI Era with Advanced Innovations
Highlighting how advanced innovations across semiconductors, packaging, and systems are powering the next phase of AI performance and scalability.
Global Market Outlook and Strategic Insights
Equipping leaders with global market intelligence and strategic insights to strengthen competitiveness.
Enabling the Next Semiconductor Frontier: AI, Packaging, and Materials Innovation
Showcasing the convergence of AI, advanced packaging, and materials innovation shaping next-generation semiconductor platforms.
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