2026 Speaker Highlights
James Chambers, Ph.D.
VP Silicon Engineering & Sourcing
Naga Chandrasekaran
Chief Technology and Operations Officer, EVP & GM
Sandeep Bharathi
President Data Center Group
Ravi Agarwal, Ph.D.
Director of Advanced Technology Development
Raja Swaminathan, Ph.D.
CVP, Advanced Packaging
Near Margalit, Ph.D.
VP & GM
2026 Speaker Highlights
James Chambers, Ph.D.
VP Silicon Engineering & Sourcing
Naga Chandrasekaran
Chief Technology and Operations Officer, EVP & GM
Sandeep Bharathi
President Data Center Group
Ravi Agarwal, Ph.D.
Director of Advanced Technology Development
Raja Swaminathan, Ph.D.
CVP, Advanced Packaging
Near Margalit, Ph.D.
VP & GM
Venue
[
SUMMIT Venue ]
TBC
Summit Topics
Manufacturing & Integrating AI Infrastructure
Exploring how enterprises manufacture, deploy, and integrate AI infrastructure to support scalable, secure, and high-performance AI initiatives across the organization.
Co-Packaged Optics: Innovations, Scaling Challenges and Deployment Roadmap
An executive-level discussion on the latest innovations in co-packaged optics, examining scalability challenges, manufacturing readiness, and the practical roadmap to commercial deployment in next-generation data center and AI infrastructure.
HBM/cHBM Adoption & Scaling for AI, Cloud and Accelerated Computing
An executive-level discussion on the adoption and scaling of HBM and cHBM technologies to meet the performance, power, and integration demands of AI, cloud infrastructure, and accelerated computing workloads.
Start Up & VC Session
A focused session connecting startup innovators and venture capital leaders to explore emerging technologies, investment strategies, and growth opportunities shaping the future of the industry.
Sponsors
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