2026 Speaker Highlights
Navid Shahriari
EVP, Packaging & Test, Foundry Technology and Manufacturing
Raja Swaminathan, Ph.D.
CVP, Advanced Packaging
Philippe Absil Ph.D.
Vice President IC-Link | imec silicon solutions
2026 Speaker Highlights
Navid Shahriari
EVP, Packaging & Test, Foundry Technology and Manufacturing
Raja Swaminathan, Ph.D.
CVP, Advanced Packaging
Philippe Absil Ph.D.
Vice President IC-Link | imec silicon solutions
Venue
[
SUMMIT Venue ]
TBC
2025 Summit Topics
Silicon Photonics Session
Exploring how silicon photonics is enabling higher bandwidth, lower power consumption, and scalable architectures for next-generation computing and connectivity.
Advanced Packaging Innovations: CoWoS, Chiplet Integration, HBM and Panel-Level Packaging
Addressing how CoWoS, chiplet integration, HBM, and panel-level packaging are unlocking performance gains for AI and high-performance computing.
Panel Discussion: Advancing Fan-Out Panel-Level Packaging: Collaborative Innovations Across the Semiconductor Ecosystem
Highlighting how collaboration across the semiconductor ecosystem is accelerating innovation in fan-out panel-level packaging.
Advanced Testing Session
Addressing the role of advanced testing in validating performance, reliability, and quality for advanced packaging and heterogeneous integration.
Solution Provider Session
Highlighting solution-driven approaches that translate innovation into scalable, deployable outcomes across the semiconductor value chain.
Sponsors
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